Inventor · disambiguated record
Takayuki Igarashi
Also filed as: IGARASHI TAKAYUKI
29 granted patents·22 pending applications·140 citations·filing 1997–2025
95Inventor score
Files withRENESAS ELECTRONICS CORP27NICHIA CORP10MITSUBISHI ELECTRIC CORP4IGARASHI TAKAYUKI2RENESAS TECH CORP2
Top patents by PatentIndex Score
51 records- 0194US9502489B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·14 cites·16 claims
- 0291US9711451B2Semiconductor device with coils in different wiring layersRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 18, 2017·9 cites·19 claims
- 0387US12272773B2Light emitting device and method of manufacturing light emitting deviceNICHIA CORP·Filed 2023·Granted Apr 8, 2025·1 cites·19 claims
- 0481US10483199B2Semiconductor device with coils in different wiring layersRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 19, 2019·2 cites·14 claims
- 0577US8030730B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Oct 4, 2011·4 cites·4 claims
- 0676US9653396B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted May 16, 2017·3 cites·13 claims
- 0774US10128125B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 13, 2018·1 cites·14 claims
- 0874USD661262SLight emitting diodeIGARASHI TAKAYUKI·Filed 2010·Granted Jun 5, 2012·3 cites·1 claims
- 0973US6009057ADisc drive equipped with identification indication reader provided in an optical discMITSUMI ELECTRIC CO LTD·Filed 1997·Granted Dec 28, 1999·26 cites·16 claims
- 1072US6005833ADisc drive and driving method of loading motor in the disc driveFiled 1997·Granted Dec 21, 1999·30 cites·5 claims
- 1171US10062642B2Semiconductor device with inductively coupled coilsRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·1 cites·18 claims
- 1271US6002657AApparatus for reading identification indication provided on an optical disc and method thereforFiled 1997·Granted Dec 14, 1999·25 cites·18 claims
- 1366US9929042B2Semiconductor device having a discontinued part between a first insulating film and a second insulating filmRENESAS ELECTRONICS CORP·Filed 2016·Granted Mar 27, 2018·1 cites·15 claims
- 1464US2025157917A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1564US2025157918A1Semiconductor device and inverter systemRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1664US2025204025A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1763US2025022794A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1862US2024429159A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1961US2024312969A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2060US2024170463A1Electronic deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2159US2024162144A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2258US12288760B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Apr 29, 2025·0 cites·10 claims
- 2358US11562989B2Light-emitting device and method for manufacturing sameNICHIA CORP·Filed 2019·Granted Jan 24, 2023·0 cites·13 claims
- 2458USD743918SLight emitting diodeNICHIA CORP·Filed 2014·Granted Nov 24, 2015·0 cites·1 claims
- 2558US2024105761A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2657US11862760B2Light emitting device and method of manufacturing light emitting deviceNICHIA CORP·Filed 2021·Granted Jan 2, 2024·0 cites·16 claims
- 2757US9805950B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 31, 2017·0 cites·7 claims
- 2857US2024096788A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2957US2023335487A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3056US2015115294A2Light emitting device including resin-molded body with white portion and black portionNICHIA CORP·Filed 2014·Application pending·0 cites
- 3155US11670743B2Light emitting device and method of manufacturing light emitting deviceNICHIA CORP·Filed 2020·Granted Jun 6, 2023·0 cites·12 claims
- 3255US9631797B2Light emitting device and lighting fixtureNICHIA CORP·Filed 2014·Granted Apr 25, 2017·0 cites·18 claims
- 3353US9172007B2Method of manufacturing light emitting device and spray coating machineNICHIA CORP·Filed 2013·Granted Oct 27, 2015·0 cites·20 claims
- 3453US2025338519A1Semiconductor device, semiconductor packaging and inverter systemsRENESAS ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 3552US10176985B2Method of manufacturing light emitting deviceNICHIA CORP·Filed 2017·Granted Jan 8, 2019·0 cites·10 claims
- 3652US2025293151A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 3751US2024128248A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3851US2023228671A1Rectangular cell for photometric analysisYEP CO LTD·Filed 2019·Application pending·0 cites
- 3950US2018174900A1Semiconductor device having a discontinued part between a first insulating film and second insulating filmRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 4050US2024014067A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4149US2005282375A1Semiconductor device and manufacturing method thereofNITTA TETSUYA·Filed 2005·Application pending·0 cites
- 4248US2011198726A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONIC CORP·Filed 2011·Application pending·0 cites
- 4344US2023072941A1Light-emitting device and method for manufacturing sameNICHIA CORP·Filed 2021·Application pending·0 cites
- 4443US6027962AMethod of manufacturing semiconductor device having bipolar transistor and field-effect transistorMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Feb 22, 2000·10 cites·9 claims
- 4542US10916500B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 9, 2021·0 cites·17 claims
- 4640US6808973B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Oct 26, 2004·3 cites·7 claims
- 4740US2007166969A1Semiconductor device and method for manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 4839US6426533B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 30, 2002·1 cites·4 claims
- 4937US8796782B2Semiconductor device and method of manufacturing the sameIGARASHI TAKAYUKI·Filed 2012·Granted Aug 5, 2014·0 cites·5 claims
- 5037US6281060B1Method of manufacturing a semiconductor device containing a BiCMOS circuitMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Aug 28, 2001·6 cites·11 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →