Inventor · disambiguated record
Tatsuo Abe
Also filed as: ABE TATSUO
18 granted patents·17 pending applications·283 citations·filing 1976–2023
92Inventor score
Top patents by PatentIndex Score
35 records- 0196US6721637B2Hybrid vehicleNISSAN MOTOR·Filed 2002·Granted Apr 13, 2004·138 cites·13 claims
- 0289US6814170B2Hybrid vehicleNISSAN MOTOR·Filed 2002·Granted Nov 9, 2004·85 cites·15 claims
- 0379US7663270B2Canned linear motor armature and canned linear motorYASKAWA DENKI SEISAKUSHO KK·Filed 2005·Granted Feb 16, 2010·10 cites·9 claims
- 0476US6374834B1Substrate processing method and processing apparatusSHINETSU HANDOTAI KK·Filed 2000·Granted Apr 23, 2002·24 cites·13 claims
- 0567US4041137AMethod of producing aluminum fluorideSUMITOMO ALUMINIUM SMELTING CO·Filed 1976·Granted Aug 9, 1977·14 cites·18 claims
- 0662US8083856B2Ultrasonic cleaning apparatus and ultrasonic cleaning methodABE TATSUO·Filed 2009·Granted Dec 27, 2011·2 cites·6 claims
- 0756US2025369103A1Method for growing diamond layer and microwave plasma cvd apparatusSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 0855US2025313989A1Method for producing heteroepitaxial waferSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 0954US11095183B2Electric pump deviceNIDEC TOSOK CORP·Filed 2019·Granted Aug 17, 2021·0 cites·7 claims
- 1054US2024395563A1Epitaxial wafer and production method thereforSHINETSU HANDOTAI KK·Filed 2022·Application pending·0 cites
- 1154US2025154646A1Substrate for high-frequency device, and method for producing sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 1253US2025109488A1Method for growing diamond on silicon substrate and method for selectively growing diamond on silicon substrateSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 1352US12440943B2Method and apparatus for polishing waferSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·10 claims
- 1452US2024203745A1Silicon wafer manufacturing methodSHINETSU HANDOTAI KK·Filed 2022·Application pending·0 cites
- 1552US2025163609A1Method for producing heteroepitaxial filmSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 1652US2024274477A1Method for forming thermal oxide film on semiconductor substrate and method for producing semiconductor deviceSHINETSU HANDOTAI KK·Filed 2022·Application pending·0 cites
- 1752US2024120192A1Method of cleaning silicon wafer, method of manufacturing silicon wafer, and silicon waferSHINETSU HANDOTAI KK·Filed 2022·Application pending·0 cites
- 1851US2024429046A1Method for producing heteroepitaxial waferSHINETSU HANDOTAI KK·Filed 2022·Application pending·0 cites
- 1950US2020106329A1Motor unit and electric pump deviceNIDEC TOSOK CORP·Filed 2019·Application pending·0 cites
- 2049US12482647B2Method for forming thermal oxide film on semiconductor substrateSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·18 claims
- 2148US12308225B2Method for forming thermal oxide film on semiconductor substrateSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted May 20, 2025·0 cites·18 claims
- 2247US2023207399A1Method for dry-etching semiconductor substrate and method for dry-etching silicon oxide filmSHINETSU HANDOTAI KK·Filed 2021·Application pending·0 cites
- 2346US9725587B2Injection molded articleFUJISAWA TOMOYUKI·Filed 2011·Granted Aug 8, 2017·0 cites·8 claims
- 2444US11177125B2Method for cleaning semiconductor waferSHINETSU HANDOTAI KK·Filed 2018·Granted Nov 16, 2021·0 cites·4 claims
- 2544US11094525B2Method for cleaning semiconductor waferSHINETSU HANDOTAI KK·Filed 2017·Granted Aug 17, 2021·0 cites·17 claims
- 2643US11222780B2Method for evaluating silicon wafer and method for manufacturing silicon waferSHINETSU HANDOTAI KK·Filed 2018·Granted Jan 11, 2022·0 cites·17 claims
- 2742US5914281AApparatus for etching waferSHINETSU HANDOTAI KK·Filed 1996·Granted Jun 22, 1999·10 cites·10 claims
- 2841US11878329B2Method for cleaning silicon waferSHINETSU HANDOTAI KK·Filed 2018·Granted Jan 23, 2024·0 cites·1 claims
- 2941US2016067749A1Ultrasonic cleaning apparatus and method for cleaningSHINETSU HANDOTAI KK·Filed 2014·Application pending·0 cites
- 3039US2015053234A1Method for cleaning semiconductor waferSHINETSU HANDOTAI KK·Filed 2013·Application pending·0 cites
- 3139US2021013031A1Wafer treatment apparatus and method for treating waferSHINETSU HANDOTAI KK·Filed 2019·Application pending·0 cites
- 3237US9082610B2Method for cleaning semiconductor waferABE TATSUO·Filed 2012·Granted Jul 14, 2015·0 cites·6 claims
- 3335US2013233344A1Method for cleaning semiconductor waferKABASAWA HITOSHI·Filed 2011·Application pending·0 cites
- 3434US2003036570A1Water for storing silicon wafers and storing methodFiled 2001·Application pending·0 cites
- 3532US8303722B2Water and method for storing silicon waferABE TATSUO·Filed 2002·Granted Nov 6, 2012·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →