Inventor · disambiguated record
Takahiro Shindo
Also filed as: SHINDO TAKAHIRO
4 granted patents·10 pending applications·1 citations·filing 2019–2025
56Inventor score
Files withTOKYO ELECTRON LTD14
Top patents by PatentIndex Score
14 records- 0187US12354846B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Jul 8, 2025·1 cites·12 claims
- 0265US12027344B2Film forming apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Jul 2, 2024·0 cites·9 claims
- 0363US2025149291A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0461US2025171893A1Method of forming carbon-based film and film forming apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0556US2025046575A1Plasma Processing DeviceTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0652US2019385815A1Film forming apparatusTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 0751US12456605B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Oct 28, 2025·0 cites·16 claims
- 0850US2025006471A1Nitride film forming method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0949US12476084B2Plasma processing apparatus, high-frequency power supply circuit, and impedance matching methodTOKYO ELECTRON LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1049US2023013551A1Plasma processing apparatus and processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1149US2025179630A1Substrate Treatment Device, Fluid Activation Device, Substrate Treatment Method, and Fluid Activation MethodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1247US2023038750A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1345US2025263830A1Method of forming carbon-based film and film forming apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1442US2023335379A1Plasma processing deviceTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →