Inventor · disambiguated record
Steven Lin
Also filed as: LIN STEVEN · LIN STEVEN G · LIN STEVEN G S
9 granted patents·5 pending applications·55 citations·filing 2003–2007
85Inventor score
Top patents by PatentIndex Score
14 records- 0187US7432192B2Post ECP multi-step anneal/H2 treatment to reduce film impurityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 7, 2008·11 cites·20 claims
- 0281US7030016B2Post ECP multi-step anneal/H2 treatment to reduce film impurityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 18, 2006·22 cites·37 claims
- 0360US7256120B2Method to eliminate plating copper defectTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 14, 2007·8 cites·17 claims
- 0458US7253093B2Method for fabricating interconnection in an insulating layer on a waferUNITED MICROELECTRONICS CORP·Filed 2005·Granted Aug 7, 2007·3 cites·13 claims
- 0558US7208404B2Method to reduce Rs pattern dependence effectTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 24, 2007·9 cites·20 claims
- 0645US7667835B2Apparatus and method for preventing copper peeling in ECPTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 23, 2010·0 cites·15 claims
- 0745US2008067076A1Method of reducing oxygen content in ECP solutionTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 0845US2006196765A1Metallization target optimization method providing enhanced metallization layer uniformityTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 0943US7262067B2Method for conductive film quality evaluationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 28, 2007·1 cites·23 claims
- 1042US7481910B2Method and apparatus for stabilizing plating film impuritiesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 27, 2009·1 cites·8 claims
- 1139US2007152216A1Interconnection in an insulating layer on a waferUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1239US2007006405A1Systems and methods for wafer cleaningTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1338US2006213778A1Method for electrochemical plating on semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1437US7122471B2Method for preventing voids in metal interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Steven Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →