Inventor · disambiguated record
Sundar Ramamurthy
Also filed as: RAMAMURTHY SUNDAR
28 granted patents·8 pending applications·347 citations·filing 2000–2018
96Inventor score
Files withAPPLIED MATERIALS INC23ADERHOLD WOLFGANG2MOFFATT STEPHEN2TSENG MING-KUEI MICHAEL2YOKOTA YOSHITAKA2
Top patents by PatentIndex Score
36 records- 0193US7972441B2Thermal oxidation of silicon using ozoneAPPLIED MATERIALS INC·Filed 2005·Granted Jul 5, 2011·22 cites·7 claims
- 0292US7509035B2Lamp array for thermal processing exhibiting improved radial uniformityAPPLIED MATERIALS INC·Filed 2005·Granted Mar 24, 2009·37 cites·9 claims
- 0392US7414224B2Backside rapid thermal processing of patterned wafersAPPLIED MATERIALS INC·Filed 2006·Granted Aug 19, 2008·16 cites·10 claims
- 0490US8056500B2Thermal reactor with improved gas flow distributionTSENG MING-KUEI MICHAEL·Filed 2008·Granted Nov 15, 2011·17 cites·20 claims
- 0589US8608853B2Thermal reactor with improved gas flow distributionTSENG MING-KUEI MICHAEL·Filed 2011·Granted Dec 17, 2013·10 cites·15 claims
- 0688US8536492B2Processing multilayer semiconductors with multiple heat sourcesRAMAMURTHY SUNDAR·Filed 2005·Granted Sep 17, 2013·17 cites·3 claims
- 0788US6888104B1Thermally matched support ring for substrate processing chamberAPPLIED MATERIALS INC·Filed 2004·Granted May 3, 2005·41 cites·25 claims
- 0887US8888916B2Thermal reactor with improved gas flow distributionAPPLIED MATERIALS INC·Filed 2013·Granted Nov 18, 2014·6 cites·20 claims
- 0986US8409353B2Water cooled gas injectorYOKOTA YOSHITAKA·Filed 2011·Granted Apr 2, 2013·6 cites·15 claims
- 1086US6897131B2Advances in spike anneal processes for ultra shallow junctionsAPPLIED MATERIALS INC·Filed 2003·Granted May 24, 2005·45 cites·12 claims
- 1185US7127367B2Tailored temperature uniformityAPPLIED MATERIALS INC·Filed 2004·Granted Oct 24, 2006·36 cites·18 claims
- 1281US9114479B2Managing thermal budget in annealing of substratesAPPLIED MATERIALS INC·Filed 2014·Granted Aug 25, 2015·3 cites·11 claims
- 1381US6803546B1Thermally processing a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Oct 12, 2004·25 cites·33 claims
- 1480US8314369B2Managing thermal budget in annealing of substratesMOFFATT STEPHEN·Filed 2008·Granted Nov 20, 2012·6 cites·20 claims
- 1580US7041931B2Stepped reflector plateAPPLIED MATERIALS INC·Filed 2002·Granted May 9, 2006·24 cites·32 claims
- 1676US9947578B2Methods for forming low-resistance contacts through integrated process flow systemsAPPLIED MATERIALS INC·Filed 2016·Granted Apr 17, 2018·2 cites·19 claims
- 1775US7241345B2Cylinder for thermal processing chamberAPPLIED MATERIALS INC·Filed 2003·Granted Jul 10, 2007·17 cites·17 claims
- 1873US9431278B2Backside rapid thermal processing of patterned wafersADERHOLD WOLFGANG·Filed 2008·Granted Aug 30, 2016·3 cites·15 claims
- 1971US7811877B2Method of controlling metal silicide formationAPPLIED MATERIALS INC·Filed 2007·Granted Oct 12, 2010·3 cites·20 claims
- 2069US7986871B2Processing multilayer semiconductors with multiple heat sourcesAPPLIED MATERIALS INC·Filed 2008·Granted Jul 26, 2011·2 cites·18 claims
- 2167US7700376B2Edge temperature compensation in thermal processing particularly useful for SOI wafersAPPLIED MATERIALS INC·Filed 2006·Granted Apr 20, 2010·4 cites·19 claims
- 2260US8658945B2Backside rapid thermal processing of patterned wafersADERHOLD WOLFGANG·Filed 2004·Granted Feb 25, 2014·5 cites·3 claims
- 2356US9595459B2Managing thermal budget in annealing of substratesAPPLIED MATERIALS INC·Filed 2015·Granted Mar 14, 2017·0 cites·20 claims
- 2456US2010068898A1Managing thermal budget in annealing of substratesMOFFATT STEPHEN·Filed 2008·Application pending·0 cites
- 2553US2007026693A1Method of Thermally Oxidizing Silicon Using OzoneAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2652US8497193B2Method of thermally treating silicon with oxygenYOKOTA YOSHITAKA·Filed 2011·Granted Jul 30, 2013·0 cites·21 claims
- 2747US7923660B2Pulsed laser anneal system architectureAPPLIED MATERIALS INC·Filed 2007·Granted Apr 12, 2011·0 cites·23 claims
- 2845US10354882B2Low thermal budget crystallization of amorphous metal silicidesAPPLIED MATERIALS INC·Filed 2018·Granted Jul 16, 2019·0 cites·20 claims
- 2945US9812328B2Methods for forming low resistivity interconnectsAPPLIED MATERIALS INC·Filed 2016·Granted Nov 7, 2017·0 cites·16 claims
- 3045US9373516B2Method and apparatus for forming gate stack on Si, SiGe or Ge channelsAHMED KHALED Z·Filed 2013·Granted Jun 21, 2016·0 cites·18 claims
- 3144US2008090309A1Controlled annealing methodRANISH JOSEPH M·Filed 2007·Application pending·0 cites
- 3243US2014003800A1Processing multilayer semiconductors with multiple heat sourcesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 3337US2012222618A1Dual plasma source, lamp heated plasma chamberOLSEN CHRISTOPHER·Filed 2011·Application pending·0 cites
- 3437US2006240680A1Substrate processing platform allowing processing in different ambientsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3535US2010297854A1High throughput selective oxidation of silicon and polysilicon using plasma at room temperatureAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 3632US2012088356A1Integrated platform for in-situ doping and activation of substratesSANTHANAM KARTIK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →