Inventor · disambiguated record
Steven K. Groothuis
Also filed as: GROOTHUIS STEVEN · GROOTHUIS STEVEN K
28 granted patents·3 pending applications·197 citations·filing 1994–2023
96Inventor score
Top patents by PatentIndex Score
31 records- 0198US10978427B2Stacked semiconductor die assemblies with partitioned logic and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 13, 2021·39 cites·20 claims
- 0296US9780079B2Semiconductor die assembly and methods of forming thermal pathsMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 3, 2017·19 cites·24 claims
- 0395US9287240B2Stacked semiconductor die assemblies with thermal spacers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 15, 2016·21 cites·21 claims
- 0494US9899293B2Semiconductor device packages with improved thermal management and related methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 20, 2018·9 cites·20 claims
- 0594US9543274B2Semiconductor device packages with improved thermal management and related methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·9 cites·14 claims
- 0692US9691746B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 27, 2017·9 cites·16 claims
- 0792US9153520B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsGROOTHUIS STEVEN K·Filed 2012·Granted Oct 6, 2015·17 cites·21 claims
- 0886US10134655B2Semiconductor device packages with direct electrical connections and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 20, 2018·3 cites·20 claims
- 0985US10551129B2Semiconductor device assembly with vapor chamberMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 4, 2020·3 cites·20 claims
- 1083US10170389B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 1, 2019·3 cites·16 claims
- 1181US10215500B2Semiconductor device assembly with vapor chamberMICRON TECHNOLOGY INC·Filed 2015·Granted Feb 26, 2019·3 cites·31 claims
- 1281US2023395463A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1375US10816275B2Semiconductor device assembly with vapor chamberMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 27, 2020·1 cites·20 claims
- 1475US10741468B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 11, 2020·1 cites·11 claims
- 1574US11776877B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1674US8816494B2Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packagesGROOTHUIS STEVEN·Filed 2012·Granted Aug 26, 2014·4 cites·30 claims
- 1773US10163755B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·1 cites·5 claims
- 1871US11594462B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 28, 2023·0 cites·15 claims
- 1971US11562986B2Stacked semiconductor die assemblies with partitioned logic and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 24, 2023·0 cites·20 claims
- 2070US9443744B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 13, 2016·2 cites·26 claims
- 2167US9818625B2Stacked semiconductor die assemblies with thermal spacers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·1 cites·18 claims
- 2263US5581489AModel generator for constructing and method of generating a model of an object for finite element analysisTEXAS INSTRUMENTS INC·Filed 1994·Granted Dec 3, 1996·42 cites·20 claims
- 2362US10679921B2Semiconductor device packages with direct electrical connections and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 2459US2018308785A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 2558US7183485B2Microelectronic component assemblies having lead frames adapted to reduce package bowMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 27, 2007·9 cites·40 claims
- 2655US9184105B2Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packagesMICRON TECHNOLOGY INC·Filed 2014·Granted Nov 10, 2015·0 cites·20 claims
- 2750US9837396B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·0 cites·12 claims
- 2846US2015279431A1Stacked semiconductor die assemblies with partitioned logic and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 2945US7601562B2Microelectronic component assemblies having lead frames adapted to reduce package bowMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 13, 2009·0 cites·22 claims
- 3031US5950069AQuencher clamping operation using an electromagnetTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 7, 1999·1 cites·12 claims
- 3130US6192709B1Quencher clamping operation using an electromagnetTEXAS INSTRUMENTS INC·Filed 1999·Granted Feb 27, 2001·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →