Inventor · disambiguated record
Teruo Haibara
Also filed as: HAIBARA TERUO
36 granted patents·13 pending applications·60 citations·filing 2003–2023
95Inventor score
Top patents by PatentIndex Score
49 records- 0189US10137534B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 27, 2018·5 cites·8 claims
- 0289US9887172B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Feb 6, 2018·6 cites·9 claims
- 0388US11721660B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Aug 8, 2023·1 cites·13 claims
- 0487US11929343B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Mar 12, 2024·1 cites·13 claims
- 0586US12090578B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Sep 17, 2024·2 cites·2 claims
- 0685US10610976B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Apr 7, 2020·1 cites·22 claims
- 0784US11373934B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Jun 28, 2022·4 cites·13 claims
- 0878US8070882B2Method for the wet-chemical treatment of a semiconductor waferSCHWAB GUENTER·Filed 2008·Granted Dec 6, 2011·8 cites·19 claims
- 0975US12300658B2Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted May 13, 2025·0 cites·3 claims
- 1073US9773688B2Ultrasonic cleaning method and ultrasonic cleaning apparatusSILTRONIC AG·Filed 2013·Granted Sep 26, 2017·3 cites·19 claims
- 1172US9543266B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 10, 2017·2 cites·5 claims
- 1271US10737356B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Aug 11, 2020·1 cites·9 claims
- 1371US10414002B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Sep 17, 2019·1 cites·10 claims
- 1470US9457385B2Ultrasonic cleaning method and ultrasonic cleaning apparatusSILTRONIC AG·Filed 2013·Granted Oct 4, 2016·1 cites·16 claims
- 1569US12412864B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·7 claims
- 1669US2023387066A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1768US2024290745A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1868US2023335528A1Bonding wire for semiconductor devicesNIPPON MICROMETAL COPORATION·Filed 2023·Application pending·0 cites
- 1967US8043435B2Cleaning liquid and cleaning method for electronic materialSILTRONIC AG·Filed 2007·Granted Oct 25, 2011·2 cites·17 claims
- 2066US8575571B2Cleaning apparatus, measurement method and calibration methodHAIBARA TERUO·Filed 2012·Granted Nov 5, 2013·2 cites·7 claims
- 2165US7276168B2Method for supply of constant-concentration ozonated waterSILTRONIC AG·Filed 2004·Granted Oct 2, 2007·11 cites·14 claims
- 2264US10672733B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 2363US2024297142A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2460US10497663B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Dec 3, 2019·0 cites·21 claims
- 2560US7074316B2Functional water, method and apparatus of producing the same, and method and apparatus of rinsing electronic parts therewithPURETRON LTD·Filed 2003·Granted Jul 11, 2006·9 cites·3 claims
- 2655US12388044B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Aug 12, 2025·0 cites·4 claims
- 2755US12132025B2Bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·4 claims
- 2855US10121758B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 2954US12463172B2AG alloy bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·8 claims
- 3054US10236272B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Mar 19, 2019·0 cites·10 claims
- 3153US10137483B2Ultrasonic cleaning methodSILTRONIC AG·Filed 2016·Granted Nov 27, 2018·0 cites·5 claims
- 3252US9662687B2Ultrasonic cleaning methodSILTRONIC AG·Filed 2015·Granted May 30, 2017·0 cites·14 claims
- 3352US2024290744A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 3451US11342299B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2016·Granted May 24, 2022·0 cites·8 claims
- 3551US2024290743A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 3651US2020312808A1Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2017·Application pending·0 cites
- 3750US8408221B2Micro bubble generating device and silicon wafer cleaning apparatusHAIBARA TERUO·Filed 2009·Granted Apr 2, 2013·0 cites·9 claims
- 3848US10121649B2Cleaning method of semiconductor waferHAIBARA TERUO·Filed 2009·Granted Nov 6, 2018·0 cites·10 claims
- 3945US10032741B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Jul 24, 2018·0 cites·8 claims
- 4045US2013192628A1Cleaning apparatus, equipment, and methodMORI YOSHIHIRO·Filed 2012·Application pending·0 cites
- 4144US10121764B2Method for forming ball in bonding wireNIPPON MICROMETAL CORP·Filed 2016·Granted Nov 6, 2018·0 cites·11 claims
- 4240US11101234B2Cu pillar cylindrical preform for semiconductor connectionNIPPON MICROMETAL CORP·Filed 2015·Granted Aug 24, 2021·0 cites·10 claims
- 4340US9536854B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 3, 2017·0 cites·5 claims
- 4439US8778085B2Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatusHAIBARA TERUO·Filed 2011·Granted Jul 15, 2014·0 cites·9 claims
- 4539US2013312789A1Ultrasonic cleaning method and ultrasonic cleaning apparatusSILTRONIC AG·Filed 2013·Application pending·0 cites
- 4639US2013312788A1Ultrasonic cleaning method and ultrasonic cleaning apparatusSILTRONIC AG·Filed 2013·Application pending·0 cites
- 4737US2013192627A1Cleaning methodKUBO ETSUKO·Filed 2012·Application pending·0 cites
- 4836US2005109711A1Method for forwarding ozonated waterSILTRONIC AG·Filed 2004·Application pending·0 cites
- 4936US2013160791A1Ultrasonic cleaning methodHAIBARA TERUO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →