Inventor · disambiguated record
Syuji Nozawa
Also filed as: NOZAWA SYUJI
24 granted patents·13 pending applications·23 citations·filing 2004–2025
91Inventor score
Top patents by PatentIndex Score
37 records- 0180US10446438B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2018·Granted Oct 15, 2019·2 cites·8 claims
- 0277US10960435B2Film forming apparatus, film forming method, and storage mediumTOKYO ELECTRON LTD·Filed 2018·Granted Mar 30, 2021·2 cites·7 claims
- 0375US10096499B2Substrate processing method, program, control apparatus, film forming apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2014·Granted Oct 9, 2018·3 cites·8 claims
- 0475US8580077B2Plasma processing apparatus for performing accurate end point detectionOGASAWARA KOSUKE·Filed 2009·Granted Nov 12, 2013·5 cites·22 claims
- 0571US2025369108A1Substrate Processing Method and Substrate Processing ApparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0671US2025372350A1Substrate Processing Method and Substrate Processing ApparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0770US11139313B2Method of manufacturing semiconductor memoryTOKYO ELECTRON LTD·Filed 2019·Granted Oct 5, 2021·1 cites·6 claims
- 0870US11081321B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Aug 3, 2021·1 cites·4 claims
- 0968US2024316592A1Film forming apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1066US7662646B2Plasma processing method and plasma processing apparatus for performing accurate end point detectionTOKYO ELECTRON LTD·Filed 2007·Granted Feb 16, 2010·2 cites·14 claims
- 1165US2023383407A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1261US12297539B2Film forming system and film forming methodTOKYO ELECTRON LTD·Filed 2022·Granted May 13, 2025·0 cites·15 claims
- 1361US2024150500A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1461US2023067094A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1559US11258023B1Resistive change elements using passivating interface gaps and methods for making sameNANTERO INC·Filed 2020·Granted Feb 22, 2022·0 cites·23 claims
- 1659US10755971B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2019·Granted Aug 25, 2020·0 cites·9 claims
- 1759US7481944B2Etch amount detection method, etching method, and etching systemTOKYO ELECTRON LTD·Filed 2004·Granted Jan 27, 2009·7 cites·12 claims
- 1859US2024021419A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1958US11923242B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2021·Granted Mar 5, 2024·0 cites·7 claims
- 2056US2020101490A1Film forming apparatus and temperature control methodTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 2155US12104251B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Oct 1, 2024·0 cites·6 claims
- 2255US12051571B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Jul 30, 2024·0 cites·9 claims
- 2355US11843027B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2021·Granted Dec 12, 2023·0 cites·9 claims
- 2454US11282699B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Mar 22, 2022·0 cites·15 claims
- 2553US11342223B2Semiconductor device manufacturing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted May 24, 2022·0 cites·6 claims
- 2653US10957531B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2753US2021047724A1Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 2852US11387139B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2020·Granted Jul 12, 2022·0 cites·7 claims
- 2950US11069536B2Device manufacturing methodTOKYO ELECTRON LTD·Filed 2019·Granted Jul 20, 2021·0 cites·6 claims
- 3050US10790135B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2018·Granted Sep 29, 2020·0 cites·8 claims
- 3150US10629448B2Method of manufacturing semiconductor device and vacuum processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Apr 21, 2020·0 cites·6 claims
- 3250US2009095421A1Etch amount detection method, etching method, and etching systemTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3348US10490405B2Semiconductor device manufacturing method, substrate processing apparatus and vacuum processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Nov 26, 2019·0 cites·10 claims
- 3448US2021202298A1Semiconductor device manufacturing method and semiconductor device manufacturing systemTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 3548US2021272840A1Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 3647US11694891B2Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2020·Granted Jul 4, 2023·0 cites·7 claims
- 3743US2019390347A1Control device, film forming apparatus, control method, film forming method, and recording mediumTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →