Inventor · disambiguated record
Tomihiro Amano
Also filed as: AMANO TOMIHIRO
9 granted patents·4 pending applications·20 citations·filing 2011–2024
84Inventor score
Technology areasH10P
Files withKOKUSAI ELECTRIC CORP8HITACHI INT ELECTRIC INC2ABURATANI YUKINORI1SHIMADA TOSHIYA1YANAI HIDEHIRO1
Top patents by PatentIndex Score
13 records- 0196US11574815B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 7, 2023·7 cites·20 claims
- 0294US11101111B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 24, 2021·3 cites·12 claims
- 0389US10763084B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 1, 2020·4 cites·10 claims
- 0487US12091751B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 17, 2024·1 cites·12 claims
- 0586US12505989B2Substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Granted Dec 23, 2025·0 cites·14 claims
- 0680US9911580B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusYANAI HIDEHIRO·Filed 2011·Granted Mar 6, 2018·5 cites·17 claims
- 0775US11948778B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 2, 2024·0 cites·13 claims
- 0870US11942333B2Method of manufacturing semiconductor device, cleaning method, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Mar 26, 2024·0 cites·20 claims
- 0957US2024087937A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1055US2024047233A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1143US2014235068A1Method of manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 1240US9082797B2Substrate processing apparatus and method of manufacturing semiconductor deviceABURATANI YUKINORI·Filed 2012·Granted Jul 14, 2015·0 cites·12 claims
- 1338US2012329290A1Substrate Placement Stage, Substrate Processing Apparatus and Method of Manufacturing Semiconductor DeviceSHIMADA TOSHIYA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →