Inventor · disambiguated record
Tian-An Chen
Also filed as: CHEN TIAN-AN
34 granted patents·9 pending applications·607 citations·filing 1997–2012
98Inventor score
Top patents by PatentIndex Score
43 records- 0196US6172128B1Nanoporous polymers crosslinked via cyclic structuresHONEYWELL INT INC·Filed 2000·Granted Jan 9, 2001·70 cites·20 claims
- 0294US6380347B1Nanoporous polymers comprising macrocyclesHONEYWELL INT INC·Filed 2000·Granted Apr 30, 2002·49 cites·30 claims
- 0393US6156812ANanoporous material fabricated using polymeric template strandsHONEYWELL INT INC·Filed 2000·Granted Dec 5, 2000·44 cites·25 claims
- 0491US7179684B2Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill materialINTEL CORP·Filed 2005·Granted Feb 20, 2007·19 cites·19 claims
- 0589US7303944B2Microelectronic devices having underfill materials with improved fluxing agentsINTEL CORP·Filed 2006·Granted Dec 4, 2007·10 cites·17 claims
- 0688US6899960B2Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill materialINTEL CORP·Filed 2002·Granted May 31, 2005·23 cites·19 claims
- 0787US6313185B1Polymers having backbones with reactive groups employed in crosslinking as precursors to nanoporous thin film structuresHONEYWELL INT INC·Filed 1998·Granted Nov 6, 2001·51 cites·20 claims
- 0884US6270395B1Oxidizing polishing slurries for low dielectric constant materialsALLIED SIGNAL INC·Filed 1998·Granted Aug 7, 2001·64 cites·18 claims
- 0977US6124421APoly(arylene ether) compositions and methods of manufacture thereofALLIED SIGNAL INC·Filed 1997·Granted Sep 26, 2000·53 cites·45 claims
- 1076US6303733B1Poly(arylene ether) homopolymer compositions and methods of manufacture thereofALLIED SIGNAL INC·Filed 1998·Granted Oct 16, 2001·48 cites·34 claims
- 1174US7218007B2Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devicesINTEL CORP·Filed 2004·Granted May 15, 2007·12 cites·21 claims
- 1274US6610114B2Oxidizing polishing slurries for low dielectric constant materialsHONEYWELL INT INC·Filed 2001·Granted Aug 26, 2003·15 cites·27 claims
- 1373US6730542B2Polybenzoxazine based wafer-level underfill materialINTEL CORP·Filed 2003·Granted May 4, 2004·16 cites·13 claims
- 1472US7619318B2No-flow underfill composition and methodINTEL CORP·Filed 2005·Granted Nov 17, 2009·4 cites·13 claims
- 1572US6794225B2Surface treatment for microelectronic device substrateINTEL CORP·Filed 2002·Granted Sep 21, 2004·19 cites·24 claims
- 1671US6780517B2Polycarbosilane adhesion promoters for low dielectric constant polymeric materialsHONEYWELL INT INC·Filed 2002·Granted Aug 24, 2004·13 cites·20 claims
- 1770US6982492B2No-flow underfill composition and methodINTEL CORP·Filed 2003·Granted Jan 3, 2006·14 cites·12 claims
- 1869US6794761B2No-flow underfill materialINTEL CORP·Filed 2001·Granted Sep 21, 2004·15 cites·28 claims
- 1964US7521115B2Low temperature bumping processINTEL CORP·Filed 2002·Granted Apr 21, 2009·4 cites·5 claims
- 2064US6727594B2Polybenzoxazine based wafer-level underfill materialINTEL CORP·Filed 2002·Granted Apr 27, 2004·10 cites·13 claims
- 2162US7279359B2High performance amine based no-flow underfill materials for flip chip applicationsINTEL CORP·Filed 2004·Granted Oct 9, 2007·10 cites·13 claims
- 2262US7153765B2Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particlesINTEL CORP·Filed 2005·Granted Dec 26, 2006·1 cites·23 claims
- 2355US7999042B2Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applicationsINTEL CORP·Filed 2004·Granted Aug 16, 2011·4 cites·8 claims
- 2455US6872654B2Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectricINTEL CORP·Filed 2002·Granted Mar 29, 2005·4 cites·19 claims
- 2553US7470564B2Flip-chip system and method of making sameINTEL CORP·Filed 2002·Granted Dec 30, 2008·5 cites·17 claims
- 2652US8431223B2Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applicationsMATAYABAS JR JAMES C·Filed 2012·Granted Apr 30, 2013·0 cites·9 claims
- 2752US7029723B2Forming chemical vapor depositable low dielectric constant layersINTEL CORP·Filed 2003·Granted Apr 18, 2006·3 cites·5 claims
- 2852US2007085175A1Selective solder deposition by self-assembly of nano-sized solder particles, and methods of assembling soldered packagesINTEL CORP·Filed 2006·Application pending·0 cites
- 2951US7026376B2Fluxing agent for underfill materialsINTEL CORP·Filed 2003·Granted Apr 11, 2006·2 cites·13 claims
- 3051US2007117263A1Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill materialSHI SONG-HUA·Filed 2007·Application pending·0 cites
- 3150US8242216B2Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applicationsMATAYABAS JR JAMES C·Filed 2011·Granted Aug 14, 2012·0 cites·9 claims
- 3249US8513111B2Forming semiconductor structuresMEAGLEY ROBERT P·Filed 2006·Granted Aug 20, 2013·0 cites·3 claims
- 3349US7718216B2Low temperature bumping processINTEL CORP·Filed 2007·Granted May 18, 2010·0 cites·8 claims
- 3449US7504318B2Nanopowder coating for scribing and structures formed therebyINTEL CORP·Filed 2005·Granted Mar 17, 2009·0 cites·24 claims
- 3548US6761975B1Polycarbosilane adhesion promoters for low dielectric constant polymeric materialsHONEYWELL INT INC·Filed 1999·Granted Jul 13, 2004·13 cites·10 claims
- 3646US6291628B1Solvent systems for low dielectric constant polymeric materialsALLIED SIGNAL INC·Filed 1999·Granted Sep 18, 2001·12 cites·10 claims
- 3745US2006138622A1One step capillary underfill integration for semiconductor packagesLU DAOQIANG·Filed 2005·Application pending·0 cites
- 3841US2006138643A1One step capillary underfill integration for semiconductor packagesLU DAOQIANG·Filed 2004·Application pending·0 cites
- 3940US2005147489A1Wafer supporting system for semiconductor wafersFiled 2003·Application pending·0 cites
- 4040US2004145030A1Forming semiconductor structuresFiled 2003·Application pending·0 cites
- 4140US2006243315A1Gap-filling in electronic assemblies including a TEC structureCHRYSLER GREGORY M·Filed 2005·Application pending·0 cites
- 4238US2005067468A1Fluxes for flip chip assembly using water soluble polymersFiled 2003·Application pending·0 cites
- 4336US2004192172A1Oxidizing polishing slurries for low dielectric constant materialsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →