Inventor · disambiguated record
Tadashi Takasaki
Also filed as: TAKASAKI TADASHI
38 granted patents·12 pending applications·59 citations·filing 2010–2025
96Inventor score
Top patents by PatentIndex Score
50 records- 0197US11538661B1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 27, 2022·3 cites·19 claims
- 0296US10424520B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 24, 2019·15 cites·9 claims
- 0390US8986450B1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Mar 24, 2015·8 cites·15 claims
- 0489US10934622B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 2, 2021·5 cites·9 claims
- 0589US2025054794A1Processing method, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0687US12424409B2Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 0786US8925562B1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 6, 2015·6 cites·13 claims
- 0886US2025343060A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0985US12387949B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1085US12165894B2Processing method, method of manufacturing semiconductor, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 1184US10453720B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·3 cites·18 claims
- 1282US11923173B2Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 1382US9163309B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 20, 2015·5 cites·17 claims
- 1481US9070554B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jun 30, 2015·4 cites·19 claims
- 1581US7943528B2Substrate processing apparatus and semiconductor devices manufacturing methodHITACHI INT ELECTRIC INC·Filed 2010·Granted May 17, 2011·2 cites·13 claims
- 1680US12093021B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 17, 2024·0 cites·17 claims
- 1780US10651068B1Method of manufacturing semiconductor device by setting process chamber to maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 12, 2020·1 cites·12 claims
- 1879US11749550B2Method of manufacturing semiconductor device by setting process chamber maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 1979US9508546B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·3 cites·1 claims
- 2079US2025340983A1Substrate processing apparatus with cleaning of exhaust systemKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2175US9728431B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 8, 2017·2 cites·9 claims
- 2274US11747789B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 5, 2023·0 cites·15 claims
- 2373US11967513B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 2473US11289350B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 29, 2022·1 cites·15 claims
- 2572US11355372B2Method of manufacturing semiconductor device by setting process chamber to maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 7, 2022·0 cites·19 claims
- 2672US11342212B2Method of manufacturing semiconductor device by setting process chamber maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2769US2023073084A1Substrate processing apparatus, substrate processing method and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2868US9659767B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted May 23, 2017·1 cites·14 claims
- 2967US2022360822A1Substrate processing system, method of processing substrate, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3066US12392032B2Substrate processing apparatus with cleaning of exhaust systemKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 19, 2025·0 cites·17 claims
- 3163US11314234B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 26, 2022·0 cites·15 claims
- 3262US11422528B2Substrate processing system, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 23, 2022·0 cites·16 claims
- 3361US11530481B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 20, 2022·0 cites·13 claims
- 3461US11380540B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jul 5, 2022·0 cites·19 claims
- 3561US10978361B2Substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
- 3660US10964531B1Method of manufacturing semiconductor device by supplying gasKOKUSAI ELECTRIC CORP·Filed 2020·Granted Mar 30, 2021·0 cites·16 claims
- 3758US2024093372A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3857US12327755B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jun 10, 2025·0 cites·17 claims
- 3957US8222161B2Substrate processing apparatus and semiconductor devices manufacturing methodYANAGISAWA YOSHIHIKO·Filed 2011·Granted Jul 17, 2012·0 cites·12 claims
- 4056US10503152B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Dec 10, 2019·0 cites·12 claims
- 4152US11305986B2Method of manufacturing semiconductor device, substrate processing apparatus and programKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 4250US10978310B2Method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of adjusting substrate temperatureKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
- 4349US10930533B2Substrate processing apparatus, substrate processing system and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 23, 2021·0 cites·9 claims
- 4449US2022090264A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4549US2022090263A1Substrate Processing SystemKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4645US2021071297A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 4743US11104995B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Aug 31, 2021·0 cites·20 claims
- 4842US2020051838A1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 4941US2019221460A1Method of manufacturing a semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 5038US2018158714A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →