Inventor · disambiguated record
Sung Yi
Also filed as: YI SUNG · YI SUNG-CHOL
22 granted patents·15 pending applications·147 citations·filing 2008–2014
95Inventor score
Top patents by PatentIndex Score
37 records- 0193US8893380B2Method of manufacturing a chip embedded printed circuit boardKIM HONG WON·Filed 2009·Granted Nov 25, 2014·37 cites·9 claims
- 0292US7663250B2Wafer level package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 16, 2010·26 cites·12 claims
- 0383US8593595B2Color filter using surface plasmon and liquid crystal display devicePARK SE-YOUNG·Filed 2010·Granted Nov 26, 2013·9 cites·8 claims
- 0480US8064215B2Semiconductor chip package and printed circuit boardCHUNG YUL-KYO·Filed 2008·Granted Nov 22, 2011·11 cites·4 claims
- 0579US7886414B2Method of manufacturing capacitor-embedded PCBSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·7 cites·5 claims
- 0677US9075269B2Array substrate and liquid crystal display device including the sameLG DISPLAY CO LTD·Filed 2013·Granted Jul 7, 2015·3 cites·29 claims
- 0777US8302270B2Method of manufacturing capacitor-embedded PCBKIM WOON-CHUN·Filed 2011·Granted Nov 6, 2012·3 cites·5 claims
- 0877US7730612B2Method of manufacturing component-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 8, 2010·7 cites·3 claims
- 0977US7632709B2Method of manufacturing wafer level packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Dec 15, 2009·7 cites·6 claims
- 1073US8026590B2Die package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Sep 27, 2011·5 cites·16 claims
- 1173US7727877B2Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillarSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 1, 2010·6 cites·5 claims
- 1271US8283768B2Wafer Level package for heat dissipation and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Oct 9, 2012·4 cites·6 claims
- 1371US7992296B2PCB and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Granted Aug 9, 2011·4 cites·4 claims
- 1471US7982982B2Wafer level packaging image sensor module having lens actuator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Jul 19, 2011·2 cites·4 claims
- 1570US8110914B2Wafer level package with removable chip protecting layerKANG JOON SEOK·Filed 2009·Granted Feb 7, 2012·4 cites·4 claims
- 1669US8558975B2Liquid crystal display device and method of fabricating the samePARK SE-YOUNG·Filed 2010·Granted Oct 15, 2013·3 cites·22 claims
- 1769US8351215B2Method of manufacturing a chip embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 8, 2013·4 cites·8 claims
- 1866US8379171B2Fringe field switching mode liquid crystal display device and method for fabricating the sameLG DISPLAY CO LTD·Filed 2010·Granted Feb 19, 2013·1 cites·18 claims
- 1965US8552305B2Electronic component-embedded printed circuit boardPARK JIN SEON·Filed 2009·Granted Oct 8, 2013·3 cites·6 claims
- 2062US8283251B2Method of manufacturing wafer level packageLEE SEUNG SEOUP·Filed 2011·Granted Oct 9, 2012·1 cites·4 claims
- 2155US2009244864A1Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2254US2009046409A1Capacitor-embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2353US2012152886A1Method of manufacturing substrate for capacitor-embedded printed circuit board and capacitor-embedded printed circuit boardKIM WOON-CHUN·Filed 2012·Application pending·0 cites
- 2451US2009305105A1Fuel cell and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2551US2010052164A1Wafer level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2651US2010288739A1Laser processing deviceSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2750US8943685B2Method of manufacturing a capacitor-embedded printed circuit boardKWEON YOUNG DO·Filed 2010·Granted Feb 3, 2015·0 cites·6 claims
- 2849US2013005089A1Wafer Level Package For Heat Dissipation And Method Of Manufacturing The SameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2948US2014313676A1Electronic component packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3047US8779580B2Electronic component package and manufacturing method thereofKANG JOON-SEOK·Filed 2008·Granted Jul 15, 2014·0 cites·5 claims
- 3146US2009072335A1Image sensor packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3246US2012129297A1Method of manufacturing wafer level packageKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 3345US2009302468A1Printed circuit board comprising semiconductor chip and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3445US2009045441A1CMOS image sensor packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3544US2010142116A1CapacitorSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3644US2010214719A1Capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3741US2008211083A1Electronic package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →