Inventor · disambiguated record
Steven Grumbine
Also filed as: GRUMBINE STEVEN · GRUMBINE STEVEN K
62 granted patents·15 pending applications·1,679 citations·filing 1996–2025
99Inventor score
Top patents by PatentIndex Score
77 records- 0197US6582623B1CMP composition containing silane modified abrasive particlesCABOT MICROELECTRONICS CORP·Filed 2000·Granted Jun 24, 2003·143 cites·21 claims
- 0297US5958288AComposition and slurry useful for metal CMPCABOT CORP·Filed 1996·Granted Sep 28, 1999·219 cites·49 claims
- 0396US9127187B1Mixed abrasive tungsten CMP compositionCABOT MICROELECTRONICS CORP·Filed 2014·Granted Sep 8, 2015·24 cites·26 claims
- 0495US6068787AComposition and slurry useful for metal CMPCABOT CORP·Filed 1997·Granted May 30, 2000·189 cites·18 claims
- 0595US5980775AComposition and slurry useful for metal CMPCABOT CORP·Filed 1997·Granted Nov 9, 1999·144 cites·26 claims
- 0694US7994057B2Polishing composition and method utilizing abrasive particles treated with an aminosilaneCABOT MICROELECTRONICS CORP·Filed 2008·Granted Aug 9, 2011·30 cites·19 claims
- 0794US6383065B1Catalytic reactive pad for metal CMPCABOT MICROELECTRONICS CORP·Filed 2001·Granted May 7, 2002·51 cites·40 claims
- 0894US6136711APolishing composition including an inhibitor of tungsten etchingCABOT CORP·Filed 1998·Granted Oct 24, 2000·163 cites·52 claims
- 0994US6015506AComposition and method for polishing rigid disksCABOT CORP·Filed 1997·Granted Jan 18, 2000·127 cites·33 claims
- 1093US9422456B2Colloidal silica chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Aug 23, 2016·9 cites·44 claims
- 1193US9303188B2Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2014·Granted Apr 5, 2016·14 cites·20 claims
- 1293US8252687B2Barrier slurry for low-k dielectricsLI SHOUTIAN·Filed 2009·Granted Aug 28, 2012·29 cites·46 claims
- 1392US9499721B2Colloidal silica chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·8 cites·46 claims
- 1492US9422457B2Colloidal silica chemical-mechanical polishing concentrateCABOT MICROELECTRONICS CORP·Filed 2015·Granted Aug 23, 2016·7 cites·29 claims
- 1591US6646348B1Silane containing polishing composition for CMPCABOT MICROELECTRONICS CORP·Filed 2000·Granted Nov 11, 2003·48 cites·26 claims
- 1690US9567491B2Tungsten chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·7 cites·41 claims
- 1790US9309442B2Composition for tungsten buffingCABOT MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·6 cites·25 claims
- 1890US9238754B2Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2014·Granted Jan 19, 2016·9 cites·17 claims
- 1990US9028572B2Polishing composition and method utilizing abrasive particles treated with an aminosilaneGRUMBINE STEVEN·Filed 2008·Granted May 12, 2015·14 cites·7 claims
- 2090US6852632B2Method of polishing a multi-layer substrateCABOT MICROELECTRONICS CORP·Filed 2003·Granted Feb 8, 2005·33 cites·34 claims
- 2190US6083419APolishing composition including an inhibitor of tungsten etchingCABOT CORP·Filed 1997·Granted Jul 4, 2000·101 cites·47 claims
- 2289US9556363B2Copper barrier chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Jan 31, 2017·8 cites·36 claims
- 2389US8961807B2CMP compositions with low solids content and methods related theretoCABOT MICROELECTRONICS CORP·Filed 2013·Granted Feb 24, 2015·5 cites·21 claims
- 2489US7316603B2Compositions and methods for tantalum CMPCABOT MICROELECTRONICS CORP·Filed 2005·Granted Jan 8, 2008·16 cites·39 claims
- 2588US6830503B1Catalyst/oxidizer-based CMP system for organic polymer filmsCABOT MICROELECTRONICS CORP·Filed 2003·Granted Dec 14, 2004·38 cites·19 claims
- 2688US6705926B2Boron-containing polishing system and methodCABOT MICROELECTRONICS CORP·Filed 2001·Granted Mar 16, 2004·38 cites·28 claims
- 2787US6685540B2Polishing pad comprising particles with a solid core and polymeric shellCABOT MICROELECTRONICS CORP·Filed 2001·Granted Feb 3, 2004·35 cites·42 claims
- 2885US9803106B2Methods for fabricating a chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Oct 31, 2017·4 cites·20 claims
- 2985US6592776B1Polishing composition for metal CMPCABOT MICROELECTRONICS CORP·Filed 2000·Granted Jul 15, 2003·30 cites·20 claims
- 3084US6855266B1Polishing system with stopping compound and method of its useCABOT MICROELECTRONICS CORP·Filed 2000·Granted Feb 15, 2005·26 cites·25 claims
- 3183US7732393B2Oxidation-stabilized CMP compositions and methodsCABOT MICROELECTRONICS CORP·Filed 2006·Granted Jun 8, 2010·8 cites·17 claims
- 3282US10647887B2Tungsten buff polishing compositions with improved topographyCABOT MICROELECTRONICS CORP·Filed 2018·Granted May 12, 2020·2 cites·36 claims
- 3382US9303190B2Mixed abrasive tungsten CMP compositionCABOT MICROELECTRONICS CORP·Filed 2014·Granted Apr 5, 2016·5 cites·17 claims
- 3480US9303189B2Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2014·Granted Apr 5, 2016·4 cites·13 claims
- 3580US6867140B2Method of polishing a multi-layer substrateCABOT MICROELECTRONICS CORP·Filed 2003·Granted Mar 15, 2005·20 cites·21 claims
- 3679US11034862B2Polishing composition and method utilizing abrasive particles treated with an aminosilaneCABOT MICROELECTRONICS CORP·Filed 2019·Granted Jun 15, 2021·1 cites·7 claims
- 3776US8960177B2Wiresaw cutting methodGRUMBINE STEVEN·Filed 2009·Granted Feb 24, 2015·6 cites·15 claims
- 3874US7311856B2Polymeric inhibitors for enhanced planarizationCABOT MICROELECTRONICS CORP·Filed 2005·Granted Dec 25, 2007·4 cites·50 claims
- 3972US7776230B2CMP system utilizing halogen adductCABOT MICROELECTRONICS CORP·Filed 2007·Granted Aug 17, 2010·3 cites·16 claims
- 4071US9617450B2Polishing composition and method utilizing abrasive particles treated with an aminosilaneCABOT MICROELECTRONICS CORP·Filed 2015·Granted Apr 11, 2017·1 cites·5 claims
- 4171US8425639B2Wire saw slurry recycling processGAUDET GREGORY·Filed 2009·Granted Apr 23, 2013·4 cites·8 claims
- 4269US10988635B2Composition and method for copper barrier CMPCABOT MICROELECTRONICS CORP·Filed 2018·Granted Apr 27, 2021·1 cites·22 claims
- 4369US9566686B2Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·1 cites·8 claims
- 4469US8623766B2Composition and method for polishing aluminum semiconductor substratesCUI JI·Filed 2011·Granted Jan 7, 2014·2 cites·16 claims
- 4569US8529680B2Compositions for CMP of semiconductor materialsDE REGE THESAURO FRANCESCO·Filed 2010·Granted Sep 10, 2013·2 cites·25 claims
- 4668US8157876B2Slurry composition containing non-ionic polymer and method for useGRUMBINE STEVEN·Filed 2008·Granted Apr 17, 2012·3 cites·38 claims
- 4767US7501346B2Gallium and chromium ions for oxide rate enhancementCABOT MICROELECTRONICS CORP·Filed 2006·Granted Mar 10, 2009·2 cites·22 claims
- 4867US7001253B2Boron-containing polishing system and methodCABOT MICROELECTRONICS CORP·Filed 2004·Granted Feb 21, 2006·11 cites·16 claims
- 4967US2025354033A1Highly modified colloidal silica tungsten cmp compositionENTEGRIS INC·Filed 2025·Application pending·0 cites
- 5066US6767476B2Polishing composition for metal CMPCABOT MICROELECTRONICS CORP·Filed 2003·Granted Jul 27, 2004·9 cites·21 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →