Inventor · disambiguated record
Takafumi Sasaki
Also filed as: SASAKI TAKAFUMI
67 granted patents·28 pending applications·804 citations·filing 1982–2024
98Inventor score
Files withKOKUSAI ELECTRIC CORP25HITACHI INT ELECTRIC INC22SASAKI TAKAFUMI15FANUC CORP5RICOH CO LTD5
Top patents by PatentIndex Score
95 records- 0198US9412582B2Reaction tube, substrate processing apparatus, and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 9, 2016·464 cites·14 claims
- 0296US10424520B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 24, 2019·15 cites·9 claims
- 0394US9096061B2Droplet discharge head, and image-forming apparatusSASAKI TAKAFUMI·Filed 2014·Granted Aug 4, 2015·9 cites·10 claims
- 0493US10336053B2Control apparatus for three dimensional object fabrication apparatus, control method for three-dimensional object fabrication apparatus, and three-dimensional object fabrication systemSASAKI TAKAFUMI·Filed 2016·Granted Jul 2, 2019·6 cites·18 claims
- 0593US8350514B2Numerical controller for multi-axis machineFANUC CORP·Filed 2011·Granted Jan 8, 2013·18 cites·10 claims
- 0692US10453735B2Substrate processing apparatus, reaction tube, semiconductor device manufacturing method, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·8 cites·5 claims
- 0791US9919475B2Three-dimensional printing apparatus, three-dimensional object forming method, and three-dimensional objectSASAKI TAKAFUMI·Filed 2015·Granted Mar 20, 2018·4 cites·8 claims
- 0889US9028614B2Substrate processing apparatusHARA DAISUKE·Filed 2012·Granted May 12, 2015·19 cites·1 claims
- 0989US8197048B2Image forming apparatusYAMANAKA KUNIHIRO·Filed 2007·Granted Jun 12, 2012·14 cites·11 claims
- 1087US8414097B2Image forming apparatus selecting pulses to form drive waveformSASAKI TAKAFUMI·Filed 2011·Granted Apr 9, 2013·5 cites·7 claims
- 1187US8255078B2Numerical controller for multi-axis machine toolOTSUKI TOSHIAKI·Filed 2011·Granted Aug 28, 2012·9 cites·13 claims
- 1286US11685992B2Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 27, 2023·2 cites·10 claims
- 1386USD739832SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 29, 2015·34 cites·1 claims
- 1485US9063536B2Numerical controller having workpiece mounting error compensation unit for three-axis machine toolOTSUKI TOSHIAKI·Filed 2011·Granted Jun 23, 2015·7 cites·1 claims
- 1585US2025101583A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1684US12203167B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 21, 2025·0 cites·15 claims
- 1784US8041447B2Numerical controller having workpiece setting error compensation meansFANUC LTD·Filed 2008·Granted Oct 18, 2011·13 cites·3 claims
- 1883US10808318B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 20, 2020·3 cites·10 claims
- 1982US9163309B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 20, 2015·5 cites·17 claims
- 2082US9082694B2Substrate processing apparatus, method for manufacturing substrate, and method for manufacturing semiconductor deviceSAIDO SHUHEI·Filed 2012·Granted Jul 14, 2015·7 cites·16 claims
- 2181US11045976B2Apparatus for producing three-dimensional objects, method for producing three-dimensional objects, and non-transitory recording mediumRICOH CO LTD·Filed 2017·Granted Jun 29, 2021·2 cites·13 claims
- 2280US7283889B2Numerical control device, and numerical control methodFANUC LTD·Filed 2004·Granted Oct 16, 2007·29 cites·3 claims
- 2380US2025125143A1Method of manufacturing semiconductor device capable of controlling film thickness distributionKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2480US2025118549A1Method of manufacturing semiconductor device capable of controlling film thickness distributionKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2579US11859280B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 2, 2024·0 cites·14 claims
- 2679US10961625B2Substrate processing apparatus, reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 2779US8033657B2Image forming apparatus including liquid discharge head unitRICOH CO LTD·Filed 2008·Granted Oct 11, 2011·5 cites·14 claims
- 2878US11453942B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 27, 2022·1 cites·18 claims
- 2978US8042911B2Liquid dispenser head, liquid dispensing unit using same, and image forming apparatus using sameRICOH CO LTD·Filed 2007·Granted Oct 25, 2011·5 cites·18 claims
- 3077US11426929B2Powder material for producing three-dimensional object, kit for producing three-dimensional object, and three-dimensional object producing method and apparatusRICOH CO LTD·Filed 2020·Granted Aug 30, 2022·1 cites·20 claims
- 3177USD939459SBoat for wafer processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 28, 2021·15 cites·1 claims
- 3277US11084274B2Three-dimensional shaping apparatus, method for controlling three-dimensional shaping apparatus, and recording mediumSASAKI TAKAFUMI·Filed 2016·Granted Aug 10, 2021·1 cites·19 claims
- 3376US8409352B2Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatusKURIBAYASHI KOEI·Filed 2011·Granted Apr 2, 2013·6 cites·13 claims
- 3475US10520913B2Numerical controllerFANUC CORP·Filed 2018·Granted Dec 31, 2019·1 cites·1 claims
- 3575US8868228B2Numerical controller having speed control function for multi-axis machining deviceOTSUKI TOSHIAKI·Filed 2011·Granted Oct 21, 2014·3 cites·10 claims
- 3670US12211689B2Method of manufacturing semiconductor device capable of controlling film thickness distributionKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 28, 2025·0 cites·18 claims
- 3770US10388512B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Aug 20, 2019·1 cites·8 claims
- 3870US9982347B2Cleaning method, method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted May 29, 2018·1 cites·7 claims
- 3968US4497513ALocking device for door of cooking apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1982·Granted Feb 5, 1985·20 cites·4 claims
- 4067US8901013B2Substrate processing apparatus, method of processing substrate and method of manufacturing semiconductor deviceYUASA KAZUHIRO·Filed 2011·Granted Dec 2, 2014·2 cites·15 claims
- 4166US9365928B2Substrate processing apparatus, method for manufacturing semiconductor device and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 14, 2016·1 cites·18 claims
- 4266US9022521B2Droplet discharge head, and image forming apparatusSASAKI TAKAFUMI·Filed 2013·Granted May 5, 2015·1 cites·13 claims
- 4365USD916037SCover of seal cap for reaction chamber for semiconductorKOKUSAI ELECTRIC CORP·Filed 2018·Granted Apr 13, 2021·9 cites·1 claims
- 4464USD872037SCover of seal cap for reaction chamber for semiconductor manufacturingHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 7, 2020·9 cites·1 claims
- 4564USD842823SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·9 cites·1 claims
- 4663US7239938B2Interference checking for a numerical control deviceFANUC LTD·Filed 2004·Granted Jul 3, 2007·9 cites·11 claims
- 4762USD843958SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 26, 2019·8 cites·1 claims
- 4861US10978361B2Substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
- 4959USD847301SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 30, 2019·7 cites·1 claims
- 5056US11898247B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →