Inventor · disambiguated record
Thomas E. Noll
Also filed as: NOLL THOMAS · NOLL THOMAS E
7 granted patents·3 pending applications·360 citations·filing 1994–2018
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0198US8399972B2Overmolded semiconductor package with a wirebond cage for EMI shieldingHOANG DINHPHUOC V·Filed 2006·Granted Mar 19, 2013·86 cites·18 claims
- 0298US8071431B2Overmolded semiconductor package with a wirebond cage for EMI shieldingHOANG DINHPHUOC V·Filed 2010·Granted Dec 6, 2011·119 cites·26 claims
- 0394US9041168B2Overmolded semiconductor package with wirebonds for electromagnetic shieldingHOANG DINHPHUOC V·Filed 2011·Granted May 26, 2015·15 cites·20 claims
- 0489US9054115B2Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shieldingHOANG DINHPHUOC V·Filed 2011·Granted Jun 9, 2015·7 cites·23 claims
- 0588US6320257B1Chip packaging techniqueFOSTER MILLER INC·Filed 1994·Granted Nov 20, 2001·104 cites·27 claims
- 0682US8058714B2Overmolded semiconductor package with an integrated antennaNOLL THOMAS·Filed 2008·Granted Nov 15, 2011·23 cites·20 claims
- 0771US9955582B23-D stacking of active devices over passive devicesKUHLMAN MARK A·Filed 2008·Granted Apr 24, 2018·6 cites·17 claims
- 0854US2015255402A1Packaged radio-frequency module having wirebond shieldingSKYWORKS SOLUTIONS INC·Filed 2015·Application pending·0 cites
- 0954US2015255403A1Methods related to fabrication of shielded radio-frequency moduleSKYWORKS SOLUTIONS INC·Filed 2015·Application pending·0 cites
- 1050US2018242455A13-d stacking of active devices over passive devicesSKYWORKS SOLUTIONS INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →