Inventor · disambiguated record
Tetsuaki Inada
Also filed as: INADA TETSUAKI
11 granted patents·13 pending applications·58 citations·filing 1997–2025
85Inventor score
Technology areasH10P
Top patents by PatentIndex Score
24 records- 0196US11473196B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 18, 2022·4 cites·20 claims
- 0288USD981970SSubstrate mounting plate for substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 28, 2023·13 cites·1 claims
- 0384US10685832B1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 16, 2020·3 cites·8 claims
- 0471US12424415B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 23, 2025·0 cites·19 claims
- 0571US11926893B2Substrate processing apparatus, substrate processing method and non-transitory computer-readable recording medium thereforKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 0668US2023230818A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0768US2023212753A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0867US5960159AHeat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entiretyKOKUSAI ELECTRIC CO LTD·Filed 1997·Granted Sep 28, 1999·37 cites·20 claims
- 0967US2025191878A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1067US2023041284A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1165US12230474B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 18, 2025·0 cites·19 claims
- 1263US10604839B2Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 31, 2020·1 cites·8 claims
- 1362US2025014930A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1459US11499224B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 15, 2022·0 cites·14 claims
- 1555US2023274916A1Seal structure, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1654US2023245869A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1750US2022139760A1Substrate processing apparatus, susceptor cover, method of manufacturing semiconductor device and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1849US11035037B2Substrate processing apparatus and metal memberKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 15, 2021·0 cites·10 claims
- 1949US2022005678A1Substrate processing apparatus, reflector and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2044US2015087160A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 2142US2014087567A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 2241US9546422B2Semiconductor device manufacturing method and substrate processing method including a cleaning methodHITACHI INT ELECTRIC INC·Filed 2013·Granted Jan 17, 2017·0 cites·7 claims
- 2337US2013276983A1Injection member for manufacturing semiconductor device and plasma processing apparatus having the samePARK YONG SUNG·Filed 2012·Application pending·0 cites
- 2433US2015252474A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →