Inventor · disambiguated record
Takahiro Yada
Also filed as: YADA TAKAHIRO
6 granted patents·2 pending applications·4 citations·filing 2010–2023
70Inventor score
Files withYADA TAKAHIRO3AMKOR TECH JAPAN INC2AMKOR TECHNOLOGY INC1J-DEVICES CORP1SONY SEMICONDUCTOR SOLUTIONS CORP1
Top patents by PatentIndex Score
8 records- 0167US8741411B2Multi-piece board and method for manufacturing the sameYADA TAKAHIRO·Filed 2010·Granted Jun 3, 2014·3 cites·20 claims
- 0263US11967565B2Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 0362US11362041B2Semiconductor devices including shielding layer and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2019·Granted Jun 14, 2022·1 cites·15 claims
- 0452US2025386602A1Solid-state imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 0546US8926785B2Multi-piece board and method for manufacturing the sameYADA TAKAHIRO·Filed 2012·Granted Jan 6, 2015·0 cites·20 claims
- 0636US10312186B2Heat sink attached to an electronic component in a packaged deviceAMKOR TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·0 cites·14 claims
- 0736US8547702B2Multi-piece board and method for manufacturing the sameYADA TAKAHIRO·Filed 2010·Granted Oct 1, 2013·0 cites·20 claims
- 0825US2017256453A1Method of manufacturing semiconductor package and semiconductor packageJ-DEVICES CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →