Method and apparatus for fabricating metal layer

Abstract

A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle θ less than 90° between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate.

1 . An apparatus for electrochemical deposition comprising: 
 an electrochemical cell for electrochemically depositing a metal on a substrate, wherein the electrochemical cell further includes: 
 a electrolyte bath;  
 an anode;  
 a substrate holder assembly including a substrate chuck, a cathode contact ring and a lift seal; and  
 a cap covering the electrochemical deposition cell.  
   
   
   
       2 . The apparatus according to  claim 1 , wherein the cathode contact ring includes a contact angle θ between the lift seal and the electroplating substrate.  
   
   
       3 . The apparatus according to  claim 2 , wherein the contact angle θ is less than 90°.  
   
   
       4 . The apparatus according to  claim 2 , wherein the substrate chuck exerts a rear force on a rear side of the electroplated substrate.  
   
   
       5 . The apparatus according to  claim 4 , wherein the rear force applied to rear side of the electroplated surface reverses any curvature of the substrate.