Inventor · disambiguated record
Tighe A. Spurlin
Also filed as: SPURLIN TIGHE · SPURLIN TIGHE A
11 granted patents·10 pending applications·31 citations·filing 2011–2021
86Inventor score
Top patents by PatentIndex Score
21 records- 0192US9865501B2Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layerLAM RES CORP·Filed 2013·Granted Jan 9, 2018·6 cites·19 claims
- 0289US9385035B2Current ramping and current pulsing entry of substrates for electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Jul 5, 2016·10 cites·29 claims
- 0383US9472377B2Method and apparatus for characterizing metal oxide reductionLAM RES CORP·Filed 2015·Granted Oct 18, 2016·4 cites·14 claims
- 0481US10443146B2Monitoring surface oxide on seed layers during electroplatingLAM RES CORP·Filed 2017·Granted Oct 15, 2019·1 cites·14 claims
- 0578US9816196B2Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 14, 2017·1 cites·19 claims
- 0678US9070750B2Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environmentNOVELLUS SYSTEMS INC·Filed 2013·Granted Jun 30, 2015·7 cites·20 claims
- 0777US10711366B2Removal of electroplating bath additivesLAM RES CORP·Filed 2018·Granted Jul 14, 2020·1 cites·11 claims
- 0875US9816193B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceGANESAN KOUSIK·Filed 2011·Granted Nov 14, 2017·1 cites·16 claims
- 0971US11208732B2Monitoring surface oxide on seed layers during electroplatingLAM RES CORP·Filed 2019·Granted Dec 28, 2021·0 cites·8 claims
- 1067US10745817B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceNOVELLUS SYSTEMS INC·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 1165US11280022B2Removal of electroplating bath additivesLAM RES CORP·Filed 2020·Granted Mar 22, 2022·0 cites·10 claims
- 1263US2018030611A1Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2017·Application pending·0 cites
- 1350US2018350670A1Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layerLAM RES CORP·Filed 2017·Application pending·0 cites
- 1447US2023178430A1Electroplating cobalt, nickel, and alloys thereofLAM RES CORP·Filed 2021·Application pending·0 cites
- 1544US2015376792A1Atmospheric plasma apparatus for semiconductor processingLAM RES CORP·Filed 2014·Application pending·0 cites
- 1641US2022102209A1Electrodeposition of cobalt tungsten filmsLAM RES CORP·Filed 2020·Application pending·0 cites
- 1741US2015299886A1Method and apparatus for preparing a substrate with a semi-noble metal layerLAM RES CORP·Filed 2014·Application pending·0 cites
- 1841US2015072538A1Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layerLAM RES CORP·Filed 2013·Application pending·0 cites
- 1939US2014199497A1Methods for reducing metal oxide surfaces to modified metal surfacesSPURLIN TIGHE A·Filed 2013·Application pending·0 cites
- 2039US2013323930A1Selective Capping of Metal Interconnect Lines during Air Gap FormationCHATTOPADHYAY KAUSHIK·Filed 2012·Application pending·0 cites
- 2131US2016111342A1Method and apparatus for characterizing metal oxide reductionLAM RES CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →