Inventor · disambiguated record
Takashi Kawamori
Also filed as: KAWAMORI TAKASHI
33 granted patents·20 pending applications·55 citations·filing 2008–2024
95Inventor score
Files withSEIKO EPSON CORP14HITACHI CHEMICAL CO LTD9MITSUKURA KAZUYUKI9RESONAC CORP8KAWAMORI TAKASHI7
Top patents by PatentIndex Score
53 records- 0191US7851131B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partHITACHI CHEMICAL CO LTD·Filed 2008·Granted Dec 14, 2010·13 cites·21 claims
- 0290US12084599B2Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation materialRESONAC CORP·Filed 2023·Granted Sep 10, 2024·2 cites·7 claims
- 0384US8258017B2Photosensitive adhesiveMASUKO TAKASHI·Filed 2008·Granted Sep 4, 2012·12 cites·9 claims
- 0483US9787858B2Network system and control method of a network systemSEIKO EPSON CORP·Filed 2016·Granted Oct 10, 2017·4 cites·4 claims
- 0582US11487201B2Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2018·Granted Nov 1, 2022·3 cites·14 claims
- 0676US8323873B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Dec 4, 2012·2 cites·21 claims
- 0776US8293453B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 23, 2012·2 cites·9 claims
- 0875US11840648B2Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Dec 12, 2023·2 cites·11 claims
- 0975US9720630B2Recording device, control method of a recording device, and recording systemSEIKO EPSON CORP·Filed 2015·Granted Aug 1, 2017·2 cites·10 claims
- 1075US8445177B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted May 21, 2013·2 cites·14 claims
- 1172US2025282944A1Curable resin composition, curable film, and laminated filmRESONAC CORP·Filed 2023·Application pending·0 cites
- 1271US2025297143A1Curable resin composition, curable film, and laminated filmRESONAC CORP·Filed 2023·Application pending·0 cites
- 1370US2025326951A1Adhesive set, adhesive body, and manufacturing method thereforRESONAC CORP·Filed 2023·Application pending·0 cites
- 1470US2025333627A1Adhesive set, adhesive body, and manufacturing method thereforRESONAC CORP·Filed 2023·Application pending·0 cites
- 1569US9247652B2Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive compositionKONNO KAORU·Filed 2008·Granted Jan 26, 2016·2 cites·9 claims
- 1669US7974165B2Error detection apparatus and method for a disc loading systemSEIKO EPSON CORP·Filed 2009·Granted Jul 5, 2011·2 cites·8 claims
- 1768US10048912B2Control device, control method of a control device, server, and network systemSEIKO EPSON CORP·Filed 2016·Granted Aug 14, 2018·1 cites·13 claims
- 1868US9309446B2Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor deviceMITSUKURA KAZUYUKI·Filed 2012·Granted Apr 12, 2016·3 cites·24 claims
- 1968US2025046626A1Semiconductor device manufacturing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 2067US12258498B2Adhesive set, adhesive body, and manufacturing method thereforRESONAC CORP·Filed 2020·Granted Mar 25, 2025·0 cites·9 claims
- 2164US10229403B2Network system, control method of a network system, and management serverSEIKO EPSON CORP·Filed 2016·Granted Mar 12, 2019·2 cites·8 claims
- 2262US10504864B2Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive compositionHITACHI CHEMICAL CO LTD·Filed 2015·Granted Dec 10, 2019·0 cites·12 claims
- 2361US10629457B2Method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Apr 21, 2020·1 cites·7 claims
- 2460US10880997B2Stretchable member with metal foilHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·8 claims
- 2557US8673539B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
- 2653US12165882B2Semiconductor device manufacturing methodRESONAC CORP·Filed 2020·Granted Dec 10, 2024·0 cites·4 claims
- 2753US8278024B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 2, 2012·0 cites·20 claims
- 2850US10153953B2Network system, control method of a network system and control deviceSEIKO EPSON CORP·Filed 2016·Granted Dec 11, 2018·0 cites·15 claims
- 2950US8507323B2Method of producing semiconductor device with patterned photosensitive adhesiveMASUKO TAKASHI·Filed 2012·Granted Aug 13, 2013·0 cites·9 claims
- 3048US8349700B2Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 8, 2013·0 cites·10 claims
- 3146US10536531B2Printer and data processing methodSEIKO EPSON CORP·Filed 2015·Granted Jan 14, 2020·0 cites·14 claims
- 3246US2011159238A1Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic componentKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 3346US2011223397A1Semiconductor device and method for manufacturing the sameKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 3445US11259409B2Conductor substrate, wiring substrate and method for producing wiring substrateHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 22, 2022·0 cites·16 claims
- 3545US10032152B2Transmission system that enables correlation between a sending device and each of multiple receiving devicesSEIKO EPSON CORP·Filed 2014·Granted Jul 24, 2018·0 cites·19 claims
- 3645US2021054150A1Silicon compound and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 3742US9720788B2Recording device and control method of a recording deviceSEIKO EPSON CORP·Filed 2015·Granted Aug 1, 2017·0 cites·8 claims
- 3841US2011151195A1Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive compositionMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 3940US10757224B2Data processing system, data processing method, and printerSEIKO EPSON CORP·Filed 2015·Granted Aug 25, 2020·0 cites·16 claims
- 4040US2011121435A1Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 4140US2015179494A1Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 4239US2010143673A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing methodMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 4339US2022028722A1Semiconductor device production method and laminate film for temporary fixation materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 4439US2010295190A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 4538US9921555B2Device control system, host device, and control method of a host deviceSEIKO EPSON CORP·Filed 2013·Granted Mar 20, 2018·0 cites·11 claims
- 4638US9655149B2Wireless communication configuration method, wireless communication system, and recording deviceSEIKO EPSON CORP·Filed 2015·Granted May 16, 2017·0 cites·8 claims
- 4737US10068219B2Information processing method and recording systemSEIKO EPSON CORP·Filed 2015·Granted Sep 4, 2018·0 cites·10 claims
- 4836US2016380852A1Control Device, Network System, and ServerSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 4935US2012202015A1Method for manufacturing adhesion body, method for manufacturing substrate with adhesive pattern, and substrate with adhesive patternIKEDA AYA·Filed 2012·Application pending·0 cites
- 5032US2012256326A1Adhesive composition, semiconductor device making use thereof, and production method thereofMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →