Inventor · disambiguated record
Takatoshi Masuda
Also filed as: MASUDA TAKATOSHI
16 granted patents·7 pending applications·101 citations·filing 2006–2020
92Inventor score
Top patents by PatentIndex Score
23 records- 0198US11616407B2Segment-core coupled body and method of manufacturing armatureMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 28, 2023·20 cites·26 claims
- 0288US8025556B2Method of grinding waferDISCO CORP·Filed 2009·Granted Sep 27, 2011·14 cites·4 claims
- 0385US7677955B2Grinding method for waferDISCO CORP·Filed 2008·Granted Mar 16, 2010·12 cites·5 claims
- 0482US7608481B2Method for producing semiconductor packageDISCO CORP·Filed 2007·Granted Oct 27, 2009·12 cites·4 claims
- 0581US7622328B2Processing method of waferDISCO CORP·Filed 2006·Granted Nov 24, 2009·8 cites·2 claims
- 0681US7278903B2Processing method for wafer and processing apparatus thereforDISCO CORP·Filed 2006·Granted Oct 9, 2007·8 cites·1 claims
- 0779US10756588B2Stator for rotary electric machineMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 25, 2020·2 cites·4 claims
- 0878US8415232B2Dividing method for wafer having die bonding film attached to the back side thereofKAJIYAMA KEIICHI·Filed 2011·Granted Apr 9, 2013·5 cites·3 claims
- 0978US7858530B2Processing method for wafer and processing apparatus thereforDISCO CORP·Filed 2007·Granted Dec 28, 2010·6 cites·4 claims
- 1069US8716914B2Stator of vehicle AC generator and method for manufacturing the sameTANAKA KAZUNORI·Filed 2009·Granted May 6, 2014·5 cites·7 claims
- 1169US7718511B2Processing method for waferDISCO CORP·Filed 2007·Granted May 18, 2010·3 cites·6 claims
- 1268US7439162B2Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniformDISCO CORP·Filed 2006·Granted Oct 21, 2008·4 cites·3 claims
- 1356US9159622B2Dividing method for waferDISCO CORP·Filed 2014·Granted Oct 13, 2015·1 cites·2 claims
- 1453US11095173B2Stator for rotating electric machine, and rotating electric machineMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 17, 2021·0 cites·9 claims
- 1551US8100742B2Grinding method for wafer having crystal orientationMASUDA TAKATOSHI·Filed 2009·Granted Jan 24, 2012·1 cites·1 claims
- 1644US2007249146A1Protective tape applying methodDISCO CORP·Filed 2007·Application pending·0 cites
- 1742US10886823B2Stator for rotary electric machine, rotary electric machine, and method for manufacturing stator for rotary electric machineMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 5, 2021·0 cites·17 claims
- 1842US2007004177A1Wafer processing methodNAKAMURA MASARU·Filed 2006·Application pending·0 cites
- 1942US2014209240A1Vacuum processing apparatusDISCO CORP·Filed 2014·Application pending·0 cites
- 2041US2023156997A1Memory unit, semiconductor module, dimm module, and manufacturing method for sameULTRAMEMORY INC·Filed 2020·Application pending·0 cites
- 2140US2018006512A1Armature and rotating electric machineMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 2239US2018331605A1Coil forming device and coil forming methodMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 2337US2022223531A1Semiconductor module and manufacturing method thereforULTRAMEMORY INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →