Inventor · disambiguated record
Stephan Grunow
Also filed as: GRUNOW STEPHAN
44 granted patents·10 pending applications·415 citations·filing 2003–2016
98Inventor score
Top patents by PatentIndex Score
54 records- 0195US7446036B1Gap free anchored conductor and dielectric structure and method for fabrication thereofIBM·Filed 2007·Granted Nov 4, 2008·42 cites·1 claims
- 0294US8633707B2Stacked via structure for metal fuse applicationsFILIPPI RONALD G·Filed 2011·Granted Jan 21, 2014·15 cites·17 claims
- 0394US7517736B2Structure and method of chemically formed anchored metallic viasIBM·Filed 2006·Granted Apr 14, 2009·34 cites·7 claims
- 0493US9685404B2Back-end electrically programmable fuseBAO JUNJING·Filed 2012·Granted Jun 20, 2017·14 cites·11 claims
- 0593US8232646B2Interconnect structure for integrated circuits having enhanced electromigration resistanceBONILLA GRISELDA·Filed 2010·Granted Jul 31, 2012·17 cites·15 claims
- 0691US8056039B2Interconnect structure for integrated circuits having improved electromigration characteristicsIBM·Filed 2008·Granted Nov 8, 2011·23 cites·17 claims
- 0789US7629264B2Structure and method for hybrid tungsten copper metal contactIBM·Filed 2008·Granted Dec 8, 2009·18 cites·19 claims
- 0889US7189615B2Single mask MIM capacitor and resistor with in trench copper drift barrierTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 13, 2007·18 cites·19 claims
- 0988US8367544B2Self-aligned patterned etch stop layers for semiconductor devicesIBM·Filed 2009·Granted Feb 5, 2013·16 cites·11 claims
- 1087US9142506B2E-fuse structures and methods of manufactureIBM·Filed 2013·Granted Sep 22, 2015·7 cites·11 claims
- 1187US7338893B2Integration of pore sealing liner into dual-damascene methods and devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 4, 2008·17 cites·14 claims
- 1285US8962467B2Metal fuse structure for improved programming capabilityBONILLA GRISELDA·Filed 2012·Granted Feb 24, 2015·6 cites·9 claims
- 1384US7737528B2Structure and method of forming electrically blown metal fuses for integrated circuitsIBM·Filed 2008·Granted Jun 15, 2010·12 cites·20 claims
- 1484US6864108B1Measurement of wafer temperature in semiconductor processing chambersTEXAS INSTRUMENTS INC·Filed 2003·Granted Mar 8, 2005·29 cites·22 claims
- 1580US8742766B2Stacked via structure for metal fuse applicationsIBM·Filed 2013·Granted Jun 3, 2014·3 cites·3 claims
- 1680US7642619B2Air gap in integrated circuit inductor fabricationTEXAS INSTRUMENTS INC·Filed 2009·Granted Jan 5, 2010·8 cites·19 claims
- 1779US7671362B2Test structure for determining optimal seed and liner layer thicknesses for dual damascene processingIBM·Filed 2007·Granted Mar 2, 2010·6 cites·7 claims
- 1878US7148140B2Partial plate anneal plate process for deposition of conductive fill materialTEXAS INSTRUMENTS INC·Filed 2004·Granted Dec 12, 2006·27 cites·17 claims
- 1977US9425144B2Metal fuse structure for improved programming capabilityGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 23, 2016·3 cites·15 claims
- 2076US9893011B2Back-end electrically programmable fuseIBM·Filed 2015·Granted Feb 13, 2018·2 cites·4 claims
- 2176US7833893B2Method for forming conductive structuresIBM·Filed 2007·Granted Nov 16, 2010·5 cites·20 claims
- 2275US7179747B2Use of supercritical fluid for low effective dielectric constant metallizationTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 20, 2007·17 cites·27 claims
- 2374US8444868B2Method for removing copper oxide layerCHENG TIEN-JEN·Filed 2010·Granted May 21, 2013·3 cites·19 claims
- 2474US7888252B2Self-aligned contactIBM·Filed 2009·Granted Feb 15, 2011·4 cites·18 claims
- 2573US7776737B2Reliability of wide interconnectsIBM·Filed 2008·Granted Aug 17, 2010·5 cites·25 claims
- 2673US7566627B2Air gap in integrated circuit inductor fabricationTEXAS INSTRUMENTS INC·Filed 2007·Granted Jul 28, 2009·5 cites·16 claims
- 2772US7037837B2Method of fabricating robust nucleation/seed layers for subsequent deposition/fill of metallization layersTEXAS INSTRUMENTS INC·Filed 2004·Granted May 2, 2006·13 cites·31 claims
- 2871US7781884B2Method of fabrication of on-chip heat pipes and ancillary heat transfer componentsTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 24, 2010·5 cites·23 claims
- 2968US8836124B2Fuse and integrated conductorBONILLA GRISELDA·Filed 2012·Granted Sep 16, 2014·2 cites·13 claims
- 3068US7985928B2Gap free anchored conductor and dielectric structure and method for fabrication thereofIBM·Filed 2008·Granted Jul 26, 2011·3 cites·1 claims
- 3168US7825019B2Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuitsIBM·Filed 2007·Granted Nov 2, 2010·4 cites·14 claims
- 3268US7674707B2Manufacturable reliable diffusion-barrierTEXAS INSTRUMENTS INC·Filed 2007·Granted Mar 9, 2010·2 cites·16 claims
- 3364US8298948B2Capping of copper interconnect lines in integrated circuit devicesBONILLA GRISELDA·Filed 2009·Granted Oct 30, 2012·2 cites·20 claims
- 3464US8026166B2Interconnect structures comprising capping layers with low dielectric constants and methods of making the sameIBM·Filed 2008·Granted Sep 27, 2011·3 cites·7 claims
- 3562US7485963B2Use of supercritical fluid for low effective dielectric constant metallizationTEXAS INSTRUMENTS INC·Filed 2006·Granted Feb 3, 2009·2 cites·24 claims
- 3661US7256121B2Contact resistance reduction by new barrier stack processTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 14, 2007·7 cites·21 claims
- 3761US7115467B2Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspectTEXAS INSTRUMENTS INC·Filed 2004·Granted Oct 3, 2006·9 cites·20 claims
- 3858US9360525B2Stacked via structure for metal fuse applicationsIBM·Filed 2014·Granted Jun 7, 2016·0 cites·20 claims
- 3957US6900127B2Multilayer integrated circuit copper plateable barriersTEXAS INSTRUMENTS INC·Filed 2003·Granted May 31, 2005·5 cites·5 claims
- 4056US10229875B2Stacked via structure for metal fuse applicationsIBM·Filed 2016·Granted Mar 12, 2019·0 cites·20 claims
- 4155US8211794B2Properties of metallic copper diffusion barriers through silicon surface treatmentsARUNACHALAM VALLI·Filed 2007·Granted Jul 3, 2012·2 cites·21 claims
- 4251US2008197495A1Structure for reducing lateral fringe capacitance in semiconductor devicesIBM·Filed 2008·Application pending·0 cites
- 4350US9059169B2E-fuse structures and methods of manufactureBONILLA GRISELDA·Filed 2011·Granted Jun 16, 2015·0 cites·18 claims
- 4449US9093164B2Redundant via structure for metal fuse applicationsFILIPPI RONALD G·Filed 2011·Granted Jul 28, 2015·0 cites·21 claims
- 4549US7456099B2Method of forming a structure for reducing lateral fringe capacitance in semiconductor devicesIBM·Filed 2006·Granted Nov 25, 2008·0 cites·8 claims
- 4645US2008160754A1Method for fabricating a microelectronic conductor structureIBM·Filed 2006·Application pending·0 cites
- 4745US2015235946A1Redundant via structure for metal fuse applicationsIBM·Filed 2015·Application pending·0 cites
- 4845US2008153282A1Method for preparing a metal feature surfaceTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 4944US2009098728A1Structure cu liner for interconnects using a double-bilayer processing schemeGRUNOW STEPHAN·Filed 2007·Application pending·0 cites
- 5039US2005082606A1Low K dielectric integrated circuit interconnect structureFiled 2003·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →