Inventor · disambiguated record
Susan D. Strothers
Also filed as: STROTHERS SUSAN D
20 granted patents·24 pending applications·161 citations·filing 1991–2025
93Inventor score
Top patents by PatentIndex Score
44 records- 0193US7767043B2Copper sputtering targets and methods of forming copper sputtering targetsHONEYWELL INT INC·Filed 2008·Granted Aug 3, 2010·18 cites·31 claims
- 0292US11421311B2ECAE materials for high strength aluminum alloysHONEYWELL INT INC·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
- 0387US11649535B2ECAE processing for high strength and high hardness aluminum alloysHONEYWELL INT INC·Filed 2019·Granted May 16, 2023·1 cites·15 claims
- 0486US7618520B2Physical vapor deposition target constructionsHONEYWELL INT INC·Filed 2005·Granted Nov 17, 2009·13 cites·17 claims
- 0581US11981991B2Sputter trap having a thin high purity coating layer and method of making the sameHONEYWELL INT INC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 0681US11584985B2Sputter trap having a thin high purity coating layer and method of making the sameHONEYWELL INT INC·Filed 2019·Granted Feb 21, 2023·2 cites·15 claims
- 0780US10900102B2High strength aluminum alloy backing plate and methods of makingHONEYWELL INT INC·Filed 2017·Granted Jan 26, 2021·1 cites·19 claims
- 0880US5143590AMethod of manufacturing sputtering target assemblyJOHNSON MATTHEY INC·Filed 1991·Granted Sep 1, 1992·53 cites·9 claims
- 0979US12252770B2ECAE processing for high strength and high hardness aluminum alloysHONEYWELL INT INC·Filed 2023·Granted Mar 18, 2025·0 cites·10 claims
- 1073US10655212B2Sputter trap having multimodal particle size distributionHONEYWELL INT INC·Filed 2017·Granted May 19, 2020·1 cites·18 claims
- 1172US6451185B2Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making sameHONEYWELL INT INC·Filed 2001·Granted Sep 17, 2002·16 cites·8 claims
- 1271US10851447B2ECAE materials for high strength aluminum alloysHONEYWELL INT INC·Filed 2017·Granted Dec 1, 2020·0 cites·8 claims
- 1370US11248286B2ECAE materials for high strength aluminum alloysHONEYWELL INT INC·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 1470US10968510B2Sputter trap having multimodal particle size distributionHONEYWELL INT INC·Filed 2020·Granted Apr 6, 2021·0 cites·19 claims
- 1566US2025197987A1Molybdenum sputtering target assembly and method of makingHONEYWELL INT INC·Filed 2024·Application pending·0 cites
- 1665US6274015B1Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making sameHONEYWELL INT INC·Filed 1997·Granted Aug 14, 2001·28 cites·17 claims
- 1764US8030082B2Liquid-particle analysis of metal materialsHONEYWELL INT INC·Filed 2006·Granted Oct 4, 2011·1 cites·20 claims
- 1863US6555250B2Ni-plated target diffusion bonded to a backing plate and method of making sameHONEYWELL INT INC·Filed 1999·Granted Apr 29, 2003·25 cites·11 claims
- 1963US2024229225A1Diffusion bonded tungsten containing target to copper alloy backing plateHONEYWELL INT INC·Filed 2023·Application pending·0 cites
- 2063US2025327171A1Cobalt-tantalum alloy sputtering target assembly and method of makingHONEYWELL INT INC·Filed 2025·Application pending·0 cites
- 2159US2012273097A1Sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articlesWU CHI TSE·Filed 2012·Application pending·0 cites
- 2258US11450516B2Large-grain tin sputtering targetHONEYWELL INT INC·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 2358US11359273B2Frictionless forged aluminum alloy sputtering target with improved propertiesHONEYWELL INT INC·Filed 2016·Granted Jun 14, 2022·0 cites·7 claims
- 2458US2025263828A1Molybdenum sputtering target with high transverse rupture strengthHONEYWELL INT INC·Filed 2025·Application pending·0 cites
- 2556US10760156B2Copper manganese sputtering targetHONEYWELL INT INC·Filed 2018·Granted Sep 1, 2020·0 cites·22 claims
- 2656US2025122608A1Diffusion bonded tungsten containing target to titanium or titanium alloy backing plateHONEYWELL INT INC·Filed 2023·Application pending·0 cites
- 2755US2025327172A1Cobalt-titanium alloy sputtering target assembly and method of makingHONEYWELL INT INC·Filed 2025·Application pending·0 cites
- 2852US2009101496A1Copper physical vapor deposition targets and methods of making copper physical vapor deposition targetsYI WUWEN·Filed 2008·Application pending·0 cites
- 2949US2007251818A1Copper physical vapor deposition targets and methods of making copper physical vapor deposition targetsYI WUWEN·Filed 2006·Application pending·0 cites
- 3048US2006201589A1Components comprising metallic material, physical vapor deposition targets, thin films, and methods of forming metallic componentsHONEYWELL INT INC·Filed 2005·Application pending·0 cites
- 3147US2017287685A1Sputtering target assembly having a graded interlayer and methods of makingHONEYWELL INT INC·Filed 2017·Application pending·0 cites
- 3246US2007251819A1Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targetsKARDOKUS JANINE K·Filed 2006·Application pending·0 cites
- 3345US2018202039A1Heat treatment methods for metal and metal alloy preparationHONEYWELL INT INC·Filed 2016·Application pending·0 cites
- 3444US2004144643A1Sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articlesFiled 2004·Application pending·0 cites
- 3544US2018323047A1Sputter target backing plate assemblies with cooling structuresHONEYWELL INT INC·Filed 2016·Application pending·0 cites
- 3644US2009065354A1Sputtering targets comprising a novel manufacturing design, methods of production and uses thereofKARDOKUS JANINE K·Filed 2007·Application pending·0 cites
- 3744US2008110746A1Novel manufacturing design and processing methods and apparatus for sputtering targetsKARDOKUS JANINE K·Filed 2006·Application pending·0 cites
- 3843US2007196563A1Three-dimensional pvd targets, and methods of forming three-dimensional pvd targetsWUWEN YI·Filed 2005·Application pending·0 cites
- 3941US2007084527A1High-strength mechanical and structural components, and methods of making high-strength componentsFERRASSE STEPHANE·Filed 2005·Application pending·0 cites
- 4040US2008173541A1Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced coolingLEE EAL·Filed 2007·Application pending·0 cites
- 4140US2004072009A1Copper sputtering targets and methods of forming copper sputtering targetsFiled 2003·Application pending·0 cites
- 4237US2008041720A1Novel manufacturing design and processing methods and apparatus for PVD targetsKIM JAEYEON·Filed 2006·Application pending·0 cites
- 4336US2007141857A1Target designs and related methods for enhanced cooling and reduced deflection and deformationSTROTHERS SUSAN D·Filed 2003·Application pending·0 cites
- 4434US2017229295A1Sputtering device component with modified surface and method of makingHONEYWELL INT INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →