Inventor · disambiguated record
Tadashi Kodaira
Also filed as: KODAIRA TADASHI
13 granted patents·3 pending applications·159 citations·filing 2002–2018
92Inventor score
Top patents by PatentIndex Score
16 records- 0188US7340121B2Optoelectric composite substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Mar 4, 2008·15 cites·8 claims
- 0285US7093356B2Method for producing wiring substrateSHINKO ELECTRIC IND CO·Filed 2003·Granted Aug 22, 2006·38 cites·13 claims
- 0381US7196426B2Multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2004·Granted Mar 27, 2007·24 cites·1 claims
- 0480US7285856B2Package for semiconductor devicesSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 23, 2007·17 cites·4 claims
- 0576US6759739B2Multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 6, 2004·18 cites·13 claims
- 0675US10290570B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2018·Granted May 14, 2019·3 cites·6 claims
- 0775US7801396B2Optoelectric composite substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Sep 21, 2010·5 cites·12 claims
- 0873US6988312B2Method for producing multilayer circuit board for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2002·Granted Jan 24, 2006·24 cites·27 claims
- 0965US7164198B2Multilayered substrate for semiconductor deviceSHINKO ELECTRIC INDUSTRES CO L·Filed 2003·Granted Jan 16, 2007·12 cites·5 claims
- 1064US7696617B2Package for semiconductor devicesSHINKO ELECTRIC IND CO·Filed 2007·Granted Apr 13, 2010·2 cites·4 claims
- 1159US7873245B2Optoelectric composite substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Jan 18, 2011·1 cites·7 claims
- 1248US2010155933A1Package for semiconductor devicesSHINKO ELECTRONICS·Filed 2010·Application pending·0 cites
- 1348US2010155114A1Package for semiconductor devicesSHINKO ELECTRONICS·Filed 2010·Application pending·0 cites
- 1446US2009288870A1Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 1543US7807560B2Solder bump forming methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Oct 5, 2010·0 cites·7 claims
- 1640US10121695B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Nov 6, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →