Inventor · disambiguated record
Tadasuke Endo
Also filed as: ENDO TADASUKE
2 granted patents·6 pending applications·2 citations·filing 2008–2021
35Inventor score
Top patents by PatentIndex Score
8 records- 0163US8465837B2Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring boardENDO TADASUKE·Filed 2008·Granted Jun 18, 2013·2 cites·22 claims
- 0246US2023095959A1Thermosetting resin composition, resin sheet, and metal base substrateSUMITOMO BAKELITE CO·Filed 2021·Application pending·0 cites
- 0345US2023018491A1Thermosetting resin composition, resin sheet, and metal base substrateSUMITOMO BAKELITE CO·Filed 2020·Application pending·0 cites
- 0441US8294268B2Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor deviceENDO TADASUKE·Filed 2008·Granted Oct 23, 2012·0 cites·10 claims
- 0539US2022372208A1Thermosetting resin composition, resin sheet, and metal base substrateSUMITOMO BAKELITE CO·Filed 2020·Application pending·0 cites
- 0634US2013037310A1Epoxy resin composition for circuit board, prepreg, laminate, resin sheet, laminated base material for printed wiring board, printed wiring board, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2011·Application pending·0 cites
- 0734US2011205721A1Resin composition, resin sheet, prepreg, laminate, multilayer printed wiring board, and semiconductor deviceENDO TADASUKE·Filed 2009·Application pending·0 cites
- 0827US2013105200A1Prepreg, wiring board, and semiconductor deviceOHIGASHI NORIYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →