Inventor · disambiguated record
Stanislav Kadlec
Also filed as: KADLEC STANISLAV
18 granted patents·2 pending applications·190 citations·filing 1992–2022
94Inventor score
Files withKADLEC STANISLAV5OC OERLIKON BALZERS AG5EATON INTELLIGENT POWER LTD2EVATEC AG2UNAXIS BALZERS LTD2
Top patents by PatentIndex Score
20 records- 0193US8574409B2Method of magnetron sputtering and a method for determining a power modulation compensation function for a power supply applied to a magnetron sputtering sourceKADLEC STANISLAV·Filed 2012·Granted Nov 5, 2013·18 cites·6 claims
- 0292US9355824B2Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)KADLEC STANISLAV·Filed 2007·Granted May 31, 2016·17 cites·16 claims
- 0389US11380530B2Reactive sputtering with HIPIMSEVATEC AG·Filed 2020·Granted Jul 5, 2022·2 cites·23 claims
- 0487US11842871B2Low voltage MEMS relay filled with alternative gas mixture to SF6EATON INTELLIGENT POWER LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0586US8435389B2RF substrate bias with high power impulse magnetron sputtering (HIPIMS)KADLEC STANISLAV·Filed 2007·Granted May 7, 2013·7 cites·5 claims
- 0686US5234560AMethod and device for sputtering of filmsHAUZER HOLDINGS BV·Filed 1992·Granted Aug 10, 1993·92 cites·21 claims
- 0781US10692707B2RF substrate bias with high power impulse magnetron sputtering (HIPIMS)OC OERLIKON BALZERS AG·Filed 2013·Granted Jun 23, 2020·3 cites·12 claims
- 0880US9587306B2Method for producing a directional layer by cathode sputtering, and device for implementing the methodROHRMANN HARTMUT·Filed 2008·Granted Mar 7, 2017·12 cites·15 claims
- 0979US9611537B2Target shapingKADLEC STANISLAV·Filed 2011·Granted Apr 4, 2017·2 cites·10 claims
- 1078US6860977B2Method for manufacturing a workpiece using a magnetron sputter sourceUNAXIS BALZERS LTD·Filed 2003·Granted Mar 1, 2005·12 cites·17 claims
- 1170US10784092B2Reactive sputtering with HIPIMsWEICHART JUERGEN·Filed 2008·Granted Sep 22, 2020·2 cites·18 claims
- 1269US6682637B2Magnetron sputter sourceUNAXIS BALZERS LTD·Filed 2002·Granted Jan 27, 2004·7 cites·20 claims
- 1365US8246794B2Method of magnetron sputtering and a method for determining a power modulation compensation function for a power supply applied to a magnetron sputtering sourceKADLEC STANISLAV·Filed 2008·Granted Aug 21, 2012·1 cites·12 claims
- 1465US7138343B2Method of producing a substrate with a surface treated by a vacuum treatment process, use of said method for the production of coated workpieces and plasma treatment chamberOC OERLIKON BALZERS AG·Filed 2003·Granted Nov 21, 2006·7 cites·22 claims
- 1562US8475634B2Application of HIPIMS to through silicon via metallization in three-dimensional wafer packagingWEICHART JURGEN·Filed 2008·Granted Jul 2, 2013·2 cites·20 claims
- 1660US7718042B2Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such sourceOC OERLIKON BALZERS AG·Filed 2004·Granted May 18, 2010·4 cites·15 claims
- 1758US11211234B2Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)EVATEC AG·Filed 2016·Granted Dec 28, 2021·0 cites·8 claims
- 1858US7429543B2Method for the production of a substrateOC OERLIKON BALZERS AG·Filed 2006·Granted Sep 30, 2008·0 cites·21 claims
- 1950US2007175748A1Method of manufacturing at least one sputter-coated substrate and sputter sourceOC OERLIKON BALZERS AG·Filed 2006·Application pending·0 cites
- 2049US2024274373A1Electrical contact system with liquid metal layer and diffusion barrierEATON INTELLIGENT POWER LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →