Inventor · disambiguated record
Tadahiro Kato
Also filed as: KATO TADAHIRO
35 granted patents·2 pending applications·890 citations·filing 1987–2015
98Inventor score
Top patents by PatentIndex Score
37 records- 0194US5942445AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 24, 1999·163 cites·20 claims
- 0290US6726525B1Method and device for grinding double sides of thin disk workSHIN ESTU HANDOTAI CO LTD·Filed 2000·Granted Apr 27, 2004·48 cites·5 claims
- 0388US6652358B1Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machineSHINETSU HANDOTAI KK·Filed 2000·Granted Nov 25, 2003·39 cites·22 claims
- 0486US8037878B2Method for slicing workpiece by using wire saw and wire sawSHINETSU HANDOTAI KK·Filed 2008·Granted Oct 18, 2011·21 cites·8 claims
- 0586US7507146B2Method for producing semiconductor wafer and semiconductor waferSHINETSU HANDOTAI KK·Filed 2005·Granted Mar 24, 2009·22 cites·32 claims
- 0686US5800725AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Sep 1, 1998·80 cites·13 claims
- 0782US5679212AMethod for production of silicon wafer and apparatus thereforSHINETSU HANDOTAI KK·Filed 1995·Granted Oct 21, 1997·54 cites·5 claims
- 0880US5951374AMethod of polishing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Sep 14, 1999·57 cites·16 claims
- 0978US6346485B1Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2000·Granted Feb 12, 2002·16 cites·2 claims
- 1077US6660337B2Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the sameKANSAI PAINT CO LTD·Filed 2002·Granted Dec 9, 2003·15 cites·3 claims
- 1177US4759961ACoating method with crosslinked coatings from two coat-one bake systemsKANSAI PAINT CO LTD·Filed 1987·Granted Jul 26, 1988·33 cites·11 claims
- 1276US6491836B1Semiconductor wafer and production method thereforSHINETSU HANDOTAI KK·Filed 1999·Granted Dec 10, 2002·52 cites·18 claims
- 1372US6432837B2Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2001·Granted Aug 13, 2002·11 cites·6 claims
- 1470US5494862AMethod of making semiconductor wafersSHINETSU HANDOTAI KK·Filed 1994·Granted Feb 27, 1996·47 cites·6 claims
- 1569US8231430B2Wafer production methodKATO TADAHIRO·Filed 2007·Granted Jul 31, 2012·3 cites·6 claims
- 1669US6787797B2Semiconductor wafer and device for semiconductor device manufacturing processSHINETSU HANDOTAI KK·Filed 2001·Granted Sep 7, 2004·12 cites·19 claims
- 1769US6050880ASurface grinding device and method of surface grinding a thin-plate workpieceSHINETSU HANDOTAI KK·Filed 1997·Granted Apr 18, 2000·31 cites·18 claims
- 1868US10002753B2Chamfering apparatus and method for manufacturing notchless waferSHINETSU HANDOTAI KK·Filed 2014·Granted Jun 19, 2018·1 cites·8 claims
- 1968US8029339B2Workpiece double-disc grinding apparatus and workpiece double-disc grinding methodSHINETSU HANDOTAI KK·Filed 2009·Granted Oct 4, 2011·3 cites·20 claims
- 2067US6444317B1Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the sameKANSAI PAINT CO LTD·Filed 1999·Granted Sep 3, 2002·25 cites·7 claims
- 2165US8454852B2Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon waferKATO TADAHIRO·Filed 2008·Granted Jun 4, 2013·2 cites·4 claims
- 2263US8562390B2Double-disc grinding apparatus and method for producing waferKOBAYASHI KENJI·Filed 2009·Granted Oct 22, 2013·2 cites·6 claims
- 2362US6883342B2Multiform gas heat pump type air conditioning systemMITSUBISHI HEAVY IND LTD·Filed 2002·Granted Apr 26, 2005·13 cites·6 claims
- 2461US7332437B2Method for processing semiconductor wafer and semiconductor waferSHINETSU HANDOTAI KK·Filed 2001·Granted Feb 19, 2008·9 cites·27 claims
- 2561US6077149AMethod and apparatus for surface-grinding of workpieceSHINETSU HANDOTAI KK·Filed 1997·Granted Jun 20, 2000·24 cites·24 claims
- 2659US6239039B1Semiconductor wafers processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 1998·Granted May 29, 2001·17 cites·11 claims
- 2758US5474644AMethod and apparatus for high-flatness etching of waferSHINETSU HANDOTAI KK·Filed 1994·Granted Dec 12, 1995·27 cites·4 claims
- 2855US6284658B1Manufacturing process for semiconductor waferSHINETSU HANDOTAI KK·Filed 1999·Granted Sep 4, 2001·20 cites·4 claims
- 2954US7997262B2Method of improving nanotopography of surface of wafer and wire saw apparatusSHINETSU HANDOTAI KK·Filed 2006·Granted Aug 16, 2011·0 cites·4 claims
- 3050US6220928B1Surface grinding method and apparatus for thin plate workSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 24, 2001·14 cites·4 claims
- 3150US5447890AMethod for production of waferSHINETSU HANDOTAI KK·Filed 1994·Granted Sep 5, 1995·20 cites·3 claims
- 3246US10011046B2Fixed-abrasive-grain wire, wire saw, and method for slicing workpieceSHINETSU HANDOTAI KK·Filed 2015·Granted Jul 3, 2018·0 cites·16 claims
- 3343US2008113510A1Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirror Edge Polishing MethodSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 3441US8603897B2Method for manufacturing bonded waferKATO TADAHIRO·Filed 2010·Granted Dec 10, 2013·0 cites·8 claims
- 3540US6358117B1Processing method for a waferSHINETSU HANDOTAI KK·Filed 1999·Granted Mar 19, 2002·9 cites·12 claims
- 3637US2012100785A1Method for chamfering waferISHIMASA YUKIO·Filed 2010·Application pending·0 cites
- 3729US9358655B2Outer periphery polishing apparatus for disc-shaped workpieceSHINETSU HANDOTAI KK·Filed 2013·Granted Jun 7, 2016·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →