Inventor · disambiguated record
Spyridon Skordas
Also filed as: SKORDAS SPYRIDON
51 granted patents·15 pending applications·638 citations·filing 2007–2023
98Inventor score
Top patents by PatentIndex Score
66 records- 0199US8563403B1Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation lastFAROOQ MUKTA G·Filed 2012·Granted Oct 22, 2013·184 cites·20 claims
- 0298US9620481B2Substrate bonding with diffusion barrier structuresGLOBALFOUNDRIES INC·Filed 2015·Granted Apr 11, 2017·220 cites·16 claims
- 0397US10681207B1Caller identity verification based on unique multi-device signaturesIBM·Filed 2019·Granted Jun 9, 2020·35 cites·20 claims
- 0497US9466538B1Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding processGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·43 cites·17 claims
- 0596US9064937B2Substrate bonding with diffusion barrier structuresIBM·Filed 2013·Granted Jun 23, 2015·29 cites·11 claims
- 0695US8900885B1Wafer bonding misalignment reductionIBM·Filed 2013·Granted Dec 2, 2014·22 cites·20 claims
- 0794US10157757B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2017·Granted Dec 18, 2018·4 cites·14 claims
- 0893US9922851B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2014·Granted Mar 20, 2018·8 cites·16 claims
- 0992US10056272B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2017·Granted Aug 21, 2018·3 cites·10 claims
- 1091US9028628B2Wafer-to-wafer oxide fusion bondingIBM·Filed 2013·Granted May 12, 2015·12 cites·10 claims
- 1191US8765578B2Edge protection of bonded wafers during wafer thinningLA TULIPE JR DOUGLAS C·Filed 2012·Granted Jul 1, 2014·16 cites·17 claims
- 1288US9263366B2Liquid cooling of semiconductor chips utilizing small scale structuresIBM·Filed 2014·Granted Feb 16, 2016·8 cites·11 claims
- 1387US9472710B1Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrateIBM·Filed 2015·Granted Oct 18, 2016·5 cites·7 claims
- 1486US9536853B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2014·Granted Jan 3, 2017·3 cites·6 claims
- 1586US9059039B2Reducing wafer bonding misalignment by varying thermal treatment prior to bondingIBM·Filed 2013·Granted Jun 16, 2015·6 cites·15 claims
- 1683US9671215B2Wafer to wafer alignmentIBM·Filed 2014·Granted Jun 6, 2017·5 cites·20 claims
- 1782US9214435B2Via structure for three-dimensional circuit integrationFAROOQ MUKTA G·Filed 2012·Granted Dec 15, 2015·5 cites·17 claims
- 1882US9058974B2Distorting donor wafer to corresponding distortion of host waferIBM·Filed 2013·Granted Jun 16, 2015·4 cites·6 claims
- 1980US9401303B2Handler wafer removal by use of sacrificial inert layerGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 26, 2016·4 cites·20 claims
- 2079US10269760B2Advanced chip to wafer stackingIBM·Filed 2017·Granted Apr 23, 2019·2 cites·5 claims
- 2179US9536809B2Combination of TSV and back side wiring in 3D integrationIBM·Filed 2015·Granted Jan 3, 2017·3 cites·3 claims
- 2276US10915620B2Paint on micro chip touch screensIBM·Filed 2019·Granted Feb 9, 2021·1 cites·20 claims
- 2373US10404306B2Paint on micro chip touch screensIBM·Filed 2017·Granted Sep 3, 2019·1 cites·12 claims
- 2473US9640514B1Wafer bonding using boron and nitrogen based bonding stackGLOBALFOUNDRIES INC·Filed 2016·Granted May 2, 2017·2 cites·17 claims
- 2572US9105517B2Wafer to wafer alignment by LED/LSD devicesIBM·Filed 2013·Granted Aug 11, 2015·2 cites·15 claims
- 2671US10170447B2Advanced chip to wafer stackingIBM·Filed 2017·Granted Jan 1, 2019·1 cites·20 claims
- 2769US9543229B2Combination of TSV and back side wiring in 3D integrationIBM·Filed 2013·Granted Jan 10, 2017·2 cites·6 claims
- 2866US9881896B2Advanced chip to wafer stackingIBM·Filed 2015·Granted Jan 30, 2018·1 cites·8 claims
- 2965US10615139B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2018·Granted Apr 7, 2020·0 cites·4 claims
- 3065US9784917B2Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrateIBM·Filed 2015·Granted Oct 10, 2017·1 cites·13 claims
- 3164US11790072B2Paint on micro chip touch screensIBM·Filed 2019·Granted Oct 17, 2023·0 cites·9 claims
- 3264US9378966B2Selective etching of silicon waferIBM·Filed 2014·Granted Jun 28, 2016·1 cites·18 claims
- 3364US9059333B1Facilitating chip dicing for metal-metal bonding and hybrid wafer bondingIBM·Filed 2013·Granted Jun 16, 2015·1 cites·16 claims
- 3463US10211178B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2017·Granted Feb 19, 2019·0 cites·5 claims
- 3562US12469787B2Resist patterned redistribution wiring on copper polyimide via layerIBM·Filed 2022·Granted Nov 11, 2025·0 cites·19 claims
- 3662US10020279B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2016·Granted Jul 10, 2018·0 cites·6 claims
- 3759US11182722B2Cognitive system for automatic risk assessment, solution identification, and action enablementIBM·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 3859US10777433B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 3959US7909208B2Process of monitoring dispensing of process fluids in precision processing operationsIBM·Filed 2007·Granted Mar 22, 2011·3 cites·12 claims
- 4059US2025201638A1Structure for monitoring hybrid bonds in a semiconductor chip packageIBM·Filed 2023·Application pending·0 cites
- 4158US11355379B1Oxide-bonded wafer pair separation using laser debondingIBM·Filed 2020·Granted Jun 7, 2022·0 cites·18 claims
- 4257US2025048730A1Release layer containing semiconductor-on-insulator substratesIBM·Filed 2023·Application pending·0 cites
- 4356US11239167B2Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrateIBM·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
- 4456US2024332239A1Hybrid bond integration for multi-die assemblyIBM·Filed 2023·Application pending·0 cites
- 4555US11068896B2Granting requests for authorization using data of devices associated with requestorsIBM·Filed 2017·Granted Jul 20, 2021·0 cites·2 claims
- 4655US8236705B2Deposition of viscous materialPARBHOO NITIN H·Filed 2010·Granted Aug 7, 2012·1 cites·17 claims
- 4754US2024113055A1Structure for hybrid bond crackstop with airgapsIBM·Filed 2022·Application pending·0 cites
- 4853US9142488B2Manganese oxide hard mask for etching dielectric materialsIBM·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
- 4953US2015035169A1Via structure for three-dimensional circuit integrationIBM·Filed 2014·Application pending·0 cites
- 5050US9472457B2Manganese oxide hard mask for etching dielectric materialsIBM·Filed 2015·Granted Oct 18, 2016·0 cites·15 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Spyridon Skordas files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →