Inventor · disambiguated record
Tong-Yu Chen
Also filed as: CHEN TONG · CHEN TONG-YU
58 granted patents·12 pending applications·964 citations·filing 1996–2022
99Inventor score
Files withUNITED MICROELECTRONICS CORP31TELEDYNE TECH INC8WANG CHIH-JUNG5CHEN TONG-YU4Qingdao haier refrigerator co ltd2
Top patents by PatentIndex Score
70 records- 0193US6828663B2Method of packaging a device with a lead frame, and an apparatus formed therefromTELEDYNE TECH INC·Filed 2001·Granted Dec 7, 2004·126 cites·22 claims
- 0293US5798427AEthylene polymers having enhanced processabilityUNION CARBIDE CHEM PLASTIC·Filed 1996·Granted Aug 25, 1998·110 cites·18 claims
- 0392US6159617AEthylene polymers having superior clarity enhanced toughness, low extractables, and processing easeUNIVATION TECH LLC·Filed 1998·Granted Dec 12, 2000·82 cites·18 claims
- 0491US8426283B1Method of fabricating a double-gate transistor and a tri-gate transistor on a common substrateWANG CHIH-JUNG·Filed 2011·Granted Apr 23, 2013·16 cites·15 claims
- 0590US8339584B2Velocity measuring systemCHRISTIAN WILLIAM R·Filed 2010·Granted Dec 25, 2012·13 cites·22 claims
- 0688US6426298B1Method of patterning a dual damasceneUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 30, 2002·52 cites·12 claims
- 0787US6559004B1Method for forming three dimensional semiconductor structure and three dimensional capacitorUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 6, 2003·51 cites·15 claims
- 0886US9048285B2Semiconductor structure and method of forming a harmonic-effect-suppression structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 2, 2015·6 cites·8 claims
- 0986US6507110B1Microwave device and method for making sameTELEDYNE TECH INC·Filed 2000·Granted Jan 14, 2003·29 cites·24 claims
- 1086US6184142B1Process for low k organic dielectric film etchUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 6, 2001·81 cites·18 claims
- 1184US6638871B2Method for forming openings in low dielectric constant material layerUNITED MICROLECTRONICS CORP·Filed 2002·Granted Oct 28, 2003·44 cites·20 claims
- 1283US9012975B2Field effect transistor and manufacturing method thereofCHEN TONG-YU·Filed 2012·Granted Apr 21, 2015·5 cites·10 claims
- 1383US8871575B2Method of fabricating field effect transistor with fin structureWANG CHIH-JUNG·Filed 2011·Granted Oct 28, 2014·6 cites·12 claims
- 1483US8698199B2FinFET structureCHEN TONG-YU·Filed 2012·Granted Apr 15, 2014·7 cites·10 claims
- 1581US9006107B2Patterned structure of semiconductor device and fabricating method thereofWANG CHIH-JUNG·Filed 2012·Granted Apr 14, 2015·4 cites·11 claims
- 1681US8804103B2Velocity measuring systemTELEDYNE TECH INC·Filed 2012·Granted Aug 12, 2014·6 cites·6 claims
- 1779US10847412B2Interconnect structure, interconnect layout structure, and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 24, 2020·2 cites·4 claims
- 1879US10658232B2Interconnect structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·2 cites·12 claims
- 1979US7319074B2Method of defining polysilicon patternsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jan 15, 2008·6 cites·17 claims
- 2078US9871123B2Field effect transistor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 16, 2018·2 cites·10 claims
- 2178US6750129B2Process for forming fusible linksINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 15, 2004·27 cites·27 claims
- 2276US8946078B2Method of forming trench in semiconductor substrateCHEN TONG-YU·Filed 2012·Granted Feb 3, 2015·3 cites·12 claims
- 2370US8158405B2Process for concentrating and processing fluid samplesBOYETTE SCOTT·Filed 2008·Granted Apr 17, 2012·1 cites·18 claims
- 2470US6285254B1System and method for linearizing vacuum electronic amplificationTELEDYNE TECH INC·Filed 2000·Granted Sep 4, 2001·15 cites·24 claims
- 2569US6972259B2Method for forming openings in low dielectric constant material layerUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 6, 2005·9 cites·14 claims
- 2668US10900392B2Inverted non-stop lifeboat diesel engine lubrication system and flow configuration method thereofUNIV JIANGSU SCIENCE & TECH·Filed 2017·Granted Jan 26, 2021·1 cites·9 claims
- 2768US6221772B1Method of cleaning the polymer from within holes on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 24, 2001·34 cites·6 claims
- 2867US10851684B2Inverted non-stop apparatus of multi-cylinder diesel engine for free-fall lifeboatUNIV JIANGSU SCIENCE & TECH·Filed 2017·Granted Dec 1, 2020·1 cites·9 claims
- 2966US8743351B2Velocity measuring systemTELEDYNE TECH INC·Filed 2012·Granted Jun 3, 2014·2 cites·3 claims
- 3065US8803247B2Fin-type field effect transistorWANG CHIH-JUNG·Filed 2011·Granted Aug 12, 2014·2 cites·7 claims
- 3165US6528428B1Method of forming dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Mar 4, 2003·13 cites·19 claims
- 3263US6590450B2System and method for linearizing vacuum electronic amplificationTELEDYNE TECH INC·Filed 2001·Granted Jul 8, 2003·10 cites·25 claims
- 3363US6379574B1Integrated post-etch treatment for a dielectric etch processAPPLIED MATERIALS INC·Filed 1999·Granted Apr 30, 2002·31 cites·24 claims
- 3462US2025137709A1Aging device and refrigerating and freezing apparatusQingdao haier refrigerator co ltd·Filed 2022·Application pending·0 cites
- 3559US8946031B2Method for fabricating MOS deviceWANG CHIH-JUNG·Filed 2012·Granted Feb 3, 2015·1 cites·8 claims
- 3659US6352938B2Method of removing photoresist and reducing native oxide in dual damascene copper processUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 5, 2002·25 cites·30 claims
- 3758US9214384B2Method of forming trench in semiconductor substrateUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 15, 2015·0 cites·13 claims
- 3857US9709594B1Velocity measuring systemTELEDYNE TECH INCORPORATED·Filed 2014·Granted Jul 18, 2017·1 cites·2 claims
- 3957US6083845AEtching methodUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 4, 2000·20 cites·16 claims
- 4056US6010968AMethod for forming a contact opening with multilevel etchingUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 4, 2000·21 cites·15 claims
- 4155US6218084B1Method for removing photoresist layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 17, 2001·17 cites·10 claims
- 4254US6307174B1Method for high-density plasma etchingUNITED MICROELECTRONICS CORP·Filed 2000·Granted Oct 23, 2001·5 cites·15 claims
- 4352US10276429B2Interconnect structure, interconnect layout structure, and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Apr 30, 2019·0 cites·9 claims
- 4452US6281316B1Enhanced crosslinking terpolymerUNION CARBIDE CHEM PLASTIC·Filed 1999·Granted Aug 28, 2001·10 cites·11 claims
- 4550US9378998B2Semiconductor structure and method of forming a harmonic-effect-suppression structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·0 cites·18 claims
- 4650US6933603B2Multi-substrate layer semiconductor packages and method for making sameTELEDYNE TECH INC·Filed 2002·Granted Aug 23, 2005·4 cites·24 claims
- 4750US2014374841A1Field effect transistor with fin structureUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4850US2017295816A13d food printerKUNSHAN PORIMY 3D PRINTING TECH CO LTD·Filed 2016·Application pending·0 cites
- 4948US6139702ASeasoning process for etcherUNITED MICROELECTRONICS CORP·Filed 1999·Granted Oct 31, 2000·13 cites·11 claims
- 5047US6806182B2Method for eliminating via resistance shift in organic ILDIBM·Filed 2002·Granted Oct 19, 2004·2 cites·9 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →