Inventor · disambiguated record
Thomas P. Glenn
Also filed as: GLENN THOMAS P
135 granted patents·4 pending applications·12,744 citations·filing 1985–2015
99Inventor score
Files withAMKOR TECHNOLOGY INC130AMKOR ELECTRONICS INC3AMKOR TECHNOLOGY3ANKOR TECHNOLOGY INC1GLENN THOMAS P1
Top patents by PatentIndex Score
139 records- 0199US6686588B1Optical module with lens integral holderAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·267 cites·41 claims
- 0299US6577013B1Chip size semiconductor packages with stacked diesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·559 cites·28 claims
- 0399US6571466B1Flip chip image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 3, 2003·282 cites·20 claims
- 0499US6143981APlastic integrated circuit package and method and leadframe for making the packageAMKOR TECHNOLOGY INC·Filed 1998·Granted Nov 7, 2000·476 cites·19 claims
- 0598US6962829B2Method of making near chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 8, 2005·148 cites·19 claims
- 0698US6734419B1Method for forming an image sensor package with vision die in lens housingAMKOR TECHNOLOGY INC·Filed 2001·Granted May 11, 2004·209 cites·14 claims
- 0798US6672773B1Optical fiber having tapered end and optical connector with reciprocal openingAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 6, 2004·158 cites·22 claims
- 0898US6545345B1Mounting for a package containing a chipAMKOR TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·199 cites·14 claims
- 0998US6528869B1Semiconductor package with molded substrate and recessed input/output terminalsAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 4, 2003·131 cites·33 claims
- 1098US6503780B1Wafer scale image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 7, 2003·355 cites·32 claims
- 1198US6424315B1Semiconductor chip having a radio-frequency identification transceiverAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 23, 2002·249 cites·21 claims
- 1298US6407381B1Wafer scale image sensor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·346 cites·18 claims
- 1398US6342406B1Flip chip on glass image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·174 cites·18 claims
- 1498US6340846B1Making semiconductor packages with stacked dies and reinforced wire bondsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 22, 2002·269 cites·21 claims
- 1598US6266197B1Molded window array for image sensor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 24, 2001·337 cites·17 claims
- 1698US6143588AMethod of making an integrated circuit package employing a transparent encapsulantAMKOR TECHNOLOGY INC·Filed 1998·Granted Nov 7, 2000·291 cites·46 claims
- 1797US6601293B1Method of making an electromagnetic interference shield deviceAMKOR TECHNOLOGY INC·Filed 2000·Granted Aug 5, 2003·82 cites·10 claims
- 1897US6530515B1Micromachine stacked flip chip package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·151 cites·18 claims
- 1997US6492699B1Image sensor package having sealed cavity over active areaAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·148 cites·16 claims
- 2097US6476476B1Integrated circuit package including pin and barrel interconnectsAMKOR TECHNOLOGY INC·Filed 2001·Granted Nov 5, 2002·143 cites·37 claims
- 2197US6472598B1Electromagnetic interference shield device with conductive encapsulant and damAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·92 cites·19 claims
- 2297US6472758B1Semiconductor package including stacked semiconductor dies and bond wiresAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·193 cites·27 claims
- 2397US6433277B1Plastic integrated circuit package and method and leadframe for making the packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Aug 13, 2002·83 cites·25 claims
- 2497US6274927B1Plastic package for an optical integrated circuit device and method of makingAMKOR TECHNOLOGY INC·Filed 1999·Granted Aug 14, 2001·228 cites·40 claims
- 2597US6150193ARF shielded deviceAMKOR TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·283 cites·17 claims
- 2697US5981314ANear chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1996·Granted Nov 9, 1999·280 cites·10 claims
- 2796US6650019B2Method of making a semiconductor package including stacked semiconductor diesAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 18, 2003·123 cites·27 claims
- 2896US6518659B1Stackable package having a cavity and a lid for an electronic deviceAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 11, 2003·117 cites·54 claims
- 2996US6455927B1Micromirror device packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·126 cites·29 claims
- 3096US6444499B1Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic componentsAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 3, 2002·213 cites·45 claims
- 3196US6424031B1Stackable package with heat sinkAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 23, 2002·121 cites·22 claims
- 3296US6268654B1Integrated circuit package having adhesive bead supporting planar lid above planar substrateAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 31, 2001·198 cites·28 claims
- 3396US6214644B1Flip-chip micromachine package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Apr 10, 2001·158 cites·11 claims
- 3496US6117705AMethod of making integrated circuit package having adhesive bead supporting planar lid above planar substrateAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·202 cites·38 claims
- 3596US6092281AElectromagnetic interference shield driver and methodAMKOR TECHNOLOGY INC·Filed 1998·Granted Jul 25, 2000·95 cites·4 claims
- 3695US6448506B1Semiconductor package and circuit board for making the packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 10, 2002·125 cites·27 claims
- 3795US6406934B1Wafer level production of chip size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·104 cites·20 claims
- 3895US6291884B1Chip-size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·182 cites·22 claims
- 3995US6281568B1Plastic integrated circuit device package and leadframe having partially undercut leads and die padAMKOR TECHNOLOGY INC·Filed 1998·Granted Aug 28, 2001·485 cites·35 claims
- 4094US6943429B1Wafer having alignment marks extending from a first to a second surface of the waferAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 13, 2005·97 cites·30 claims
- 4194US6630728B2Plastic integrated circuit package and leadframe for making the packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Oct 7, 2003·52 cites·19 claims
- 4294US6486545B1Pre-drilled ball grid array packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Nov 26, 2002·92 cites·34 claims
- 4394US6228676B1Near chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1999·Granted May 8, 2001·151 cites·13 claims
- 4493US6849916B1Flip chip on glass sensor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 1, 2005·64 cites·28 claims
- 4593US6521987B1Plastic integrated circuit device package and method for making the packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·104 cites·18 claims
- 4693US6522015B1Micromachine stacked wirebonded packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·70 cites·21 claims
- 4793US6483030B1Snap lid image sensor packageAMKOR TECHNOLOGY INC·Filed 1999·Granted Nov 19, 2002·105 cites·19 claims
- 4893US6399463B1Method of singulation using laser cuttingAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·74 cites·8 claims
- 4993US5949655AMounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit deviceAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 7, 1999·157 cites·19 claims
- 5092US6667544B1Stackable package having clips for fastening package and tool for opening clipsAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 23, 2003·67 cites·25 claims
Showing the top 50 of 139 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →