Inventor · disambiguated record
Tetsuya Shinjo
Also filed as: SHINJO TETSUYA
37 granted patents·39 pending applications·104 citations·filing 2004–2025
96Inventor score
Files withNISSAN CHEMICAL CORP47NISSAN CHEMICAL IND LTD17SHINJO TETSUYA3TAKEI SATOSHI3HORIGUCHI YUSUKE2
Top patents by PatentIndex Score
76 records- 0190US8993215B2Resist underlayer film forming composition containing phenylindole-containing novolac resinNISSAN CHEMICAL IND LTD·Filed 2013·Granted Mar 31, 2015·11 cites·8 claims
- 0289US9746772B2Resist underlayer film forming composition for lithography containing polyether structure-containing resinNISSAN CHEMICAL IND LTD·Filed 2016·Granted Aug 29, 2017·5 cites·9 claims
- 0388US11732214B2Cleaning agent composition comprising an alkylamide solvent and a fluorine-containing quaternary ammonium saltNISSAN CHEMICAL CORP·Filed 2020·Granted Aug 22, 2023·2 cites·14 claims
- 0487US11866676B2Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Granted Jan 9, 2024·2 cites·13 claims
- 0583US11926765B2Adhesive composition for peeling off by irradiation with light, layered product, and production method and peeling method for layered productNISSAN CHEMICAL CORP·Filed 2019·Granted Mar 12, 2024·3 cites·13 claims
- 0683US9263285B2Composition for forming a resist underlayer film including hydroxyl group-containing carbazole novolac resinSHINJO TETSUYA·Filed 2011·Granted Feb 16, 2016·7 cites·10 claims
- 0783US8674052B2Carbazole novolak resinNISSAN CHEMICAL IND LTD·Filed 2013·Granted Mar 18, 2014·5 cites·4 claims
- 0881US8481247B2Resist underlayer film forming composition containing liquid additiveHORIGUCHI YUSUKE·Filed 2007·Granted Jul 9, 2013·9 cites·5 claims
- 0980US11183415B2Adhesive containing polydimethyl siloxaneNISSAN CHEMICAL CORP·Filed 2017·Granted Nov 23, 2021·3 cites·18 claims
- 1080US9469777B2Resist underlayer film forming composition that contains novolac resin having polynuclear phenolNISSAN CHEMICAL IND LTD·Filed 2013·Granted Oct 18, 2016·4 cites·12 claims
- 1179US2025376645A1Method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 1278US9261790B2Resist underlayer film-forming composition containing copolymer resin having heterocyclic ringNISSAN CHEMICAL IND LTD·Filed 2013·Granted Feb 16, 2016·4 cites·15 claims
- 1378US8426111B2Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coatingTAKEI SATOSHI·Filed 2006·Granted Apr 23, 2013·6 cites·12 claims
- 1477US11776837B2Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrateNISSAN CHEMICAL CORP·Filed 2019·Granted Oct 3, 2023·2 cites·4 claims
- 1576US8709701B2Resist underlayer film forming composition for lithography, containing aromatic fused ring-containing resinSAKAGUCHI TAKAHIRO·Filed 2011·Granted Apr 29, 2014·2 cites·10 claims
- 1675US9244353B2Resist underlayer film forming compositionNISSAN CHEMICAL IND LTD·Filed 2013·Granted Jan 26, 2016·3 cites·5 claims
- 1775US2025092293A1Method for producing an adhesive composition for optical irradiation peelingNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 1874US9384977B2Method of manufacturing semiconductor device using organic underlayer film forming composition for solvent development lithography processNISSAN CHEMICAL IND LTD·Filed 2013·Granted Jul 5, 2016·2 cites·12 claims
- 1973US9343324B2Resist underlayer film-forming composition which contains alicyclic skeleton-containing carbazole resinSHINJO TETSUYA·Filed 2012·Granted May 17, 2016·3 cites·8 claims
- 2073US7687223B2Underlayer coating forming composition for lithography containing cyclodextrin compoundNISSAN CHEMICAL IND LTD·Filed 2005·Granted Mar 30, 2010·4 cites·12 claims
- 2173US2025263633A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 2273US2024301263A1Adhesive composition for infrared peeling, laminate, method for producing laminate, and peeling methodNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 2372US9134610B2Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coatingNISSAN CHEMICAL IND LTD·Filed 2013·Granted Sep 15, 2015·2 cites·16 claims
- 2472US2025388785A1Release agent composition for release by irradiation with light, laminate, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 2572US2024376356A1Temporary adhesive containing epoxy-modified polysiloxaneNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 2671US2024218293A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 2770US8722841B2Carbazole novolak resinSAITO DAIGO·Filed 2010·Granted May 13, 2014·2 cites·38 claims
- 2866US8361694B2Resist underlayer film forming compositionNISSAN CHEMICAL IND LTD·Filed 2008·Granted Jan 29, 2013·2 cites·3 claims
- 2963US2025153225A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 3062US12405533B2Resist underlayer film-forming composition containing substituted crosslinkable compoundNISSAN CHEMICAL IND LTD·Filed 2020·Granted Sep 2, 2025·0 cites·2 claims
- 3160US10509320B2Underlying coating forming composition for lithography containing compound having protected carboxyl groupTAKEI SATOSHI·Filed 2006·Granted Dec 17, 2019·1 cites·8 claims
- 3260US7226721B2Underlayer coating forming composition for lithography containing compound having protected carboxyl groupNISSAN CHEMICAL IND LTD·Filed 2004·Granted Jun 5, 2007·15 cites·15 claims
- 3360US2025002685A1Thermosetting compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3459US12227678B2Laminate peeling method, laminate, and laminate production methodNISSAN CHEMICAL CORP·Filed 2019·Granted Feb 18, 2025·0 cites·4 claims
- 3558US2023131533A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3658US2023129238A1Cleaning agent composition and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3757US12215259B2Multilayer object and release agent compositionNISSAN CHEMICAL CORP·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 3856US2022002602A1Adhesive composition for infrared peeling, laminate, method for producing laminate, and peeling methodNISSAN CHEMICAL CORP·Filed 2019·Application pending·0 cites
- 3956US2022073801A1Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling methodNISSAN CHEMICAL CORP·Filed 2019·Application pending·0 cites
- 4056US2022154104A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 4156US2022135913A1Cleaning agent composition and cleaning methodNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 4255US10809619B2Resist underlayer film-forming composition containing substituted crosslinkable compoundNISSAN CHEMICAL IND LTD·Filed 2014·Granted Oct 20, 2020·0 cites·12 claims
- 4355US9514949B2Composition for forming organic hard mask layer for use in lithography containing polymer having acrylamide structureSOMEYA YASUNOBU·Filed 2012·Granted Dec 6, 2016·1 cites·14 claims
- 4455US2025109325A1Releasability-imparting agent, adhesive composition, laminate, and method for producing semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 4554US2025340759A1Release agent composition for light irradiation releaseNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 4654US2025329566A1Adhesive composition for release by light irradiation, laminate, and method for producing processed semiconductor substrate or electronic device layerNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 4753US2025065601A1Laminate, release agent composition, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 4853US2010022090A1Resist underlayer film forming composition for lithography, containing aromatic fused ring-containing resinNISSAN CHEMICAL IND LTD·Filed 2007·Application pending·0 cites
- 4952US2024132806A1Method for cleaning semiconductor substrate, method for manufacturing processed semiconductor substrate, and peeling and dissolving compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 5052US2025043216A1Method for cleaning semiconductor substrate, method for manufacturing processed semiconductor substrate, and releasing and dissolving compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →