Inventor · disambiguated record
Ting-Chu Ko
Also filed as: KO TING-CHU
27 granted patents·12 pending applications·1,382 citations·filing 2003–2024
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21TAIWAN SEMICONDUCTOR MFG11CHEN CHUNG HSIEN1KO TING-CHU1LEE HSIEN MING1
Top patents by PatentIndex Score
39 records- 0198US8816444B2System and methods for converting planar design to FinFET designWANN CLEMENT HSINGJEN·Filed 2012·Granted Aug 26, 2014·1.3k cites·20 claims
- 0294US11929319B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0392US10629540B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·6 cites·20 claims
- 0490US9330970B2Structure and method for high performance interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 3, 2016·8 cites·20 claims
- 0589US11335666B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·16 claims
- 0689US8716863B2Structure and method for high performance interconnectWANN HSINGJEN·Filed 2011·Granted May 6, 2014·18 cites·14 claims
- 0786US9048317B2Contact structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·6 cites·20 claims
- 0883US12205888B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0982US11075159B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·2 cites·20 claims
- 1082US2024387359A1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1181US10879170B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 1280US11488908B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 1, 2022·2 cites·20 claims
- 1380US9634001B2System and methods for converting planar design to FinFET designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 25, 2017·4 cites·20 claims
- 1478US2024387454A1Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1576US10504865B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·2 cites·20 claims
- 1676US2024387392A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1776US2024375236A1Simplified carrier removable by reduced number of cmp processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1874US12148735B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1973US9236253B2Strained structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 12, 2016·2 cites·19 claims
- 2072US7259463B2Damascene interconnect structure with cap layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 21, 2007·20 cites·9 claims
- 2169US12165985B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 2266US8101489B2Approach to reduce the contact resistanceSHUE SHAU-LIN·Filed 2008·Granted Jan 24, 2012·2 cites·19 claims
- 2360US8053892B2Low resistance and reliable copper interconnects by variable dopingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 8, 2011·1 cites·10 claims
- 2458US11127708B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 2557US12400936B2Stacked memory cube with integrated thermal path for enhanced heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2656US2024162119A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2756US2024332176A1Semiconductor Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2855US2024072034A13DIC Package and Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2953US7026244B2Low resistance and reliable copper interconnects by variable dopingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 11, 2006·4 cites·8 claims
- 3050US11551999B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·16 claims
- 3149US9379108B2Contact structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 28, 2016·0 cites·20 claims
- 3247US2014048888A1Strained Structure of a Semiconductor DeviceCHEN CHUNG-HSIEN·Filed 2012·Application pending·0 cites
- 3345US8785321B2Low resistance and reliable copper interconnects by variable dopingKO TING-CHU·Filed 2011·Granted Jul 22, 2014·0 cites·20 claims
- 3445US2009004851A1Salicidation process using electroless plating to deposit metal and introduce dopant impuritiesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 3543US2007181434A1Method and apparatus for fabricating metal layerLEE HSIEN-MING·Filed 2007·Application pending·0 cites
- 3642US2007287294A1Interconnect structures and methods for fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3741US7771579B2Electro chemical plating additives for improving stress and leveling effectTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 10, 2010·0 cites·18 claims
- 3841US7226860B2Method and apparatus for fabricating metal layerTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2004·Granted Jun 5, 2007·0 cites·45 claims
- 3938US2005045485A1Method to improve copper electrochemical depositionTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →