3-d stacking of active devices over passive devices

Abstract

Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.

What is claimed is: 
     
         1 . A semiconductor packaged module comprising:
 a substrate having first and second conductive traces disposed thereon;   at least one passive surface mount component having an upper surface and a lower surface, at least a portion of the lower surface being connected to the first conductive trace; and   an active device adhered to the upper surface of the at least one passive surface mount component by an adhesive.   
     
     
         2 . The semiconductor packaged module as claimed in  claim 1 , wherein the adhesive is an epoxy paste. 
     
     
         3 . The semiconductor packaged module as claimed in  claim 1 , wherein the adhesive is non-conductive. 
     
     
         4 . The semiconductor packaged module as claimed in  claim 1 , wherein the at least one passive surface mount component comprises a body and a connection terminal;
 wherein the connection terminal is electrically connected to the first conductive trace; and   the adhesive is conductive; and   wherein the adhesive is disposed between a selected portion of the active device and the upper surface of the connection terminal.   
     
     
         5 . The semiconductor packaged module as claimed in  claim 1 , further comprising a wire bond electrically connecting the active device to the second conductive trace. 
     
     
         6 . The semiconductor packaged module as claimed in  claim 1 , further comprising a molding compound substantially encapsulating the active device. 
     
     
         7 . A method of packaging a semiconductor module, the method comprising:
 connecting a passive surface mount component to a substrate; and   mounting an active device on top of the passive surface mount component.   
     
     
         8 . The method as claimed in  claim 7 , wherein mounting the active device includes adhering the active device to the passive surface mount component using an adhesive. 
     
     
         9 . The method as claimed in  claim 8 , wherein adhering the active device to the passive surface mount component includes disposing a layer of adhesive on a surface of the active device; and mounting the active device to the passive surface mount component such that the adhesive is interposed between the active device and the passive surface mount component. 
     
     
         10 . The method as claimed in  claim 8 , wherein adhering the active device to the passive surface mount component includes:
 disposing a conductive adhesive on a connection terminal of the passive surface mount component;   aligning a connection pad on the active device with the connection terminal of the passive surface mount component; and   bonding and electrically connecting the connection pad to the connection terminal with the conductive adhesive.   
     
     
         11 . The method as claimed in  claim 7 , further comprising encapsulating the active device with a molding compound. 
     
     
         12 . The method as claimed in  claim 7 , wherein connecting a passive surface mount component to the substrate includes connecting a plurality of passive surface mount components to the substrate. 
     
     
         13 . The method as claimed in  claim 12 , wherein mounting the active device includes:
 disposing a layer of adhesive on the active device; and   mounting the active device on top of the plurality of passive surface mount components with the layer of adhesive interposed between the plurality of passive surface mount components and the active device.   
     
     
         14 . The method as claimed in  claim 13 , further comprising curing the layer of adhesive to bond the active device to the plurality of passive surface mount components.