Inventor · disambiguated record
Sunil Srinivasan
Also filed as: SRINIVASAN SUNIL
25 granted patents·10 pending applications·488 citations·filing 2004–2025
96Inventor score
Top patents by PatentIndex Score
35 records- 0198US11284500B2Method of controlling ion energy distribution using a pulse generatorAPPLIED MATERIALS INC·Filed 2020·Granted Mar 22, 2022·21 cites·20 claims
- 0298US11087989B1Cryogenic atomic layer etch with noble gasesAPPLIED MATERIALS INC·Filed 2020·Granted Aug 10, 2021·8 cites·20 claims
- 0398US10791617B2Method of controlling ion energy distribution using a pulse generator with a current-return output stageAPPLIED MATERIALS INC·Filed 2020·Granted Sep 29, 2020·62 cites·20 claims
- 0498US10555412B2Method of controlling ion energy distribution using a pulse generator with a current-return output stageAPPLIED MATERIALS INC·Filed 2018·Granted Feb 4, 2020·67 cites·32 claims
- 0598US10448495B1Method of controlling ion energy distribution using a pulse generator with a current-return output stageAPPLIED MATERIALS INC·Filed 2019·Granted Oct 15, 2019·63 cites·15 claims
- 0698US10448494B1Method of controlling ion energy distribution using a pulse generator with a current-return output stageAPPLIED MATERIALS INC·Filed 2019·Granted Oct 15, 2019·68 cites·30 claims
- 0798US10103010B2Adjustable extended electrode for edge uniformity controlAPPLIED MATERIALS INC·Filed 2018·Granted Oct 16, 2018·34 cites·10 claims
- 0898US9947517B1Adjustable extended electrode for edge uniformity controlAPPLIED MATERIALS INC·Filed 2016·Granted Apr 17, 2018·48 cites·20 claims
- 0996US10991556B2Adjustable extended electrode for edge uniformity controlAPPLIED MATERIALS INC·Filed 2019·Granted Apr 27, 2021·11 cites·20 claims
- 1096US10553404B2Adjustable extended electrode for edge uniformity controlAPPLIED MATERIALS INC·Filed 2017·Granted Feb 4, 2020·13 cites·20 claims
- 1196US10504702B2Adjustable extended electrode for edge uniformity controlAPPLIED MATERIALS INC·Filed 2018·Granted Dec 10, 2019·14 cites·20 claims
- 1295USD797691SComposite edge ringAPPLIED MATERIALS INC·Filed 2016·Granted Sep 19, 2017·59 cites·1 claims
- 1394US11515166B2Cryogenic atomic layer etch with noble gasesAPPLIED MATERIALS INC·Filed 2021·Granted Nov 29, 2022·2 cites·20 claims
- 1493US11393710B2Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2017·Granted Jul 19, 2022·9 cites·15 claims
- 1591US12094752B2Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2022·Granted Sep 17, 2024·1 cites·10 claims
- 1679US11996294B2Cryogenic atomic layer etch with noble gasesAPPLIED MATERIALS INC·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1776US2024429088A1Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1874US12255055B2Integrated cleaning process for substrate etchingAPPLIED MATERIALS INC·Filed 2022·Granted Mar 18, 2025·0 cites·18 claims
- 1972US2025183016A1Integrated cleaning process for substrate etchingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2070US8133817B2Shallow trench isolation etch processSASANO HIROKI·Filed 2008·Granted Mar 13, 2012·7 cites·23 claims
- 2159US11521838B2Integrated cleaning process for substrate etchingAPPLIED MATERIALS INC·Filed 2018·Granted Dec 6, 2022·0 cites·20 claims
- 2257US8747684B2Multi-film stack etching with polymer passivation of an overlying etched layerSRINIVASAN SUNIL·Filed 2010·Granted Jun 10, 2014·1 cites·18 claims
- 2357US2024429089A1Adjustable edge ring tilt for edge of wafer skew compensationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2457US2025014878A1Wafer edge profile control using connected edge ring hardwareAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2554US2025062131A1Plasma etching in semiconductor processingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2653US12456611B2Systems and methods for controlling a voltage waveform at a substrate during plasma processingAPPLIED MATERIALS INC·Filed 2017·Granted Oct 28, 2025·0 cites·13 claims
- 2753US12237149B2Reducing aspect ratio dependent etch with direct current bias pulsingAPPLIED MATERIALS INC·Filed 2022·Granted Feb 25, 2025·0 cites·19 claims
- 2850US11521849B2In-situ deposition processAPPLIED MATERIALS INC·Filed 2019·Granted Dec 6, 2022·0 cites·16 claims
- 2949US2007175856A1Notch-Free Etching of High Aspect SOI Structures Using A Time Division Multiplex Process and RF Bias ModulationJOHNSON DAVID·Filed 2007·Application pending·0 cites
- 3044US8187483B2Method to minimize CD etch biasPLUMHOFF JASON·Filed 2007·Granted May 29, 2012·0 cites·16 claims
- 3144US2020373149A1In-situ atomic layer deposition processAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3243US2019228952A1Processing with powered edge ringAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3341US2005112891A1Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulationFiled 2004·Application pending·0 cites
- 3440US11049760B2Universal process kitAPPLIED MATERIALS INC·Filed 2017·Granted Jun 29, 2021·0 cites·20 claims
- 3534US2016056059A1Component for semiconductor process chamber having surface treatment to reduce particle emissionAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →