Inventor · disambiguated record
Tai-Chun Huang
Also filed as: HUANG TAI-CHUN
130 granted patents·68 pending applications·1,309 citations·filing 1999–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD156TAIWAN SEMICONDUCTOR MFG29ADVANCED SEMICONDUCTOR ENG3LU CHANG-SHEN2YU MING-HUA2
Top patents by PatentIndex Score
198 records- 0199US8836141B2Conductor layout technique to reduce stress-induced void formationsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 16, 2014·105 cites·13 claims
- 0298US11437277B2Forming isolation regions for separating fins and gate stacksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·5 cites·19 claims
- 0398US11053584B2System and method for supplying a precursor for an atomic layer deposition (ALD) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·278 cites·20 claims
- 0497US11271083B2Semiconductor device, FinFET device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·6 cites·20 claims
- 0597US9985134B1FinFETs and methods of forming FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·18 cites·20 claims
- 0697US8895446B2Fin deformation modulationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·31 cites·20 claims
- 0796US12027423B2Forming isolation regions for separating fins and gate stacksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0895US12087834B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·2 cites·20 claims
- 0995US11835760B1Calibration system for wavelength-division multiplexing, wavelength-division multiplexing system, and calibrating method for wavelength-division multiplexingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·2 cites·20 claims
- 1095US11728173B2Masking layer with post treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·3 cites·20 claims
- 1195US11532479B2Cut metal gate refill with voidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·5 cites·20 claims
- 1295US10134604B1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·10 cites·20 claims
- 1395US10002933B1Semiconductor device structure with cap layer with top and bottom portions over gate electrodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 19, 2018·16 cites·19 claims
- 1494US11830736B2Multi-layer photo etching mask including organic and inorganic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·21 claims
- 1594US11107902B2Dielectric spacer to prevent contacting shortingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 31, 2021·8 cites·20 claims
- 1694US9812358B1FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·13 cites·20 claims
- 1793US12282184B1Reflectors applied to photonics platformsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 22, 2025·1 cites·20 claims
- 1893US11855185B2Multilayer masking layer and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·16 claims
- 1993US8546891B2Fin profile structure and method of making sameCHANG CHIA-WEI·Filed 2012·Granted Oct 1, 2013·19 cites·14 claims
- 2092US11605555B2Trench filling through reflowing filling materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 14, 2023·2 cites·20 claims
- 2192US11411113B2FinFETs and methods of forming FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·2 cites·20 claims
- 2292US7023090B2Bonding pad and via structure designTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 4, 2006·69 cites·43 claims
- 2391US10164114B2FinFETs and methods of forming FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·4 cites·20 claims
- 2491USD749486SFront face of a vehicle wheelHUANG TAI CHUN·Filed 2014·Granted Feb 16, 2016·58 cites·1 claims
- 2591US7791070B2Semiconductor device fault detection system and methodTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 7, 2010·25 cites·20 claims
- 2691US6825541B2Bump pad design for flip chip bumpingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 30, 2004·60 cites·17 claims
- 2790US12336235B2Semiconductor device having isolation structure formed of low-k dielectric material and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·1 cites·14 claims
- 2890US12050347B2Vertical polarizing beamsplitter for photonicsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·1 cites·20 claims
- 2990US11953719B2Optical power splitter and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
- 3090US11392036B2Photoresist and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 3190US7592710B2Bond pad structure for wire bondingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 22, 2009·19 cites·20 claims
- 3290US7253531B1Semiconductor bonding pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 7, 2007·23 cites·20 claims
- 3390US7098077B2Semiconductor chip singulation methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 29, 2006·50 cites·19 claims
- 3490US6229702B1Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capabilityADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted May 8, 2001·123 cites·19 claims
- 3590US2025359114A1Multilayer masking layer and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3690US2025343069A1Trench filling through reflowing filling materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3789US12255205B2Semiconductor device with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 18, 2025·1 cites·20 claims
- 3889US12189179B2Vertical grating couplerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 3989US11195717B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 7, 2021·2 cites·20 claims
- 4089US10443127B2System and method for supplying a precursor for an atomic layer deposition (ALD) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 15, 2019·4 cites·24 claims
- 4189US9318447B2Semiconductor device and method of forming vertical structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·6 cites·17 claims
- 4288US11348917B2Semiconductor device with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 4387US9276062B2Fin deformation modulationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 1, 2016·6 cites·20 claims
- 4487US9017763B2Injector for forming films respectively on a stack of wafersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Apr 28, 2015·3 cites·5 claims
- 4587US2025355172A1Calibration system for wavelength-division multiplexing, wavelength-division multiplexing system, and calibrating method for wavelength-division multiplexingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4686US10170318B2Self-aligned contact and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 1, 2019·3 cites·20 claims
- 4786US10157997B2FinFETs and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·4 cites·20 claims
- 4885US11342444B2Dielectric spacer to prevent contacting shortingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 24, 2022·2 cites·20 claims
- 4985US10714620B2FinFETs and methods of forming FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·2 cites·20 claims
- 5085US2025355180A1Semiconductor structure including optical device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 198 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →