Inventor · disambiguated record
Thomas Wagner
Also filed as: WAGNER THOMAS · WAGNER THOMAS HELMUT
44 granted patents·39 pending applications·57 citations·filing 2006–2025
96Inventor score
Top patents by PatentIndex Score
83 records- 0189US10403609B2System-in-package devices and methods for forming system-in-package devicesINTEL IP CORP·Filed 2015·Granted Sep 3, 2019·7 cites·25 claims
- 0288US2025309017A1Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2025·Application pending·0 cites
- 0387US10115668B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2015·Granted Oct 30, 2018·5 cites·10 claims
- 0487US2025323155A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 0585US12362251B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0685US11270941B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2016·Granted Mar 8, 2022·4 cites·20 claims
- 0785US2025285972A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 0885US2025285971A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 0983US2024355697A1Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2024·Application pending·0 cites
- 1082US10546817B2Face-up fan-out electronic package with passive components using a supportINTEL IP CORP·Filed 2017·Granted Jan 28, 2020·2 cites·12 claims
- 1181US12057364B2Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1281US10665522B2Package including an integrated routing layer and a molded routing layerINTEL IP CORP·Filed 2017·Granted May 26, 2020·2 cites·13 claims
- 1381US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 1479US10553538B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2018·Granted Feb 4, 2020·2 cites·19 claims
- 1579US10522485B2Electrical device and a method for forming an electrical deviceINTEL IP CORP·Filed 2015·Granted Dec 31, 2019·3 cites·25 claims
- 1678US11990408B2WLCSP reliability improvement for package edges including package shieldingINTEL CORP·Filed 2020·Granted May 21, 2024·1 cites·16 claims
- 1778US11955395B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·18 claims
- 1877US8471393B2Semiconductor component including a semiconductor chip and a passive componentMEYER THORSTEN·Filed 2006·Granted Jun 25, 2013·8 cites·20 claims
- 1977US8076739B2Micromechanical component and method for producing a micromechanical componentSCHMOLLNGRUBER PETER·Filed 2008·Granted Dec 13, 2011·11 cites·7 claims
- 2076US12341096B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2022·Granted Jun 24, 2025·0 cites·10 claims
- 2176US11581287B2Chip scale thin 3D die stacked packageINTEL CORP·Filed 2018·Granted Feb 14, 2023·2 cites·23 claims
- 2275US10403602B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL CORP·Filed 2017·Granted Sep 3, 2019·2 cites·9 claims
- 2372US12308335B2Integrating and accessing passive components in wafer-level packagesINTEL CORP·Filed 2023·Granted May 20, 2025·0 cites·15 claims
- 2472US11404339B2Fan out package with integrated peripheral devices and methodsINTEL IP CORP·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 2571US11508637B2Fan out package and methodsINTEL CORP·Filed 2020·Granted Nov 22, 2022·0 cites·19 claims
- 2670US10403580B2Molded substrate package in fan-out wafer level packageINTEL IP CORP·Filed 2017·Granted Sep 3, 2019·1 cites·20 claims
- 2770US2024030175A1Integrating and accessing passive components in wafer-level packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2868US2022051990A1Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2021·Application pending·0 cites
- 2967US10756042B2Multi-layer redistribution layer for wafer-level packagingINTEL IP CORP·Filed 2016·Granted Aug 25, 2020·1 cites·25 claims
- 3067US10366968B2Interconnect structure for a microelectronic deviceINTEL IP CORP·Filed 2016·Granted Jul 30, 2019·1 cites·13 claims
- 3166US12125815B2Assembly of 2XD module using high density interconnect bridgesINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·21 claims
- 3266US11469213B2Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronicsINTEL CORP·Filed 2016·Granted Oct 11, 2022·1 cites·25 claims
- 3366US11211337B2Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 3465US12406925B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2021·Granted Sep 2, 2025·0 cites·17 claims
- 3565US10490527B2Vertical wire connections for integrated circuit packageINTEL IP CORP·Filed 2015·Granted Nov 26, 2019·1 cites·22 claims
- 3665US2022294115A1Patch antennas stitched to systems in packages and methods of assembling sameINTEL CORP·Filed 2022·Application pending·0 cites
- 3760US10699980B2Fan out package with integrated peripheral devices and methodsINTEL IP CORP·Filed 2018·Granted Jun 30, 2020·0 cites·7 claims
- 3859US12362241B2Semiconductor structure and method for forming a semiconductor structureINTEL CORP·Filed 2021·Granted Jul 15, 2025·0 cites·24 claims
- 3959US2025261300A1Methods and apparatus to cool hotspots in integrated circuit packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 4058US11018114B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL IP CORP·Filed 2019·Granted May 25, 2021·0 cites·25 claims
- 4158US10816742B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2018·Granted Oct 27, 2020·0 cites·8 claims
- 4257US2024364000A1Antenna module with capacitive couplingINTEL CORP·Filed 2023·Application pending·0 cites
- 4357US2024364023A1Spherical antenna arrangement with z-dimensional plated antenna structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 4457US2024363556A1Integrated millimeter wave antenna esd protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 4557US2024363567A1Rf antenna module using copper-to-copper interconnects between the antenna and the rf dieINTEL CORP·Filed 2023·Application pending·0 cites
- 4657US2024364002A1Millimeter wave antenna esd protection using integrated polymer nanocomposite devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 4757US2020328182A1Embedded-bridge substrate connectors and methods of assembling sameINTEL IP CORP·Filed 2020·Application pending·0 cites
- 4856US10720393B2Molded substrate package in fan-out wafer level packageINTEL IP CORP·Filed 2019·Granted Jul 21, 2020·0 cites·20 claims
- 4955US2024429221A1Glass layers and capacitors for use with integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 5054US2019333886A1Interconnect structure for a microelectronic deviceINTEL IP CORP·Filed 2019·Application pending·0 cites
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →