Inventor · disambiguated record
Takashi Masuko
Also filed as: MASUKO TAKASHI
50 granted patents·23 pending applications·309 citations·filing 1993–2024
98Inventor score
Top patents by PatentIndex Score
73 records- 0193US11979990B2Wiring board and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted May 7, 2024·3 cites·14 claims
- 0291US7851131B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partHITACHI CHEMICAL CO LTD·Filed 2008·Granted Dec 14, 2010·13 cites·21 claims
- 0390US12004305B2Wiring board and production method for sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 4, 2024·2 cites·13 claims
- 0488US12426164B2Semiconductor packageRESONAC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·8 claims
- 0588US8373283B2Adhesive composition, film-like adhesive, adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Feb 12, 2013·13 cites·11 claims
- 0684US8258017B2Photosensitive adhesiveMASUKO TAKASHI·Filed 2008·Granted Sep 4, 2012·12 cites·9 claims
- 0781US10674612B2Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layerHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jun 2, 2020·3 cites·8 claims
- 0879US11330721B2Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin filmHITACHI CHEMICAL CO LTD·Filed 2020·Granted May 10, 2022·1 cites·7 claims
- 0978US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 1078US5667899AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Sep 16, 1997·35 cites·7 claims
- 1176US8323873B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Dec 4, 2012·2 cites·21 claims
- 1276US8293453B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 23, 2012·2 cites·9 claims
- 1375US8445177B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted May 21, 2013·2 cites·14 claims
- 1474US7921012B2Apparatus and method for speech recognition using probability and mixed distributionsTOSHIBA KK·Filed 2007·Granted Apr 5, 2011·8 cites·8 claims
- 1572US10553205B2Speech recognition device, speech recognition method, and computer program productTOSHIBA KK·Filed 2017·Granted Feb 4, 2020·2 cites·20 claims
- 1672US8370139B2Feature-vector compensating apparatus, feature-vector compensating method, and computer program productTOSHIBA KK·Filed 2007·Granted Feb 5, 2013·8 cites·8 claims
- 1771US5605763AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Feb 25, 1997·40 cites·9 claims
- 1870US11147166B2Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 12, 2021·1 cites·6 claims
- 1969US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 2068US9309446B2Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor deviceMITSUKURA KAZUYUKI·Filed 2012·Granted Apr 12, 2016·3 cites·24 claims
- 2167US7387914B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 17, 2008·2 cites·14 claims
- 2266US6717242B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 6, 2004·12 cites·6 claims
- 2362US9754603B2Speech feature extraction apparatus and speech feature extraction methodNAKAMURA MASANOBU·Filed 2012·Granted Sep 5, 2017·2 cites·16 claims
- 2462US8293847B2Film-like adhesive, adhesive sheet, and semiconductor device using sameMASUKO TAKASHI·Filed 2006·Granted Oct 23, 2012·2 cites·12 claims
- 2562US8046225B2Prosody-pattern generating apparatus, speech synthesizing apparatus, and computer program product and method thereofTOSHIBA KK·Filed 2008·Granted Oct 25, 2011·3 cites·7 claims
- 2660US7647224B2Apparatus, method, and computer program product for speech recognitionTOSHIBA KK·Filed 2005·Granted Jan 12, 2010·3 cites·25 claims
- 2760US6855579B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 15, 2005·6 cites·14 claims
- 2858US9002698B2Speech translation apparatus, method and programTOSHIBA KK·Filed 2013·Granted Apr 7, 2015·2 cites·20 claims
- 2958US7172135B2Thermostat for two-system cooling deviceNIPPON THERMOSTAT KK·Filed 2003·Granted Feb 6, 2007·11 cites·17 claims
- 3057US8673539B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
- 3156US10964313B2Word score calculation device, word score calculation method, and computer program productTOSHIBA KK·Filed 2016·Granted Mar 30, 2021·1 cites·10 claims
- 3254US7781896B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·3 claims
- 3353US8278024B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 2, 2012·0 cites·20 claims
- 3453US8073686B2Apparatus, method and computer program product for feature extractionKIDA YUSUKE·Filed 2009·Granted Dec 6, 2011·1 cites·11 claims
- 3553US7057265B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·3 cites·13 claims
- 3650US8507323B2Method of producing semiconductor device with patterned photosensitive adhesiveMASUKO TAKASHI·Filed 2012·Granted Aug 13, 2013·0 cites·9 claims
- 3750US7078094B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·27 claims
- 3850US2024088051A1Method for producing semiconductor device, wiring board, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 3948US8349700B2Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 8, 2013·0 cites·10 claims
- 4048US2023356498A1Organic core material, production method for same, laminate including organic core material, and circuit boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 4148US2005187017A1Gaming machineARUZE CORP·Filed 2005·Application pending·0 cites
- 4247US7012320B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 14, 2006·2 cites·42 claims
- 4347US2015199341A1Speech translation apparatus, method and programTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4446US9330662B2Pattern classifier device, pattern classifying method, computer program product, learning device, and learning methodTOSHIBA KK·Filed 2014·Granted May 3, 2016·0 cites·7 claims
- 4546US8554546B2Apparatus and method for calculating a fundamental frequency changeKIDA YUSUKE·Filed 2009·Granted Oct 8, 2013·0 cites·9 claims
- 4646US2009048835A1Feature extracting apparatus, computer program product, and feature extraction methodTOSHIBA KK·Filed 2008·Application pending·0 cites
- 4746US2011159238A1Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic componentKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 4846US2023253215A1Method for producing circuit boardRESONAC CORP·Filed 2020·Application pending·0 cites
- 4946US2011223397A1Semiconductor device and method for manufacturing the sameKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 5043US10452355B2Automaton deforming device, automaton deforming method, and computer program productTOSHIBA KK·Filed 2015·Granted Oct 22, 2019·0 cites·18 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →