Inventor · disambiguated record
Tin-Hao Kuo
Also filed as: KUO TIN-HAO
229 granted patents·31 pending applications·830 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD221TAIWAN SEMICONDUCTOR MFG20CHANG CHIH-HORNG3KUO TIN-HAO3SHIEH YUH CHERN2
Top patents by PatentIndex Score
260 records- 0199US11315805B2Cross-wafer RDLs in constructed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·20 claims
- 0299US10269773B1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·45 cites·20 claims
- 0398US11908706B2Cross-wafer RDLs in constructed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·4 cites·20 claims
- 0498US11848300B2Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·4 cites·20 claims
- 0598US11508656B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·8 cites·20 claims
- 0698US11502013B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·4 cites·20 claims
- 0798US10128213B2Integrated fan-out stacked package with fan-out redistribution layer (RDL)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 13, 2018·16 cites·20 claims
- 0897US11798925B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·3 cites·20 claims
- 0997US11682655B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·3 cites·20 claims
- 1097US11515268B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 29, 2022·4 cites·20 claims
- 1197US11424213B2Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 1297US11404316B2System, device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·4 cites·20 claims
- 1397US11201118B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 14, 2021·4 cites·20 claims
- 1497US11158576B2Package structure having redistribution layer structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·4 cites·20 claims
- 1597US10049953B2Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·15 cites·20 claims
- 1697US9917072B2Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·15 cites·20 claims
- 1797US9105530B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 11, 2015·22 cites·20 claims
- 1897US8922005B2Methods and apparatus for package on package devices with reversed stud bump through via interconnectionsHU YEN-CHANG·Filed 2012·Granted Dec 30, 2014·62 cites·18 claims
- 1996US11848319B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
- 2096US11749640B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 2196US11694966B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·20 claims
- 2296US10510713B1Semicondcutor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·12 cites·20 claims
- 2396US9425136B2Conical-shaped or tier-shaped pillar connectionsKUO TIN-HAO·Filed 2012·Granted Aug 23, 2016·24 cites·17 claims
- 2495US12368141B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·19 claims
- 2595US12230513B2Cross-wafer RDLs in constructed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 18, 2025·1 cites·20 claims
- 2695US11682626B2Chamfered die of semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·3 cites·20 claims
- 2795US11004803B2Dummy dies for reducing warpage in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·11 cites·20 claims
- 2895US10658258B1Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 19, 2020·8 cites·20 claims
- 2995US8318596B2Pillar structure having a non-planar surface for semiconductor devicesKUO TIN-HAO·Filed 2010·Granted Nov 27, 2012·24 cites·22 claims
- 3095US8288871B1Reduced-stress bump-on-trace (BOT) structuresSHIEH YUH CHERN·Filed 2011·Granted Oct 16, 2012·53 cites·20 claims
- 3194US12009281B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 3294US11764171B2Integrated circuit structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 3394US10978382B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·8 cites·20 claims
- 3494US10490468B2Semiconductor structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·8 cites·20 claims
- 3594US10269674B2Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 3694US9449941B2Connecting function chips to a package to form package-on-packageTSAI PEI-CHUN·Filed 2011·Granted Sep 20, 2016·44 cites·19 claims
- 3794US9287234B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·10 cites·20 claims
- 3894US8853853B2Bump structuresCHANG CHIH-HORNG·Filed 2011·Granted Oct 7, 2014·24 cites·20 claims
- 3994US8803319B2Pillar structure having a non-planar surface for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·14 cites·20 claims
- 4093US10825696B2Cross-wafer RDLs in constructed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·5 cites·18 claims
- 4193US9646923B2Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted May 9, 2017·12 cites·20 claims
- 4293US9620465B1Dual-sided integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·8 cites·19 claims
- 4393US9105533B2Bump structure having a single side recessTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 11, 2015·9 cites·20 claims
- 4493US8546945B2Pillar structure having a non-planar surface for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Oct 1, 2013·12 cites·19 claims
- 4592US12057405B2Packages with thick RDLs and thin RDLs stacked alternatinglyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·1 cites·20 claims
- 4692US11646255B2Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·2 cites·20 claims
- 4792US11495590B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 4892US11296062B2Three-dimension large system integrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·5 cites·20 claims
- 4992US11205636B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·20 claims
- 5092US11183487B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·9 cites·20 claims
Showing the top 50 of 260 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →