Inventor · disambiguated record
Sumit Agarwal
Also filed as: AGARWAL SUMIT · AGARWAL SUMIT KUMAR
14 granted patents·9 pending applications·81 citations·filing 2013–2024
87Inventor score
Top patents by PatentIndex Score
23 records- 0199US9090046B2Ceramic coated article and process for applying ceramic coatingAPPLIED MATERIALS INC·Filed 2013·Granted Jul 28, 2015·68 cites·12 claims
- 0295US11332827B2Gas distribution plate with high aspect ratio holes and a high hole densityAPPLIED MATERIALS INC·Filed 2020·Granted May 17, 2022·3 cites·20 claims
- 0377US11598004B2Lid assembly apparatus and methods for substrate processing chambersAPPLIED MATERIALS INC·Filed 2020·Granted Mar 7, 2023·1 cites·11 claims
- 0476US2022380898A1Gas distribution plate with high aspect ratio holes and a high hole densityAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0573US9359679B2Methods for cyclically etching a metal layer for an interconnection structure for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2014·Granted Jun 7, 2016·2 cites·17 claims
- 0670US9653320B2Methods for etching a hardmask layer for an interconnection structure for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2014·Granted May 16, 2017·5 cites·19 claims
- 0769US11819948B2Methods to fabricate chamber component holes using laser drillingAPPLIED MATERIALS INC·Filed 2021·Granted Nov 21, 2023·0 cites·15 claims
- 0865US11111582B2Porous showerhead for a processing chamberAPPLIED MATERIALS INC·Filed 2020·Granted Sep 7, 2021·0 cites·20 claims
- 0964US8932959B2Method and system for etching plural layers on a workpiece including a lower layer containing an advanced memory materialAPPLIED MATERIALS INC·Filed 2013·Granted Jan 13, 2015·1 cites·17 claims
- 1059US9960052B2Methods for etching a metal layer to form an interconnection structure for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2014·Granted May 1, 2018·1 cites·16 claims
- 1159US2015299050A1Ceramic coated article and process for applying ceramic coatingAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 1258US11905583B2Gas quench for diffusion bondingAPPLIED MATERIALS INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1358US2025246435A1Cryogenic etching of silicon-containing materialsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1457US2025098359A1Silicon wafers having passivated contactsALLIANCE SUSTAINABLE ENERGY·Filed 2024·Application pending·0 cites
- 1554US11371148B2Fabricating a recursive flow gas distribution stack using multiple layersAPPLIED MATERIALS INC·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 1652US12479004B2Selective attachment to enhance SiO2:SiNx etch selectivityLAM RES CORP·Filed 2020·Granted Nov 25, 2025·0 cites·24 claims
- 1751US11851758B2Fabrication of a high temperature showerheadAPPLIED MATERIALS INC·Filed 2021·Granted Dec 26, 2023·0 cites·11 claims
- 1849US2014308758A1Patterning magnetic memoryAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 1948US12030135B2Methods to fabricate chamber component holes using laser drillingAPPLIED MATERIALS INC·Filed 2020·Granted Jul 9, 2024·0 cites·15 claims
- 2046US2021083135A1Passivated contact interlayer for photovoltaicsALLIANCE SUSTAINABLE ENERGY·Filed 2020·Application pending·0 cites
- 2142US2016099173A1Methods for etching a barrier layer for an interconnection structure for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2240US2015278297A1Methods, apparatuses and computer program products for providing a speed table for analytical modelsCARADIGM USA LLC·Filed 2014·Application pending·0 cites
- 2336US2016079088A1Method for etching a hardmask layer for an interconnection structure for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →