Inventor · disambiguated record
Takaaki Noda
Also filed as: ANTHONY ANNE M · NODA TAKAAKI
50 granted patents·14 pending applications·863 citations·filing 1976–2024
98Inventor score
Files withHITACHI INT ELECTRIC INC30KOKUSAI ELECTRIC CORP11HITACHI LTD5NODA TAKAAKI4DAIDO STEEL CO LTD3
Top patents by PatentIndex Score
64 records- 0198US6686281B2Method for fabricating a semiconductor device and a substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2002·Granted Feb 3, 2004·383 cites·10 claims
- 0294US4994688ASemiconductor device having a reference voltage generating circuitHITACHI LTD·Filed 1989·Granted Feb 19, 1991·105 cites·18 claims
- 0393US5285168AOperational amplifier for stably driving a low impedance load of low power consumptionHITACHI LTD·Filed 1992·Granted Feb 8, 1994·73 cites·8 claims
- 0491US11251039B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 15, 2022·2 cites·21 claims
- 0591US9472391B2Semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 18, 2016·11 cites·17 claims
- 0690US9349586B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 24, 2016·8 cites·18 claims
- 0788US9865451B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 9, 2018·8 cites·16 claims
- 0887US10032626B2Method of manufacturing semiconductor device by forming a film on a substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jul 24, 2018·9 cites·15 claims
- 0983US9698007B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 4, 2017·3 cites·16 claims
- 1082US9793107B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 17, 2017·4 cites·16 claims
- 1182US7556839B2Method of manufacturing semiconductor device and apparatus for processing substrateHITACHI INT ELECTRIC INC·Filed 2005·Granted Jul 7, 2009·6 cites·11 claims
- 1279US5376839ALarge scale integrated circuit having low internal operating voltageHITACHI LTD·Filed 1993·Granted Dec 27, 1994·38 cites·6 claims
- 1377US8178428B2Manufacturing method of semiconductor device and substrate processing apparatusNODA TAKAAKI·Filed 2010·Granted May 15, 2012·4 cites·20 claims
- 1476US11848201B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 19, 2023·0 cites·22 claims
- 1575US9653326B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted May 16, 2017·3 cites·8 claims
- 1674US6872636B2Method for fabricating a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Mar 29, 2005·13 cites·10 claims
- 1774US5634773ASuperhigh pressure control systemDAIKIN IND LTD·Filed 1994·Granted Jun 3, 1997·27 cites·6 claims
- 1873US8293646B2Semiconductor device manufacturing method and substrate processing apparatusOZAKI TAKASHI·Filed 2005·Granted Oct 23, 2012·4 cites·13 claims
- 1971US11251038B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 15, 2022·0 cites·18 claims
- 2070US9263251B2Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 16, 2016·1 cites·10 claims
- 2170US8227030B2Method of manufacturing semiconductor device and apparatus for processing substrateNODA TAKAAKI·Filed 2009·Granted Jul 24, 2012·2 cites·12 claims
- 2270US8221835B2Method of manufacturing semiconductor device and apparatus for processing substrateNODA TAKAAKI·Filed 2009·Granted Jul 17, 2012·2 cites·14 claims
- 2369US9831082B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·1 cites·16 claims
- 2469US4648887AMethod for controlling electrostatic precipitatorSUMITOMO HEAVY INDUSTRIES·Filed 1985·Granted Mar 10, 1987·26 cites·18 claims
- 2568US5179539ALarge scale integrated circuit having low internal operating voltageHITACHI VLSI ENG·Filed 1992·Granted Jan 12, 1993·28 cites·21 claims
- 2667US9673043B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 6, 2017·1 cites·13 claims
- 2766US4479535ARecuperative radiant tubeDAIDO STEEL CO LTD·Filed 1982·Granted Oct 30, 1984·27 cites·4 claims
- 2863US10062562B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 28, 2018·1 cites·18 claims
- 2963US7892983B2Substrate processing apparatus and producing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Feb 22, 2011·1 cites·3 claims
- 3061US2025003068A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3161US2025104997A1Method of processing substrate, method of manufacturing semiconductor device, recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3259US9123531B2Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Sep 1, 2015·0 cites·11 claims
- 3359US2009205567A1Method of manufacturing semiconductor device and apparatus for processing substrateHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3459US2024105446A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3558US8497192B2Method of manufacturing a semiconductor device and substrate processing apparatusISHIBASHI KIYOHISA·Filed 2011·Granted Jul 30, 2013·1 cites·11 claims
- 3658US6905963B2Fabrication of B-doped silicon film by LPCVD method using BCI3 and SiH4 gasesHITACHI INT ELECTRIC INC·Filed 2002·Granted Jun 14, 2005·9 cites·20 claims
- 3756US4152572AMethod of applying electrodes to high temperature heating elements for use in resistance furnacesDAIDO STEEL CO LTD·Filed 1976·Granted May 1, 1979·12 cites·3 claims
- 3856US2025084535A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3955US12148611B2Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 4055US11972934B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 30, 2024·0 cites·21 claims
- 4155US2016322212A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 4254US11401849B2Internal combustion engine exhaust purification deviceISUZU MOTORS LTD·Filed 2018·Granted Aug 2, 2022·0 cites·4 claims
- 4354US2016111466A1Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 4453USD748578SAdapter plateHITACHI INT ELECTRIC INC·Filed 2014·Granted Feb 2, 2016·7 cites·1 claims
- 4553US8847343B2Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusMIZUNO NORIKAZU·Filed 2011·Granted Sep 30, 2014·0 cites·15 claims
- 4653US5254880ALarge scale integrated circuit having low internal operating voltageHITACHI LTD·Filed 1992·Granted Oct 19, 1993·14 cites·4 claims
- 4753US2019311898A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 4850US12040179B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 16, 2024·0 cites·19 claims
- 4950US2013305991A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 5049US8392067B2Power steering deviceYAMAMOTO SATORU·Filed 2009·Granted Mar 5, 2013·1 cites·10 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Takaaki Noda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →