Inventor · disambiguated record
Shih-Wei Chou
Also filed as: CHOU SHIH-WEI
39 granted patents·12 pending applications·413 citations·filing 2001–2025
97Inventor score
Files withQUALCOMM INC22TAIWAN SEMICONDUCTOR MFG1717LIVE JAPAN INC1BASF SE1CHIA CHI YA ENTPR CO LTD1
Top patents by PatentIndex Score
51 records- 0197US7064068B2Method to improve planarity of electroplated copperTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 20, 2006·208 cites·24 claims
- 0295US10298381B1Multiphase clock data recovery with adaptive tracking for a multi-wire, multi-phase interfaceQUALCOMM INC·Filed 2018·Granted May 21, 2019·19 cites·30 claims
- 0395US9496879B1Multiphase clock data recovery for a 3-phase interfaceQUALCOMM INC·Filed 2015·Granted Nov 15, 2016·37 cites·25 claims
- 0494US11240077B2C-PHY half-rate wire state encoder and decoderQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·4 cites·12 claims
- 0592US9819523B2Intelligent equalization for a three-transmitter multi-phase systemQUALCOMM INC·Filed 2017·Granted Nov 14, 2017·11 cites·25 claims
- 0691US10333690B1Calibration pattern and duty-cycle distortion correction for clock data recovery in a multi-wire, multi-phase interfaceQUALCOMM INC·Filed 2018·Granted Jun 25, 2019·9 cites·30 claims
- 0790US10419246B2C-PHY training pattern for adaptive equalization, adaptive edge tracking and delay calibrationQUALCOMM INC·Filed 2017·Granted Sep 17, 2019·9 cites·30 claims
- 0887US11095425B2Small loop delay clock and data recovery block for high-speed next generation C-PHYQUALCOMM INC·Filed 2020·Granted Aug 17, 2021·2 cites·29 claims
- 0983US11327914B1C-PHY data-triggered edge generation with intrinsic half-rate operationQUALCOMM INC·Filed 2021·Granted May 10, 2022·2 cites·30 claims
- 1083US11023409B2MIPI D-PHY receiver auto rate detection and high-speed settle time controlQUALCOMM INC·Filed 2019·Granted Jun 1, 2021·3 cites·30 claims
- 1183US6803309B2Method for depositing an adhesion/barrier layer to improve adhesion and contact resistanceTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 12, 2004·35 cites·17 claims
- 1281US11038666B1Open-loop, super fast, half-rate clock and data recovery for next generation C-PHY interfacesQUALCOMM INC·Filed 2019·Granted Jun 15, 2021·3 cites·27 claims
- 1380US10615785B1Fully compensated complementary duty cycle correction circuitsQUALCOMM INC·Filed 2019·Granted Apr 7, 2020·3 cites·20 claims
- 1479US10289600B2Reducing transmitter encoding jitter in a C-PHY interface using multiple clock phases to launch symbolsQUALCOMM INC·Filed 2016·Granted May 14, 2019·3 cites·20 claims
- 1577US11116319B1SeatCHIA CHI YA ENTPR CO LTD·Filed 2020·Granted Sep 14, 2021·2 cites·10 claims
- 1675US9998154B2Low power physical layer driver topologiesQUALCOMM INC·Filed 2016·Granted Jun 12, 2018·2 cites·16 claims
- 1770US7749896B2Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jul 6, 2010·2 cites·8 claims
- 1870US6706166B2Method for improving an electrodeposition process through use of a multi-electrode assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 16, 2004·13 cites·16 claims
- 1969US9123781B2Semiconductor device and method for forming the sameSU HUNG-WEN·Filed 2010·Granted Sep 1, 2015·2 cites·4 claims
- 2069US7446042B2Method for silicide formation on semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 4, 2008·4 cites·20 claims
- 2166US7332435B2Silicide structure for ultra-shallow junction for MOS devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 19, 2008·3 cites·18 claims
- 2265US11764733B2C-PHY receiver with self-regulated common mode servo loopQUALCOMM INC·Filed 2021·Granted Sep 19, 2023·0 cites·29 claims
- 2364US6649513B1Copper back-end-of-line by electropolishTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 18, 2003·9 cites·30 claims
- 2462US11411711B2Small loop delay clock and data recovery block for high-speed next generation C-PHYQUALCOMM INC·Filed 2021·Granted Aug 9, 2022·0 cites·12 claims
- 2562US6793797B2Method for integrating an electrodeposition and electro-mechanical polishing processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 21, 2004·8 cites·18 claims
- 2661US11641294B2C-PHY half-rate wire state encoder and decoderQUALCOMM INC·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 2761US6893549B2Cleaning apparatus for ECMD anode padTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 17, 2005·5 cites·16 claims
- 2858US6797144B2Method for reducing surface defects in an electrodeposition processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 28, 2004·8 cites·20 claims
- 2956US10833899B2Low power physical layer driver topologiesQUALCOMM INC·Filed 2019·Granted Nov 10, 2020·0 cites·8 claims
- 3056US10419252B2Low power physical layer driver topologiesQUALCOMM INC·Filed 2018·Granted Sep 17, 2019·0 cites·16 claims
- 3156US9978681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 22, 2018·0 cites·10 claims
- 3256US6652726B1Method for reducing wafer edge defects in an electrodeposition processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 25, 2003·5 cites·20 claims
- 3354US2018234122A1Low power physical layer driver topologiesQUALCOMM INC·Filed 2018·Application pending·0 cites
- 3454US2025211414A1An area and power efficient clock data recovery (cdr) and adaptation implementation for dense wavelength-division multiplexing (dwdm) optical linksXILINX INC·Filed 2023·Application pending·0 cites
- 3549US11838000B2Comparator integration time stabilization technique utilizing common mode mitigation schemeQUALCOMM INC·Filed 2021·Granted Dec 5, 2023·0 cites·23 claims
- 3649US11106610B2Seperation of low-power and high-speed analog front-end receiversQUALCOMM INC·Filed 2019·Granted Aug 31, 2021·0 cites·39 claims
- 3749US6995089B2Method to remove copper without pattern density effectTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 7, 2006·2 cites·40 claims
- 3848US2025227325A1Server, method and computer program17LIVE JAPAN INC·Filed 2025·Application pending·0 cites
- 3946US11528995B2Balancing pressure bearing apparatusGREAT SHOW GLOBAL CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·10 claims
- 4046US2006189127A1Method to improve palanarity of electroplated copperTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 4146US2007221993A1Method for making a thermally stable silicideTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 4244US2010151639A1Method for making a thermally-stable silicideTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
- 4343US10389315B2Three-input continuous-time amplifier and equalizer for multi-level signalingQUALCOMM INC·Filed 2018·Granted Aug 20, 2019·0 cites·13 claims
- 4443US2007181434A1Method and apparatus for fabricating metal layerLEE HSIEN-MING·Filed 2007·Application pending·0 cites
- 4541US7226860B2Method and apparatus for fabricating metal layerTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2004·Granted Jun 5, 2007·0 cites·45 claims
- 4640US2006091551A1Differentially metal doped copper damascenesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 4739US2002143910A1Network hubFiled 2001·Application pending·0 cites
- 4839US2005097769A1LoadlockFiled 2003·Application pending·0 cites
- 4937US2003168345A1In-situ monitor seed for copper platingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 5036US11585004B2Composition for cobalt or cobalt alloy electroplatingBASF SE·Filed 2019·Granted Feb 21, 2023·0 cites·18 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →