Inventor · disambiguated record
Tariq Majid
Also filed as: MAJID TARIQ
9 granted patents·1 pending application·158 citations·filing 2003–2020
89Inventor score
Top patents by PatentIndex Score
10 records- 0197US8377268B2Electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2011·Granted Feb 19, 2013·19 cites·23 claims
- 0297US7985325B2Closed contact electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 26, 2011·36 cites·24 claims
- 0397US7935231B2Rapidly cleanable electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted May 3, 2011·36 cites·24 claims
- 0493US8398831B2Rapidly cleanable electroplating cup sealGHONGADI SHANTINATH·Filed 2011·Granted Mar 19, 2013·18 cites·27 claims
- 0591US9677190B2Membrane design for reducing defects in electroplating systemsLAM RES CORP·Filed 2014·Granted Jun 13, 2017·7 cites·23 claims
- 0689US9685353B2Apparatus and method for edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2013·Granted Jun 20, 2017·8 cites·22 claims
- 0783US8419964B2Apparatus and method for edge bevel removal of copper from silicon wafersGANESAN KOUSIK·Filed 2008·Granted Apr 16, 2013·11 cites·23 claims
- 0877US6884335B2Electroplating using DC current interruption and variable rotation rateNOVELLUS SYSTEMS INC·Filed 2003·Granted Apr 26, 2005·23 cites·57 claims
- 0945US2022208604A1Protection of seed layers during electrodeposition of metals in semiconductor device manufacturingLAM RES CORP·Filed 2020·Application pending·0 cites
- 1042US10358738B2Gap fill process stability monitoring of an electroplating process using a potential-controlled exit stepLAM RES CORP·Filed 2016·Granted Jul 23, 2019·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →