Inventor · disambiguated record
Takeshi Miyakoshi
Also filed as: MIYAKOSHI TAKESHI
6 granted patents·5 pending applications·20 citations·filing 2009–2023
77Inventor score
Top patents by PatentIndex Score
11 records- 0189US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0286US10236231B2Semiconductor deviceJ DEVICES CORP·Filed 2017·Granted Mar 19, 2019·5 cites·13 claims
- 0386US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 0462US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 0555US2023369179A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0650US10134710B2Semiconductor packageJ DEVICES CORP·Filed 2017·Granted Nov 20, 2018·0 cites·5 claims
- 0747US9601450B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Mar 21, 2017·0 cites·15 claims
- 0846US2010126763A1Wire bonding method, electronic apparatus, and method of manufacturing sameFUJITSU LTD·Filed 2009·Application pending·0 cites
- 0943US2015243576A1Semiconductor deviceJ DEVICES CORP·Filed 2015·Application pending·0 cites
- 1038US2012080219A1Method of manufacturing electronic device and electronic deviceTAKEUCHI SHUICHI·Filed 2011·Application pending·0 cites
- 1138US2012048607A1Electronic deviceTAKAHASHI TETSUYA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →