Inventor · disambiguated record
Todd James Brill
Also filed as: BRILL TODD · BRILL TODD J · BRILL TODD JAMES
6 granted patents·4 pending applications·75 citations·filing 2005–2025
83Inventor score
Top patents by PatentIndex Score
10 records- 0192US7413069B2Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facilityAPPLIED MATERIALS INC·Filed 2005·Granted Aug 19, 2008·23 cites·24 claims
- 0290US12215966B2Methods and systems of optical inspection of electronic device manufacturing machinesAPPLIED MATERIALS INC·Filed 2020·Granted Feb 4, 2025·2 cites·14 claims
- 0390US7274971B2Methods and apparatus for electronic device manufacturing system monitoring and controlAPPLIED MATERIALS INC·Filed 2005·Granted Sep 25, 2007·35 cites·25 claims
- 0486US7434676B2Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facilityAPPLIED MATERIALS INC·Filed 2007·Granted Oct 14, 2008·10 cites·11 claims
- 0581US11813757B2Centerfinding for a process kit or process kit carrier at a manufacturing systemAPPLIED MATERIALS INC·Filed 2020·Granted Nov 14, 2023·1 cites·20 claims
- 0676US8024065B2Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facilityAPPLIED MATERIALS INC·Filed 2008·Granted Sep 20, 2011·4 cites·20 claims
- 0769US2024051144A1Centerfinding for a process kit or process kit carrier at a manufacturing systemAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0865US2025155234A1Methods and systems of optical inspection of electronic device manufacturing machinesAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0953US2025259869A1Automatic blind hand-off to center wafer referring to heater pocketAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1048US2007288115A1Methods and apparatus for electronic device manufacturing system monitoring and controlBRILL TODD J·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →