Inventor · disambiguated record
Su Mi Im
Also filed as: IM SU MI
5 granted patents·3 pending applications·30 citations·filing 2007–2017
75Inventor score
Top patents by PatentIndex Score
8 records- 0182US8557896B2Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding filmJEONG CHUL·Filed 2010·Granted Oct 15, 2013·12 cites·19 claims
- 0278US7863758B2Adhesive film composition, associated dicing die bonding film, and die packageCHEIL IND INC·Filed 2007·Granted Jan 4, 2011·11 cites·20 claims
- 0367US8211540B2Adhesive film composition, associated dicing die bonding film, die package, and associated methodsHONG YONG WOO·Filed 2008·Granted Jul 3, 2012·6 cites·23 claims
- 0462US8394493B2Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the sameHONG YONG WOO·Filed 2007·Granted Mar 12, 2013·1 cites·10 claims
- 0543US10793711B2Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using sameSAMSUNG SDI CO LTD·Filed 2017·Granted Oct 6, 2020·0 cites·11 claims
- 0640US2009162650A1Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methodsHONG YONG WOO·Filed 2008·Application pending·0 cites
- 0734US2011159294A1Attach film composition for semiconductor assembly and attach film using the sameSONG GYU SEOK·Filed 2010·Application pending·0 cites
- 0830US2016137808A1Epoxy resin composition for encapsulating semiconductor package and semiconductor package encapsulated using the sameSAMSUNG SDI CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →