Inventor · disambiguated record
Takuya Joda
Also filed as: JODA TAKUYA
13 granted patents·5 pending applications·55 citations·filing 2011–2025
86Inventor score
Top patents by PatentIndex Score
18 records- 0190USD741823SVaporizer for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 27, 2015·49 cites·1 claims
- 0283US12503767B2Non-transitory computer-readable recording medium, substrate processing apparatus and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0382US2025389026A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0475US9793112B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Oct 17, 2017·2 cites·11 claims
- 0572US12000045B2Method of manufacturing semiconductor device, non-transitory computer-readable recording medium, substrate processing apparatus and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jun 4, 2024·0 cites·21 claims
- 0672US10985017B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 20, 2021·1 cites·15 claims
- 0772US2025022708A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0869US12087598B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 10, 2024·1 cites·17 claims
- 0968US12421609B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 23, 2025·0 cites·16 claims
- 1063US12148614B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
- 1163US12084760B2Method of processing substrate, recording medium, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 10, 2024·0 cites·16 claims
- 1262US9646862B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 9, 2017·1 cites·15 claims
- 1358US9502239B2Substrate processing method, substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 22, 2016·1 cites·5 claims
- 1455US2025302414A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1550US11168396B2Method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 9, 2021·0 cites·13 claims
- 1649US11035037B2Substrate processing apparatus and metal memberKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 15, 2021·0 cites·10 claims
- 1740US2019003047A1Vaporizer and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 1837US2011217852A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →