Inventor · disambiguated record
Tetsuya Kurosawa
Also filed as: KUROSAWA TETSUYA
39 granted patents·8 pending applications·697 citations·filing 1996–2024
98Inventor score
Top patents by PatentIndex Score
47 records- 0197US11521950B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Dec 6, 2022·5 cites·17 claims
- 0296US6555418B2Method for separating a semiconductor element in a semiconductor element pushing-up deviceTOSHIBA KK·Filed 2000·Granted Apr 29, 2003·108 cites·12 claims
- 0393US7060593B2Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor waferTOSHIBA KK·Filed 2002·Granted Jun 13, 2006·57 cites·2 claims
- 0492US7675153B2Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Mar 9, 2010·30 cites·13 claims
- 0591US6709543B2Semiconductor chip pickup device and pickup methodTOSHIBA KK·Filed 2001·Granted Mar 23, 2004·55 cites·51 claims
- 0690US7642113B2Semiconductor wafer dividing methodTOSHIBA KK·Filed 2006·Granted Jan 5, 2010·15 cites·19 claims
- 0790US6337258B1Method of dividing a waferTOSHIBA KK·Filed 2000·Granted Jan 8, 2002·59 cites·16 claims
- 0887US6756562B1Semiconductor wafer dividing apparatus and semiconductor device manufacturing methodTOSHIBA KK·Filed 2003·Granted Jun 29, 2004·39 cites·26 claims
- 0985US6352073B1Semiconductor manufacturing equipmentTOSHIBA KK·Filed 1999·Granted Mar 5, 2002·68 cites·13 claims
- 1085US6201306B1Push-up pin of a semiconductor element pushing-up device, and a method for separatingTOSHIBA KK·Filed 1996·Granted Mar 13, 2001·67 cites·14 claims
- 1184US7638858B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Dec 29, 2009·8 cites·8 claims
- 1284US7300818B2Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor waferTOSHIBA KK·Filed 2005·Granted Nov 27, 2007·7 cites·7 claims
- 1381US7892890B2Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereofTOSHIBA KK·Filed 2010·Granted Feb 22, 2011·6 cites·8 claims
- 1481US7202563B2Semiconductor device package having a semiconductor element with resinTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·7 cites·12 claims
- 1581US6699774B2Wafer splitting method using cleavageTOSHIBA KK·Filed 2002·Granted Mar 2, 2004·24 cites·20 claims
- 1680US7932162B2Method for manufacturing a stacked semiconductor package, and stacked semiconductor packageTOSHIBA KK·Filed 2008·Granted Apr 26, 2011·7 cites·15 claims
- 1779US7172673B2Peeling device and peeling methodLINTEC CORP·Filed 2005·Granted Feb 6, 2007·11 cites·12 claims
- 1878US7140951B2Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor waferTOSHIBA KK·Filed 2003·Granted Nov 28, 2006·21 cites·17 claims
- 1978US6774011B2Chip pickup device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 10, 2004·21 cites·6 claims
- 2075US7223319B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceLINTEC CORP·Filed 2004·Granted May 29, 2007·19 cites·14 claims
- 2174US9887311B2Semiconductor module having a light-transmissive insulating bodyTOSHIBA KK·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 2269US7405159B2Method of fabricating a semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2007·Granted Jul 29, 2008·3 cites·22 claims
- 2369US6777313B2Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup timeTOSHIBA KK·Filed 2002·Granted Aug 17, 2004·17 cites·30 claims
- 2468US10490531B2Manufacturing method of semiconductor device and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Nov 26, 2019·1 cites·11 claims
- 2568US8294282B2Semiconductor device and adhesive sheetHAYASHI HIDEKAZU·Filed 2010·Granted Oct 23, 2012·3 cites·8 claims
- 2668US7217640B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2004·Granted May 15, 2007·10 cites·12 claims
- 2768US2023054378A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 2867US7060532B2Manufacturing method of semiconductor deviceLINTEC CORP·Filed 2004·Granted Jun 13, 2006·17 cites·4 claims
- 2964US8956917B2Semiconductor device, and manufacturing method and manufacturing apparatus of the sameKUROSAWA TETSUYA·Filed 2012·Granted Feb 17, 2015·2 cites·14 claims
- 3062US7294558B2Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquidTOSHIBA KK·Filed 2005·Granted Nov 13, 2007·1 cites·16 claims
- 3162US2025201616A1Semiconductor manufacturing device and semiconductor device manufacturing methodKIOXIA CORP·Filed 2024·Application pending·0 cites
- 3261US11749667B2Semiconductor manufacturing apparatusKIOXIA CORP·Filed 2021·Granted Sep 5, 2023·0 cites·10 claims
- 3357US2024087970A1Semiconductor device and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 3453US10490485B2Semiconductor deviceTOSHIBA KK·Filed 2018·Granted Nov 26, 2019·0 cites·16 claims
- 3553US6933211B2Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Aug 23, 2005·3 cites·11 claims
- 3652US7608911B2Semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2008·Granted Oct 27, 2009·0 cites·13 claims
- 3751US6933606B2Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Aug 23, 2005·2 cites·22 claims
- 3850US11024619B2Semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2018·Granted Jun 1, 2021·0 cites·9 claims
- 3950US10026677B2Semiconductor deviceTOSHIBA KK·Filed 2016·Granted Jul 17, 2018·0 cites·17 claims
- 4048US7631680B2Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor waferTOSHIBA KK·Filed 2004·Granted Dec 15, 2009·1 cites·19 claims
- 4147US6739326B2Semiconductor manufacturing equipmentTOSHIBA KK·Filed 2001·Granted May 25, 2004·1 cites·12 claims
- 4244US2011163459A1Method for manufacturing a stacked semiconductor package, and stacked semiconductor packageTOSHIBA KK·Filed 2011·Application pending·0 cites
- 4338US2005016678A1Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor deviceFiled 2003·Application pending·0 cites
- 4438US2005023260A1Semiconductor wafer dividing apparatus and semiconductor device manufacturing methodFiled 2004·Application pending·0 cites
- 4537US11993057B2Film to hold a metal layer, metallic decorative sheet intermediate product, metallic decorative sheet, extruded laminate product, metallic molded product, injection molded product, method for producing a metallic molded product, method for producing injection molded product, and method for producing an extruded laminate productWAVELOCK ADVANCED TECH CO LTD·Filed 2019·Granted May 28, 2024·0 cites·18 claims
- 4637US2012235282A1Semiconductor device manufacturing method and semiconductor deviceTOMONO AKIRA·Filed 2012·Application pending·0 cites
- 4733US2010311224A1Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →