Inventor · disambiguated record
Takahisa Okuno
Also filed as: OKUNO TAKAHISA
6 granted patents·34 pending applications·7 citations·filing 2018–2025
72Inventor score
Files withNISSAN CHEMICAL CORP40
Top patents by PatentIndex Score
40 records- 0188US11732214B2Cleaning agent composition comprising an alkylamide solvent and a fluorine-containing quaternary ammonium saltNISSAN CHEMICAL CORP·Filed 2020·Granted Aug 22, 2023·2 cites·14 claims
- 0287US11866676B2Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Granted Jan 9, 2024·2 cites·13 claims
- 0383US11926765B2Adhesive composition for peeling off by irradiation with light, layered product, and production method and peeling method for layered productNISSAN CHEMICAL CORP·Filed 2019·Granted Mar 12, 2024·3 cites·13 claims
- 0479US2025376645A1Method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0575US2025092293A1Method for producing an adhesive composition for optical irradiation peelingNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 0673US2025263633A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0771US2024218293A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 0863US2025153225A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0960US2025002685A1Thermosetting compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 1058US2023131533A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1158US2023129238A1Cleaning agent composition and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1256US2022073801A1Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling methodNISSAN CHEMICAL CORP·Filed 2019·Application pending·0 cites
- 1356US2022154104A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 1456US2022135913A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 1555US12297381B2Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Granted May 13, 2025·0 cites·6 claims
- 1654US2025340759A1Release agent composition for light irradiation releaseNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1754US2025329566A1Adhesive composition for release by light irradiation, laminate, and method for producing processed semiconductor substrate or electronic device layerNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1853US2025065601A1Laminate, release agent composition, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 1952US2024132806A1Method for cleaning semiconductor substrate, method for manufacturing processed semiconductor substrate, and peeling and dissolving compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2052US2025043216A1Method for cleaning semiconductor substrate, method for manufacturing processed semiconductor substrate, and releasing and dissolving compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2151US12441964B2Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·10 claims
- 2251US2024352281A1Method of manufacturing laminate and kit of adhesive compositionsNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2351US2024363387A1Method of manufacturing laminate and kit of adhesive compositionsNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2450US2024208179A1Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2549US2025092292A1Adhesive composition, laminate, method for producing laminate, and method for producing processed substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2649US2025215294A1Adhesive containing polyether-modified siloxaneNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 2749US2024006221A1Laminate, method for manufacturing laminate, and method for manufacturting semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 2849US2025316522A1Adhesive composition for release by light irradiation, laminate, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 2948US2024199924A1Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3048US2025084291A1Adhesive composition, laminate, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3148US2024222180A1Laminate, method for manufacturing laminate, and method for manufacturing semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3248US2024213072A1Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3346US2024199918A1Adhesive composition, laminate, method of manufacturing laminate, and method of manufacturing processed substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3445US2023151307A1Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and release compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3545US2023343629A1Laminate and release agent compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3645US2023131428A1Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peelingNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3744US2022411684A1Adhesive composition, laminate and method for producing same, method for peeling laminate, and method for processing semiconductor-forming substrateNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 3843US11472168B2Laminated body including novolac resin as peeling layerNISSAN CHEMICAL CORP·Filed 2018·Granted Oct 18, 2022·0 cites·17 claims
- 3943US2023298923A1Multilayer body, release agent composition, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 4043US2022135914A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →