Inventor · disambiguated record
Susumu Kasukabe
Also filed as: KASUKABE SUSUMU
26 granted patents·4 pending applications·832 citations·filing 1988–2011
97Inventor score
Top patents by PatentIndex Score
30 records- 0197US6900646B2Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereofHITACHI LTD·Filed 2002·Granted May 31, 2005·119 cites·34 claims
- 0295US7956627B2Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Jun 7, 2011·24 cites·18 claims
- 0395US5191708AManufacturing method of a probe head for semiconductor LSI inspection apparatusHITACHI LTD·Filed 1991·Granted Mar 9, 1993·151 cites·27 claims
- 0493US7227370B2Semiconductor inspection apparatus and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Jun 5, 2007·26 cites·11 claims
- 0593US4952272AMethod of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuitsHITACHI LTD·Filed 1989·Granted Aug 28, 1990·105 cites·20 claims
- 0692US4931726AApparatus for testing semiconductor deviceHITACHI LTD·Filed 1988·Granted Jun 5, 1990·90 cites·10 claims
- 0791US7049837B2Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication methodRENESAS TECH CORP·Filed 2003·Granted May 23, 2006·65 cites·26 claims
- 0889US6305230B1Connector and probing systemHITACHI LTD·Filed 1998·Granted Oct 23, 2001·79 cites·14 claims
- 0983US7724006B2Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted May 25, 2010·12 cites·12 claims
- 1083US7423439B2Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Sep 9, 2008·12 cites·18 claims
- 1180US7351597B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted Apr 1, 2008·10 cites·9 claims
- 1279US7219422B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted May 22, 2007·21 cites·8 claims
- 1379US6455335B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2000·Granted Sep 24, 2002·17 cites·10 claims
- 1478US8314624B2Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor deviceKASUKABE SUSUMU·Filed 2011·Granted Nov 20, 2012·5 cites·16 claims
- 1577US6566150B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2002·Granted May 20, 2003·15 cites·1 claims
- 1676US6759258B2Connection device and test systemRENESAS TECH CORP·Filed 2001·Granted Jul 6, 2004·14 cites·17 claims
- 1773US7656174B2Probe cassette, semiconductor inspection apparatus and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Feb 2, 2010·7 cites·9 claims
- 1871US7420380B2Probe card and semiconductor testing device using probe sheet or probe card semiconductor device producing methodHITACHI LTD·Filed 2004·Granted Sep 2, 2008·13 cites·7 claims
- 1970US7534629B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted May 19, 2009·4 cites·24 claims
- 2064US7541202B2Connection device and test systemRENESAS TECH CORP·Filed 2007·Granted Jun 2, 2009·1 cites·10 claims
- 2154US7285430B2Connection device and test systemHITACHI LTD·Filed 2004·Granted Oct 23, 2007·3 cites·8 claims
- 2253US6197603B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 1998·Granted Mar 6, 2001·12 cites·4 claims
- 2352US2009209053A1Connection device and test systemKASUKABE SUSUMU·Filed 2009·Application pending·0 cites
- 2450US7198962B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2003·Granted Apr 3, 2007·3 cites·5 claims
- 2550US6617863B1Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereofHITACHI LTD·Filed 1999·Granted Sep 9, 2003·12 cites·22 claims
- 2648US2006094162A1Thin film probe sheet and semiconductor chip inspection systemYABUSHITA AKIRA·Filed 2005·Application pending·0 cites
- 2746US2011014727A1Thin film probe sheet and semiconductor chip inspection systemYABUSHITA AKIRA·Filed 2010·Application pending·0 cites
- 2843US7390732B1Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chipHITACHI LTD·Filed 1998·Granted Jun 24, 2008·12 cites·29 claims
- 2940US2008029763A1Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor DeviceKASUKABE SUSUMU·Filed 2007·Application pending·0 cites
- 3023US8816710B2Inspection contact element and inspecting jigOHTA NORIHIRO·Filed 2011·Granted Aug 26, 2014·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Susumu Kasukabe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →