Inventor · disambiguated record
Takayuki Naba
Also filed as: NABA TAKAYUKI
24 granted patents·4 pending applications·480 citations·filing 1992–2023
96Inventor score
Top patents by PatentIndex Score
28 records- 0192US11948900B2Bonded body, circuit board, and semiconductor deviceTOSHIBA KK·Filed 2021·Granted Apr 2, 2024·2 cites·21 claims
- 0291US12396092B2Ceramic circuit board and semiconductor device using sameTOSHIBA KK·Filed 2023·Granted Aug 19, 2025·1 cites·16 claims
- 0390US9357643B2Ceramic/copper circuit board and semiconductor deviceTOSHIBA KK·Filed 2014·Granted May 31, 2016·9 cites·14 claims
- 0490US5807626ACeramic circuit boardTOSHIBA KK·Filed 1996·Granted Sep 15, 1998·118 cites·14 claims
- 0589US8273993B2Electronic component moduleKATO HIROMASA·Filed 2007·Granted Sep 25, 2012·19 cites·11 claims
- 0688US6426154B1Ceramic circuit boardTOSHIBA KK·Filed 2000·Granted Jul 30, 2002·54 cites·28 claims
- 0787US10515868B2Circuit substrate and semiconductor deviceTOSHIBA KK·Filed 2017·Granted Dec 24, 2019·5 cites·21 claims
- 0885US6284985B1Ceramic circuit board with a metal plate projected to prevent solder-flowTOSHIBA KK·Filed 2000·Granted Sep 4, 2001·41 cites·9 claims
- 0982US5672848ACeramic circuit boardTOSHIBA KK·Filed 1994·Granted Sep 30, 1997·68 cites·21 claims
- 1079US5328751ACeramic circuit board with a curved lead terminalTOSHIBA KK·Filed 1992·Granted Jul 12, 1994·61 cites·11 claims
- 1178US10952317B2Ceramic circuit board and semiconductor moduleTOSHIBA KK·Filed 2020·Granted Mar 16, 2021·1 cites·17 claims
- 1278US6613443B2Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the substrateTOSHIBA KK·Filed 2001·Granted Sep 2, 2003·25 cites·17 claims
- 1376US6232657B1Silicon nitride circuit board and semiconductor moduleTOSHIBA KK·Filed 1997·Granted May 15, 2001·50 cites·24 claims
- 1474US11973003B2Ceramic metal circuit board and semiconductor device using the sameTOSHIBA KK·Filed 2023·Granted Apr 30, 2024·0 cites·16 claims
- 1573US10595403B2Ceramic circuit board and semiconductor moduleTOSHIBA KK·Filed 2019·Granted Mar 17, 2020·1 cites·14 claims
- 1671US10872841B2Ceramic metal circuit board and semiconductor device using the sameTOSHIBA KK·Filed 2016·Granted Dec 22, 2020·2 cites·16 claims
- 1770US6569514B2Ceramic circuit board and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted May 27, 2003·18 cites·7 claims
- 1869US10790214B2Circuit substrate and semiconductor deviceTOSHIBA KK·Filed 2019·Granted Sep 29, 2020·1 cites·11 claims
- 1966US8518554B2Ceramic metal composite and semiconductor device using the sameNABA TAKAYUKI·Filed 2007·Granted Aug 27, 2013·4 cites·7 claims
- 2060US11594467B2Ceramic metal circuit board and semiconductor device using the sameTOSHIBA KK·Filed 2019·Granted Feb 28, 2023·0 cites·17 claims
- 2157US10366938B2Silicon nitride circuit board and electronic component module using the sameTOSHIBA KK·Filed 2018·Granted Jul 30, 2019·0 cites·13 claims
- 2253US2015061107A1Insulation sheet made from silicon nitride, and semiconductor module structure using the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2352US10109555B2Silicon nitride circuit board and electronic component module using the sameTOSHIBA KK·Filed 2016·Granted Oct 23, 2018·0 cites·15 claims
- 2450US2022037225A1Ceramic copper circuit board and semiconductor device using sameTOSHIBA KK·Filed 2021·Application pending·0 cites
- 2549US9214617B2Electronic component moduleKATO HIROMASA·Filed 2012·Granted Dec 15, 2015·0 cites·9 claims
- 2645US8916961B2Insulation sheet made from silicon nitride, and semiconductor module structure using the sameNABA TAKAYUKI·Filed 2010·Granted Dec 23, 2014·0 cites·16 claims
- 2741US2009090452A1Process for producing nonflat ceramic substrateTOSHIBA MATERIALS CO LTD·Filed 2006·Application pending·0 cites
- 2840US2008135082A1Thermoelectric Conversion Module, Heat Exchanger Using Same, and Thermoelectric Power Generating ApparatusTOSHIBA MATERIALS CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →